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Journal ArticleDOI

Thin-film lateral bipolar transistor in silicon-on-sapphire structure

R. Zuleeg, +1 more
- 01 Apr 1967 - 
- Vol. 3, Iss: 4, pp 137-139
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TLDR
In this article, the authors used a heteroepitaxial films of silicon-on-sapphire to fabricate lateral bipolar n-p-n transistors with a common base direct-current amplification factor of 0.9 and a maximum frequency of oscillation of 2.4 GHz.
Abstract
Heteroepitaxial films of silicon-on-sapphire were used to fabricate lateral bipolar n-p-n transistors. The devices have a common-base direct-current amplification factor of 0.9 and a maximum frequency of oscillation of 2.4 GHz. As a result of the vertical p-n-junction arrangement, small junction areas are possible, e.g. 1×10−6cm2, which yield depletion-layer capacitances of 0.02–0.05 pF.

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Citations
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Journal ArticleDOI

Single-crystal films of silicon on insulators

TL;DR: A good deal of research has been devoted to silicon films on single-crystal sapphire substrates as mentioned in this paper, with particular attention paid to the orientation relationship between the silicon and the substrate.
Journal ArticleDOI

Fully isolated lateral bipolar—MOS transistors fabricated in zone-melting-recrystallized Si films on SiO 2

TL;DR: In this article, a four-terminal device that can be operated either as a lateral n-p-n bipolar transistor or as a conventional n-channel MOSFET has been fabricated in silicon-on-insulator films prepared by graphitestrip-heater zonemelting recrystallization.
Journal ArticleDOI

Silicon films on sapphire

TL;DR: The physical properties of silicon on sapphire (SOS) thin films and their impact on the operation of integrated devices are systematically reviewed in this paper, with emphasis on autodoping, stress, lattice defects and interface behaviour.
Patent

Simultaneous fabrication of CMOS transistors and bipolar devices

TL;DR: In this article, a process for the simultaneous fabrication of CMOS transistors and bipolar devices on the same integrated circuit is described, which follows the standard Silicon-Gate Deep Depletion technology up through gate definition.
Journal ArticleDOI

Thin-film silicon: Preparation, properties, and device applications

TL;DR: In this article, the properties of thin silicon films deposited on sapphire (SOS) and magnesium aluminate spinel by pyrolysis of silane in the temperature range 900-1200°C were reviewed.
References
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Journal ArticleDOI

Lateral complementary transistor structure for the simultaneous fabrication of functional blocks

TL;DR: In this paper, an isolated p-n-p transistor structure fabricated by the same technique used for the conventional all n-p-n transistor functional block without any additional processing steps is described.
Journal ArticleDOI

The Characteristic Frequencies of a Drift Transistor

TL;DR: In this paper, the authors used the theory of the simple one-dimensional model to find the frequency variation of the current gain of a drift transistor, and used this to find how junction capacitances and base resistance affect the measurement of the characteristic frequencies.
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