Journal ArticleDOI
Structure and crystal growth of atmospheric and low-pressure chemical-vapor-deposited silicon films
TLDR
In this paper, the structure and crystal growth of undoped, asdeposited, and annealed silicon films prepared by chemical vapor deposition (CVD) and low-pressure chemical vapor injection (LPCVD) of silane have been studied with use of x-ray diffraction, Raman spectroscopy, and scanning electron microscopy (SEM).Abstract:
Structure and crystal growth of undoped, as‐deposited, and annealed silicon films prepared by chemical vapor deposition (CVD) and low‐pressure chemical vapor deposition (LPCVD) of silane have been studied with use of x‐ray diffraction, Raman spectroscopy, and scanning electron microscopy (SEM). The grain size and a complete texture analysis are performed on CVD films grown at atmospheric pressure and temperature range 600≤Td≤805 °C, LPCVD films grown in the pressure range 0.1≤Pd≤2 Torr and temperature range 500≤Td≤650 °C and annealed amorphous CVD and LPCVD films near Ta=600 °C. We obtain systematically amorphous, strong 〈220〉 polycrystalline, and inhomogeneous partially crystallized films 〈111〉 or 〈311〉 oriented depending on the deposition conditions. The presence of a given texture is explained by a model which takes into account the specific free surface energies of the starting equilibrium forms and the extinction of some crystalline planes by {111} slow growing facets. The appearance of the 〈220〉 tex...read more
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Surface kinetics and subplantation phenomena affecting the texture, morphology, stress, and growth evolution of titanium nitride films
TL;DR: In this paper, a thorough study of the microstructure, texture, intrinsic stress, surface and interface morphology of transition metal nitride (mainly TiN but also CrN) films grown on Si by reactive sputter deposition is presented, with emphasis to the mechanisms of adatom migration on the surface and subplantation of energetic species.
Journal ArticleDOI
Structural properties of polycrystalline silicon films prepared at low temperature by plasma chemical vapor deposition
TL;DR: In this paper, the authors investigated the evolution with thickness of the structure of polycrystalline silicon (poly-Si) films prepared at 300 °C by plasma decomposition of SiF4/SiH4/H2 source gases.
Journal ArticleDOI
Structural studies of low‐temperature low‐pressure chemical deposited polycrystalline silicon
TL;DR: In this paper, structural studies were performed on Si films formed by chemical vapor deposition on SiO2 films using silane under pressures below 150 mTorr and temperatures below 640 °C.
Journal ArticleDOI
Device application and structure observation for hemispherical‐grained Si
TL;DR: In this article, a polycrystalline-silicon surface with hemispherical grains (HSG) is deposited by low-pressure chemical vapor deposition at 590 °C and the surface area of the HSG-Si film is about twice as large as Si films deposited at other temperatures.
Journal ArticleDOI
The effects of dopants on surface‐energy‐driven secondary grain growth in silicon films
Hojong Kim,Carl V. Thompson +1 more
TL;DR: In this article, the effects of phosphorus, arsenic, and boron on surface energy-driven secondary grain growth (SEDSGG) in thin polycrystalline silicon films have been investigated.
References
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Book
Elements of X-ray diffraction
TL;DR: In this article, the authors present a chemical analysis of X-ray diffraction by Xray Spectrometry and phase-diagram Determination of single crystal structures and phase diagrams.