Journal ArticleDOI
Moisture absorption and diffusion characterisation of packaging materials––advanced treatment
Ee Hua Wong,Ranjan Rajoo +1 more
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TLDR
A new insight into the causes and physics of non-Fickian adsorption in polymeric packaging materials is presented along with a technique to alleviate the associated characterisation challenge.About:
This article is published in Microelectronics Reliability.The article was published on 2003-12-01. It has received 87 citations till now.read more
Citations
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Investigation of moisture diffusion in epoxy system: Experiments and molecular dynamics simulations
TL;DR: In this article, the authors investigated the moisture diffusion characterizations, which include weight changes, diffusion coefficients and activation energy, and showed that the desorption process from highly moisture-saturation tended to leave a small residual moisture content, which could only be removed by heating at relative high temperature.
Journal ArticleDOI
Effects of hygrothermal aging on epoxy-based anisotropic conductive film
TL;DR: In this paper, the effects of aging on the adhesion strengths were measured by shear mode tests and the changes of molecular conformation were analyzed by Fourier Transform Infrared Spectroscopy (FTIR).
Journal ArticleDOI
Moisture Absorption and Diffusion Characterization of Molding Compound
Xu Chen,Shufeng Zhao,Linda Zhai +2 more
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Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
TL;DR: The dual stage model developed in this paper provides a mathematical formulation for modeling anomalous moisture diffusion behavior using commercial finite element analysis software and generates reasonable results for the diffusive properties and display outstanding experimental fits.
Journal ArticleDOI
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
TL;DR: In this paper, an advanced thermal-moisture analogy scheme is proposed to cope with the inherent limitations of the existing analogy schemes, which is based on the experimentally observed unique hygroscopic behavior of polymeric materials used in microelectronics; the saturated concentration is only a function of relative humidity regardless of temperature.
References
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Book
The mathematics of diffusion
TL;DR: Though it incorporates much new material, this new edition preserves the general character of the book in providing a collection of solutions of the equations of diffusion and describing how these solutions may be obtained.
Journal ArticleDOI
Moisture diffusion in epoxy systems
TL;DR: In this article, the epoxy-amine stoichiometry and the resulting microstructure of an epoxy system is studied as a function of epoxy amine stochastic properties and the relative importance of diffusion through the low-density and high-density microstructural phases.
Book
International Encyclopedia of Composites
TL;DR: The International Encyclopedia of Composites as discussed by the authors is the first reference of its kind to cover all phases of composites for those seeking indepth engineering information, which combines the scholarship and practical knowledge of over 300 distinguished industry experts, academicians, and government researchers.
Journal ArticleDOI
Contributions of the nanovoid structure to the moisture absorption properties of epoxy resins
Christopher L. Soles,Fernando T. Chang,B. A. Bolan,H. A. Hristov,David W. Gidley,Albert F. Yee +5 more
TL;DR: In this article, the effects of molecular topology are elucidated by synthesizing novel epoxies where the polarity is maintained constant but the topology is systematically altered, quantified in part via Positron Annihilation Lifetime Spectroscopy in terms of the nanometer-sized voids, or nanovoids, that are also commensurate with typical interchain distances.
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Moisture absorption and desorption predictions for plastic ball grid array packages
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