Wall superheat excursions in the boiling incipience of dielectric fluids.

TLDR: In this article, a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions is presented. But the authors do not consider the effect of temperature variations on the nucleation of microelectronic components.

Abstract: Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.