Showing papers on "Copper plating published in 1969"
TL;DR: In this paper, the anodic oxidation of copper in hydroxide solutions has been reexamined with the rotating ring and split-ring disk techniques, and a soluble Cu(III) species has also been generated at gold rings from disk-produced Cu(II).
Abstract: The anodic oxidation of copper in hydroxide solutions has been reexamined with the rotating ring and split‐ring disk techniques. A soluble Cu(III) species has been identified in the anodic region at the onset of oxygen evolution. This species has also been generated at gold rings from disk‐produced Cu(II). Passivation processes in the copper (I) and (II) oxidation regions have been analyzed by means of the corresponding ring currents.
183 citations
Patent•
19 May 1969
TL;DR: In this article, a displacement copper deposit is formed on the zinc surface by treatment with an immersion copper plating bath and, thereafter, the thus-plated surface is electroplated with copper from an acid copper electroplating bath.
Abstract: A process for the acid copper plating of zinc, particularly complex zinc parts having recessed areas, wherein a displacement copper deposit is formed on the zinc surface by treatment with an immersion copper plating bath and, thereafter, the thus-plated surface is electroplated with copper from an acid copper electroplating bath.
33 citations
TL;DR: In this paper, a polystyrene substrate material was selected as a suitable substrate material for investigating chemical adhesion to electroless copper plating and the choice of surface geometry was discussed.
Abstract: SummaryPolystyrene is selected as a suitable substrate material for investigating chemical adhesion to electroless copper plating. The choice of surface geometry is discussed. Peel adhesion results are shown for natural, carboxylic and nitro-derived surfaces. Finally it is shown that there exists a difference in the ability of surface groups to provide chemical interaction with the copper plating.
27 citations
Patent•
22 Jan 1969TL;DR: In this article, a method of electrolessly plating a thermoplastic substrate with a metal, such as copper, nickel or cobalt, prior to application of an electrolytically deposited metal was proposed.
Abstract: A method of electrolessly plating a thermoplastic substrate with a metal, such as copper, nickel or cobalt, prior to application of an electrolytically deposited metal A novel surface treatment step which includes an improved neutralizer for the conventional chrome-containing chemical etch, is effective in promoting electroless metal coverage and the adhesion between the electroless metal layer and the substrate
20 citations
Patent•
04 Feb 1969
TL;DR: In this paper, a means for controlling the stability of electroless copper plating baths and enhancing the ductility properties of the electroless metal deposits produced therefrom is presented. But this method is not suitable for the application of plating.
Abstract: The present invention provides a means for controlling the stability of electroless copper plating baths and enhancing the ductility properties of the electroless metal deposits produced therefrom.
15 citations
Patent•
06 Jan 1969
TL;DR: High stability electroless copper plating baths containing as a stabilizer a small amount of o-phenanthroline and of iodide ions were used in this article to stabilize the plating bath.
Abstract: High stability electroless copper plating baths containing as a stabilizer a small amount of o-phenanthroline and of iodide ions.
14 citations
Patent•
03 Jul 1969
TL;DR: In this paper, an improved gold plating process was proposed, where the alkali metal concentration in the bath was maintained substantially constant during the plating operation by using ammoniated cation exchange resin.
Abstract: In an improved gold plating process the alkali metal concentration in the bath is maintained substantially constant during the plating operation by contacting the plating bath with an ammoniated cation exchange resin to replace alkali metal ions with ammonium ions and operating the ion exchanged plating bath at 60 DEG -90 DEG C. This process is particularly applicable when heavy coatings are desired, for example, in electroforming processes.
13 citations
Patent•
17 Sep 1969
TL;DR: In this article, a process for placing on COPPER-CLAD PLASTIC SUBSTRATES and for printing CIRCUIT BOARDS is described, and a constant improvement in the ADHESION BETWEEN the COOPER SURFACE and the METAL DEPOSITED by ELECTROLESS and/or ELECT-ROLYTIC PLATING is described.
Abstract: COPPER SURFACES ARE PLATED IN A PROCESS COMPRISING ETCHING, ACTIVATING, ELECTROLESS AND/OR ELECTROLYTIC COPPER DEPOSITION, AND HEATING OR BAKING AT A TEMPERATURE OF ABOUT 150* TO ABOUT 450*F. FOR ABOUT 10 MIN. TO ABOUT 2 HOURS OR MORE. SUBSTANTIAL IMPROVEMENT IN THE ADHESION BETWEEN THE COOPER SURFACE AND THE METAL DEPOSITED BY ELECTROLESS AND/OR ELECTROLYTIC PLATING IS ACHIEVED. PROCESSES FOR PLATING ON COPPER-CLAD PLASTIC SUBSTRATES AND FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS ARE ALSO SET FORTH.
