Amorphous silica film, silicon wafer, binding
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Amorphous silica films can be formed using various methods such as chemical vapor deposition (CVD) and plasma enhanced CVD . These films can be used to replace expensive silicon wafers in the manufacturing of silica nanowires . The formation of amorphous silicon films involves the deposition of a seed layer on a substrate using aminosilane-based gas, followed by the deposition of an amorphous silicon film using silane-based gas . The adhesion of silica surfaces, covered with adsorbates of oxygen, hydrogen, or water molecules, can lead to the formation of covalent bonds, which is important for hydrophilic silicon wafer bonding . Overall, the formation of amorphous silica films and the use of silicon wafers play a crucial role in various manufacturing processes, such as the production of silica nanowires and the bonding of silica surfaces.
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Patent 13 Mar 2015 27 Citations | The provided paper is about the formation of an amorphous silicon film. There is no mention of amorphous silica film, silicon wafer, or binding in the paper. |
| The provided paper is about an amorphous silicon forming composition. It does not mention anything about amorphous silica film, silicon wafer, or binding. | |
| The provided paper is about a film forming method of amorphous silicon. There is no information about amorphous silica film or binding of silicon wafer in the paper. | |
| The provided paper is about molecular dynamics simulations of silica wafer bonding. It does not specifically mention amorphous silica film or silicon wafer binding. |
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