How manufacturing IGZO Thin Film?5 answersManufacturing Indium Gallium Zinc Oxide (IGZO) thin films involves various techniques such as radio-frequency magnetron sputtering, pulsed laser deposition, and solution processing. For instance, radio-frequency magnetron sputtering is used to deposit both the IGZO channel and tunneling barrier layer, enabling rapid saturation at lower drain bias in thin-film transistors. Pulsed laser deposition allows for the control of oxygen vacancies in IGZO films, affecting threshold voltage and persistent photoconductivity in TFTs. Additionally, solution-processed IGZO thin films can be achieved through UV treatment, leading to dense semiconductor films suitable for flexible electronics fabrication. By optimizing the manufacturing process, IGZO thin films can exhibit tailored properties such as carrier concentration adjustment and good diode characteristics. These diverse methods offer flexibility in producing IGZO thin films for various applications, including optoelectronic devices and artificial neural networks.
When is a low Z surface film bad for divertor ir thermography?5 answersA low-Z surface film can pose challenges for divertor IR thermography when it comes to accurately measuring incident heat flux. Low-Z films, such as those composed of lithium, boron, beryllium, or carbon, are applied to divertor surfaces in tokamaks to enhance plasma performance. These films experience erosion during plasma bombardment, with rates influenced by factors like ion flux, surface temperature, electron temperature, and density. In environments like Alcator C-Mod and ITER, where low-emissivity metal targets and closed divertor geometries are present, the presence of low-Z surface films can affect the accuracy of heat flux measurements using IR thermography. The need to understand the evolution of these films under specific plasma conditions is crucial for effective divertor operation and diagnostics.
What heat treatment is suitable for additivelly manufactured Inconel 939?4 answersThe suitable heat treatment for additively manufactured Inconel 939 is a high-temperature solution and aging heat treatment. This heat treatment process dissolves the dendritic microstructure and precipitates semi-coherent γ’ (Ni3(Al,Ti)) precipitates, resulting in enhanced yield strength. Omitting the high-temperature solution treatment step can lead to the growth of the deleterious η phase upon aging, which results in embrittlement. High-temperature heat treatment (>1100 °C) of additively manufactured Inconel 939 samples results in recrystallized, equiaxed grains containing fcc {111} annealing twins and second phase particles, independent of the additive manufacturing process used. For Inconel 718, a solutionizing recrystallization (RC) heat treatment is suitable to improve yield strength and decrease deformation anisotropy. Additionally, a high-temperature heat treatment at 1065°C can be used to enhance the microstructure, reduce residual stress, and increase hardness in Inconel 718 fabricated through laser powder bed fusion (L-PBF).
Why negative shift after n2o treatment igzo?5 answersN<sub>2</sub>O plasma treatment of amorphous InGaZnO (a-IGZO) thin-film transistors (TFTs) leads to a negative shift in threshold voltage (V<sub>th</sub>). This negative shift is caused by leakage-current paths generated by the breakage of metal-oxygen bonds and the formation of weak bonds, such as -OH bonds, due to plasma damage and bias temperature stress. The supply of N<sub>2</sub>O plasma during the postprocesses after plasma treatment helps to maintain the electrical performance and reliability of the a-IGZO TFTs under bias stress. Additionally, controlling oxygen vacancies (Vo) in the IGZO semiconductor channel is crucial for reliable and long-term operation. Surplus interfacial charges inside the IGZO channel cause negative shifts in V<sub>th</sub>, resulting in depletion-mode operation and high current output. X-ray irradiation increases the electron concentration of the a-IGZO TFT active layer, leading to a negative V<sub>th</sub> shift. The O<sub>2</sub> flow rate during the sputtered deposition of the channel layer affects the NGBS-induced V<sub>th</sub> instability of a-IGZO TFTs. In-situ hydrogen plasma treatment improves the gate bias stability and performance of a-IGZO TFTs by suppressing gate bias instability caused by ionized oxygen vacancy defects.
How does sputtering power effect the mobility of igzo?5 answersThe sputtering power has a significant effect on the mobility of IGZO (indium gallium zinc oxide) transistors. Higher sputtering powers result in large improvements in the saturation mobility and subthreshold swing of the devices. For example, devices fabricated at a power of 400W showed a saturation mobility of 13.80 cm2/V·s, compared to 2.70 cm2/V·s for devices fabricated at 50W. The improvements in electrical performance were attributed to the formation of a denser film and reduced trap densities at the dielectric/channel interface due to the more energetic bombardment under high power sputtering conditions. Therefore, increasing the sputtering power can enhance the mobility of IGZO transistors.
What is critical temperature in heat treatment?10 answers