Journal ArticleDOI
Optimum thermal performance of microchannel heat sink by adjusting channel width and height
TLDR
In this paper, a three-dimensional numerical model of the microchannel heat sink is presented to study the effects of heat transfer characteristics due to various channel heights and widths, based on the theory of a fully developed flow.About:
This article is published in International Communications in Heat and Mass Transfer.The article was published on 2008-05-01. It has received 87 citations till now. The article focuses on the topics: Microchannel & Thermal resistance.read more
Citations
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Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review
TL;DR: In this article, the advantages and shortcomings of thermal enhancement technologies in different structural micro heat sinks are presented, and the barriers and challenges for the developments of thermal management of electronic devices by micro heat sink are discussed, and future directions of the research topic are provided.
Journal ArticleDOI
Heat transfer enhancement in microchannel heat sink by wavy channel with changing wavelength/amplitude
TL;DR: In this article, an improved design of wavy microchannel heat sink with changing wavelength or/and amplitude along the flow direction is proposed, and the thermal resistance R and the maximum bottom wall temperature difference Δ T b,max for the new design are compared with those for the straight and the original wavy design under a constant pumping power.
Journal ArticleDOI
Thermal and hydrodynamic analysis of microchannel heat sinks: A review
TL;DR: A comprehensive review of available studies regarding non-circular microchannel heat sinks, with emphasis on rectangular microchannels, was presented and analyzed in this paper, where the methodologies used to analyze and optimize the overall performance of microchannel systems along with channel geometries, flow conditions, the coolants used, structural materials, optimization tools and finally, the form in which the final outcome of each study was presented.
Journal ArticleDOI
Convective performance of CuO/water nanofluid in an electronic heat sink
P. Selvakumar,S. Suresh +1 more
TL;DR: In this paper, a thin channelled copper water block of overall dimension 55 × 55 × 19 mm is used for the study. And the interface temperature of the water block is measured and a maximum reduction of 1.15°C is observed when nanofluid of 0.2% volume fraction is used as the working fluid compared to deionised water.
Journal ArticleDOI
Analysis of heat transfer characteristics of double-layered microchannel heat sink
TL;DR: In this paper, a double-layered micro-channel heat sink was investigated and the effects of substrate materials, coolants, and geometric parameters such as channel number, channel width ratio, channel aspect ratio, substrate thickness, and pumping power on the temperature distribution, pressure drop, and thermal resistance were discussed.
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink
Weilin Qu,Issam Mudawar +1 more
TL;DR: In this paper, the authors investigated the pressure drop and heat transfer characteristics of a single-phase micro-channel heat sink, which consisted of an array of rectangular micro-channels 231 lm wide and 713 lm deep.
Journal ArticleDOI
Heat sink optimization with application to microchannels
TL;DR: In this article, the equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow.
Journal ArticleDOI
Thermally Developing Flow and Heat Transfer in Rectangular Microchannels of Different Aspect Ratios
Poh Seng Lee,Suresh V. Garimella +1 more
TL;DR: In this paper, three-dimensional numerical simulations were performed for laminar thermally developing flow in microchannels of different aspect ratios, based on the temperature and heat flux distributions obtained, both the local and average Nusselt numbers were presented graphically as a function of the dimensionless axial distance and channel aspect ratio.
Journal ArticleDOI
Analysis of three-dimensional heat transfer in micro-channel heat sinks
Weilin Qu,Issam Mudawar +1 more
TL;DR: In this article, the authors analyzed the three-dimensional fluid flow and heat transfer in a rectangular micro-channel heat sink using water as the cooling fluid and developed a numerical code based on the finite difference method and the SIMPLE algorithm to solve the governing equations.
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