Journal ArticleDOI
Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes
Zhou Hai,Jiawei Zhang,Chaobo Shen,John L. Evans,Michael J. Bozack,Munshi Basit,Jeffrey C. Suhling +6 more
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TLDR
In this article, the effect of isothermal aging on the reliability of Sn-Ag-Cu (SAC) assemblies on three different surface finish [immersion Ag (ImAg), electroless Ni/immersion Au (ENIG), and electroless N/electroless Pd/imersion Au(ENEPIG)].Abstract:
Pb-free solder joints exposed to elevated isothermal temperatures for prolonged periods of time undergo microstructural and mechanical evolution, which degrades the joint electrical performance. We report the effect of isothermal aging on the reliability of Sn–Ag–Cu (SAC) assemblies on three different surface finishes [immersion Ag (ImAg), electroless Ni/immersion Au (ENIG), and electroless Ni/electroless Pd/immersion Au (ENEPIG)]. The characteristic life for SAC alloys in 10- and 15-mm ball grid array packages on ImAg degraded over 40% after an 85 °C/12 months aging and over 50% during a 125 °C/12 months aging. ENIG and ENEPIG outperformed ImAg for all aging treatments. For passive components (2512 resistors) on ImAg, the reliability performance degraded 16.7%/28.1% after a 1-year aging at 85 °C/125 °C. Failure analysis showed dramatic intermetallic binary Cu–Sn and ternary Ni–Cu–Sn film growth at the bottom of the solder joint interfaces for ImAg and ENIG/ENEPIG. For 125 °C-aged samples, the cracks appeared at the corners of both package and board sides of the solder ball and propagated along (near) the intermetallic compound location. For the case of aged fine-pitch packages, the failures tended to start at the component side solder ball corner and then propagate along an angled path downward into the bulk solder.read more
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Proceedings ArticleDOI
Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions
Munshi Basit,Mohammad Motalab,Jeffrey C. Suhling,Zhou Hai,John L. Evans,Michael J. Bozack,Pradeep Lall +6 more
TL;DR: In this paper, the effects of aging on lead free solder material behavior were explored and new reliability prediction procedures were developed to predict the reliability of solder joints in assembly subjected to aging prior to field use.
Proceedings ArticleDOI
Cyclic Stress-Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range
TL;DR: In this paper, the effects of prior aging conditions, strain range, strain rate, and testing temperature on the cyclic stress-strain behavior of SAC305 lead free solder were examined.
Proceedings ArticleDOI
High temperature creep response of lead free solders
TL;DR: In this article, the authors have characterized the high temperature creep behavior of SAC405 (95.5Sn4.0Ag0.5Cu) lead free solder, which is the most creep resistant of the standard SACN05 alloys.
Proceedings ArticleDOI
Mechanical characterization of doped SAC solder materials at high temperature
TL;DR: In this paper, stress-strain curves have been measured for several doped Sn-Ag-Cu (SAC) solder materials at high temperatures up to 200 °C, and their performances have been compared to those for standard SAC alloys.
Proceedings ArticleDOI
Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse Imagery
TL;DR: In this paper, the aging induced changes in number of intermetallic compounds, total area of all IMCs, average particle area, and average particle diameter have been quantified for several fixed regions in the solder joints.
References
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Journal ArticleDOI
Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages
Jiawei Zhang,Zhou Hai,Sivasubramanian Thirugnanasambandam,John L. Evans,Michael J. Bozack,Yifei Zhang,Jeffrey C. Suhling +6 more
TL;DR: In this article, the performance of fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105), Sn-3.0Pb, and Sn-37Pb solder ball interconnects was investigated.
Journal ArticleDOI
Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings
Toni T. Mattila,Jorma Kivilahti +1 more
TL;DR: In this paper, lead-free test assemblies were thermally cycled (−45°C/+125°C, 15min. dwell time, 750 cycles) or isothermally annealed (125°c, 500 h) before the standard drop test, and the average number of drops to failure increased when the thermal cycling was performed before the drop test (1,500 G deceleration, 0.5 ms half sine pulse).
Journal ArticleDOI
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability
TL;DR: In this paper, the reliability of lead-free Sn-3.0Ag-0.5Cu (SAC) soldered fine-pitch ball grid array assemblies were investigated after being subjected to a combination of thermal cycling followed by board level drop tests.
Proceedings ArticleDOI
Correlation of reliability models including aging effects with thermal cycling reliability data
Mohammad Motalab,Muhannad Mustafa,Jeffrey C. Suhling,Jiawei Zhang,John L. Evans,Michael J. Bozack,Pradeep Lall +6 more
TL;DR: In this article, a new finite element based prediction procedure was developed that utilizes constitutive relations and failure criteria that incorporate aging effects, and then validated the new approach through correlation with thermal cycling accelerated life testing experimental data.
Journal ArticleDOI
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects
TL;DR: In this paper, the interaction between isothermal aging and the long-term reliability of fine-pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt.%) solder ball interconnects was investigated.
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