11 citations
Patent•
21 May 1969
TL;DR: A method of continuously plating aluminum wire or strip stock is described in this article, where the stock passes through an alkaline etch bath, an acid oxidizing bath, a conditioner bath containing tin, and a bronze-plating bath in which bronze is plated on the aluminum.
Abstract: A method of continuously plating aluminum wire or strip stock. The stock passes through an alkaline etch bath, an acid oxidizing bath, a conditioner bath containing tin, and a bronze-plating bath in which bronze is plated on the aluminum. The conditions of concentration, temperature, and solution movement are all controlled so as to achieve continuous plating of bronze while feeding the stock at a relatively high speed. Following the bronze plating, further plating and/or drawing steps may be carried out.
10 citations
Patent•
19 Jun 1969TL;DR: These 2-phase composite coprocessor plates have been shown to be effective in ACID COPPER SULFATE PLATING BATHS for the CODEPOSITION of DISPERSED FINE, BATH-INSOLUBLE, NONCONDUCTING PARTICLES.
Abstract: FINE PARTICLES OF MANY NON-CONDUCTING MATERIALS DO NOT CODEPOSIT READILY FROM AQUEOUS ACIDIC COPPER ELECTROPLATING BATHS, UNLESS THERE IS PRESENT IN THE BATH ALIPHATIC AMINES, ESPECIALLY POLYAMINES OR IMINES, OR AMINO ACIDS SUCH AS ALANINE OR EDTA. THESE AMINO COMPOUNDS ARE ESPECIALLY EFFECTIVE IN ACID COPPER SULFATE PLATING BATHS FOR THE CODEPOSITION OF DISPERSED FINE, BATH-INSOLUBLE, NONCONDUCTING PARTICLES. THESE 2-PHASE COMPOSITE COPPER PLATES HAVE ENGINEERING USE POSSIBLITIES FOR ANTI-FRICTION AND ANTI-SEIZING PROBLEMS.
10 citations
Patent•
11 Aug 1969
TL;DR: In this paper, the authors present a novel approach for the electroplating of METAL IONS from an ACID solution of SAID METALS IONS and INDIUM IONS.
Abstract: THIS INVENTION RELATES TO A NOVEL ELECTROPLATING BATH FOR THE ELECTRODEPOSITION OF METAL IONS FROM AN ACID SOLUTION OF SAID METAL IONS AND INDIUM IONS. THE PLATING BATHS OF THIS INVENTION PRODUCE A BRIGHT, DUCTILE, MORE REFINED GRAINED METAL COATING AND ALLOW A HIGHER LIMITING CURRENT DENSITY. PREFERABLY THE BATH IS A COPPER PLATING BATH COMPRISING A MIXTURE OF A COPPER SALTS, INDIUM SALT AND AN ACID SELECTED FROM THE GROUP CONSISTING OF SULFURIC, PHOSPHORIC, FLUOBORIC AND MIXTURES THEREOF, EACH BEING PRESENT IN AN AMOUNT WHICH UPON DISSOLUTION IN AN AQUEOUS BATH PROVIDES A COPPER CONCENTRATION FROM 5 TO 35 GRAMS PER LITER, AN INDIUM CONCENTRATION SUCH THAT THE WEIGHT RATIO OF INDIUM TO COPPER RANGES FROM 0.002 TO 4.0 AND AN ACID CONCENTRATION FROM 100 TO 700 GRAMS PER LITER. THE COPPER PLATING BATHS HAVE PARTICULAR EFFICACY IN THE COPPER PLATING OF RECESSED AREAS, SUCH AS PERFORATED SUBSTRATES, FOR USE AS PRINTED CIRCUIT BOARDS.
Patent•
19 Jun 1969
TL;DR: In this paper, Saran F-220 resins, a copolymer of vinylidene chloride and acrylonitrile, densely codeposit with copper when dispersed in aqueous acidic copper electroplating baths.
