Journal ArticleDOI
Synthesis and characterization of novel Cu, Cu-SiC functionally graded coating by pulse reverse electrodeposition
TLDR
In this paper, a Cu based functionally graded coating (FGC) has been deposited on an annealed Cu substrate by galvanostatic pulse reverse electrodeposition (PRED) route.About:
This article is published in Applied Surface Science.The article was published on 2019-02-15. It has received 20 citations till now. The article focuses on the topics: Coating.read more
Citations
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Journal ArticleDOI
Copper and copper nanoparticles toxicity and their impact on basic functions in the body.
TL;DR: This paper is focused on the description, literature survey and discussion of the current knowledge about copper and copper nanoparticles toxicity and their involvement in various pathological processes.
Journal ArticleDOI
Fabrication and characterization of novel layered materials produced by electroless plating and hot pressing
TL;DR: In this paper, two types of three-layer functional graded materials (FGMs) were produced by hot pressing method by electroless silver coated copper powders with flake-like morphology.
Pulse reversal plating of copper for electronics applications
TL;DR: In this paper, the copper electroplating process is discussed based on demands for modern printed circuit board (pcb) manufacturing, and an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.
Journal ArticleDOI
Cu, Cu-SiC functionally graded coating for protection against corrosion and wear
TL;DR: In this article, the performance of the copper based functionally graded coatings (FGCs) when subjected to corrosion in the 3.5wt% NaCl aqueous solution and sliding wear under the different loads (2, 5, 8 and 10) was presented.
Journal ArticleDOI
Development and investigation of Cu/SiC nano-composite coatings via various parameters of DC electrodeposition
TL;DR: In this article, the effect of various electrodeposition parameters such as, additive saccharin concentration, pH, mechanically stirring speed, temperature, and current density on the microhardness was investigated.
References
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Journal ArticleDOI
Ultrahigh strength and high electrical conductivity in copper
TL;DR: Pure copper samples with a high density of nanoscale growth twins are synthesized and show a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper.
BookDOI
Electrical contacts : principles and applications
TL;DR: In this paper, the authors discuss the effect of dust contamination on the performance of electrical contact devices and propose a method to prevent contact failure due to the presence of dust in the contact surfaces.
Journal ArticleDOI
Electrodeposition of composite coatings containing nanoparticles in a metal deposit
TL;DR: In this article, the incorporation rates of the dispersed particles have been achieved using high nanoparticle concentration in the electrolyte solution, smaller sized nanoparticles; a low concentration of electroactive species, ultrasonication during deposition and pulsed current techniques.
Journal ArticleDOI
Pulse and pulse reverse plating—Conceptual,advantages and applications
TL;DR: A review on pulse and pulse reverse techniques for electrodeposition has been attempted as mentioned in this paper, where the effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and morphology are presented.
Journal ArticleDOI
Strength, strain-rate sensitivity and ductility of copper with nanoscale twins
TL;DR: In this article, the deformation of ultrafine crystalline pure Cu with nanoscale growth twins is analyzed using the twin boundary as an internal interface and allowing special slip geometry arrangements that involve soft and hard modes of deformation.