Abstract: Fine particles of organic resins derived from vinylidene chloride such as Saran F-220 resin, a copolymer of vinylidene chloride and acrylonitrile, densely codeposit with copper when dispersed in aqueous acidic copper electroplating baths. These fine particles of polyvinylidene resins codeposit on vertical cathodes to an amazingly high volume percent compared to any other bath-insoluble particles, inorganic or organic. The surfaces of such two-phase copper coatings with their densely imbedded resin particles have anti-seizing properties. Furthermore, when subsequent thin plate is deposited over these copper surfaces with their densely imbedded particles, a finely porous over-lay plate is obtained. Also the resin particles may be dissolved out with solvents to yield porous copper surfaces or porous films.
Patent•
19 Jun 1969
TL;DR: In this paper, a 2-phase composite plate is proposed for anti-seizing and improved clothing resistances in ACIDICP SULFATE PLATING BATHS.
Abstract: FINE PARTICLES OF NON-CONDUCTING MATERIALS DO NOT CODEPOSIT READILY FROM AQUEOUS ACIDIC COPPER PLATING BATHS, UNLESS THERE IS PRESENT IN THE BATH MONOVALENT CATIONS SUCH AS THALLIUM, AMMONIUM AND THE ALKALI METAL CATIONS. THESE MONOVALENT CATIONS ARE ESPECIALLY EFFECTIVE IN ACIDIC COPPER SULFATE PLATING BATHS FOR THE CODEPOSITION OF DISPERSED FINE, BATH-INSOLUBLE, NON-CONDUCTING PARTICLES SUCH AS BARIUM SULFATE, ZIRCONIUM OXIDE, ETC. POSSIBLE ENGINEERING APPLICATIONS FOR SUCH 2-PHASE COMPOSITE PLATES ARE IN ANTI-SEIZING AND IMPROVED WEAR RESISTANCE.
Patent•
19 Feb 1969TL;DR: In this article, the authors describe a process of forming a SMOOTH ADHERENT NICKEL PLATE on the TITANIUM alloYS UTLIZING a CONTROLLED HALF-WAVE ANODIC ETCH in a quescent ACID BATH to aCHIEVE SELECTIVE KEY-HOLING of the SUBSTRATE SURFACE, FOLLOWED by CATHODICally applied nICKel PLATING.
Abstract: A PROCESS OF FORMING A SMOOTH ADHERENT NICKEL PLATE ON THE TITANIUM ALLOYS UTLIZING A CONTROLLED HALF-WAVE ANODIC ETCH IN A QUESCENT ACID BATH TO ACHIEVE SELECTIVE KEY-HOLING OF THE SUBSTRATE SURFACE, FOLLOWED BY CATHODICALLY APPLIED NICKEL PLATING.
Patent•
10 Jun 1969
TL;DR: In this article, a novel electroplating bath suitable for electrodepositing copper on steel was proposed, which consisted of an aqueous solution of soluble copper, an alkali metal thiosulfate, or bisulfite, and a heterocyclic nitrogen compound such as nicotine, 3-amino-1,2,4-triazole, etc.
Abstract: A novel electroplating bath suitable for electrodepositing copper on steel which comprises an aqueous solution of soluble copper, an alkali metal thiosulfate, an alkali metal sulfite or bisulfite, and a heterocyclic nitrogen compound such as nicotine, 3-amino-1,2,4-triazole, etc. During the electroplating process, the bath is subjected to aeration. The steel is cleaned and cathodically activated prior to plating.
Patent•
05 Aug 1969
TL;DR: CATALYTIC METAL SURFACES are NICKEL PLATED from a CATIONHYPOPHOSPHITE ANION Solution as mentioned in this paper, which is used by spraying reactive solutions on the METAL surface and heating the surface with STEAM.
Abstract: CATALYTIC METAL SURFACES ARE NICKEL PLATED FROM A CATIONHYPOPHOSPHITE ANION SOLUTION. PLATING IS ACCOMPLISHED BY SPRAYING THE REACTIVE SOLUTIONS ON THE METAL SURFACE AND HEATING THE SURFACE AS BY CONTATING IT WITH STEAM. PLATING SOLUTION IS RECOVERED, ADJUSTED IN PH AS NECESSARY TO ASSURE SATISFACTORY PLATING AND RECYCLED.
Patent•
31 Dec 1969
TL;DR: In this paper, a process for repairing defective areas or spots in chromium plated surfaces is described, in which the area is subjected to sequential steps, such as mechanical cleaning, electrocleaning, electroactivating, copper electroplating, nickel electroplacing, electrolytically removing the original chromium deposit from a band which borders the perimeter of the defective area.
Abstract: A process for repairing defective areas or spots in chromium plated surfaces in which the area is subjected to sequential steps, such as mechanical cleaning, electrocleaning, electroactivating, copper electroplating, nickel electroplating, electrocleaning and electroactivating the nickel deposit, and then chromium plating the nickel deposit. Prior to any metal deposition, the original chromium deposit is electrolytically removed from a band which borders the perimeter of the defective area. The copper electrodeposits (if used) and the nickel electrodeposit then cover the defective area and at least part of the bordering band but do not reach the contiguous originally deposited chrome-plate from which the copper and/or nickel is more likely to peel. The final chromium plating covers all of the defective area, bordering band, and contiguous originally deposited chrome-plate.
Patent•
28 May 1969
TL;DR: In this article, a method of making a plated wire non-destructive readout memory element in which a beryllium copper wire is first copper coated and electrolytically polished to optimize the surface of the copper coating and then continuously electroplated in a nickel sulfamate-ferrous sulfate bath to produce nonmagnetostrictive permalloy coating thereon.
Abstract: A method of making a plated wire nondestructive readout memory element in which a beryllium copper wire is first copper coated and electrolytically polished to optimize the surface of the copper coating and then continuously electroplated in a nickel sulfamate-ferrous sulfate bath to produce nonmagnetostrictive permalloy coating thereon.
Patent•
09 Apr 1969
TL;DR: In this paper, the authors present a method for placing thin films of zinc on a flat surface at moderate temperatures by first coating the surface with an ORGANO ZINC COMPOUND and then contacting it with an ALUMINUM HYDROGEN BONDED DIRECTLY to the aluminum.
Abstract: THIN FILMS OF ZINC CAN BE PLATED ONTO SUBSTRATES AT AMBIENT TEMPERATURES BY FIRST COATING THE SUBSTRATE WITH AN ORGANO ZINC COMPOUND AND THEN CONTACTING THE WETTED SUBSTRATE WITH AN ALUMINUM COMPOUND HAVING AT LEAST ONE HYDROGEN BONDED DIRECTLY TO THE ALUMINUM. THE ALUMINUM HYDRIDE SERVES TO REDUCE THE ZINC COMPOUND, AND GOOD ADHESIVE THIN FILMS OF ZINC ON THE SUBSTRATE ARE FORMED.
Patent•
23 Sep 1969
TL;DR: In this paper, a group of members of the group of ELEMENTAL PHOSPHORUS and LOW OXIDATION STATE PORUS COMPOUNDS is surveyed to provide ELECTROSTATIC and MAGNOSTATic SHIELDing of WIRES.
Abstract: A PROCESS COMPRISING SUBJECTING A SUBSTRATE TO A MEMBER OF THE GROUP OF ELEMENTAL PHOSPHORUS AND LOW OXIDATION STATE PHOSPHORUS COMPOUNDS, AND THEREAFTER TO A METAL SALT OR COMPLEX THEREOF IS EMPLOYED TO PROVIDE ELECTROSTATIC AND MAGNOSTATIC SHIELDING OF WIRES AND IN THE PRODUCTION OF ANTISTATIC TEXTILES. IMPROVEMENTS IN THE COATING OF FILAMENTS ARE PROVIDED BY SUBJECTION OF THE SUBSTRATE TO A SOLUTION OF ELEMENTAL PHOSPHORUS, MOLTEN ELEMENTAL PHOSPHORUS, AND THEREAFTER TO THE METAL SALT OF COMPLEX THEREOF, AND ALSO BY EMPLOYING A SECOND METAL SALT BATH.
Patent•
23 Jan 1969
TL;DR: In this article, an improved version of the COPPER ELECTRODEPOSITION of COPPER is proposed by adding a COMBINATION of a CATION ACTIVE ORGANIC NITROGEN COMPOUND and a LIGNOSULFONATE MATERIAL to a COPER ELECTRONIC ELECTROLYTE.
Abstract: IMPROVED ELECTRODEPOSITION OF COPPER IS ACHIEVED BY ADDING A COMBINATION OF A CATION ACTIVE ORGANIC NITROGEN COMPOUND AND A LIGNOSULFONATE MATERIAL TO A COPPER ELECTRODEPOSITION ELECTROLYTE.
Patent•
08 Aug 1969TL;DR: In this article, a hollow mold is used to construct a ferrite core plug-in unit and copper plating applied to the entire unit is removed from the plane established by the nonconducting surfaces only.
Abstract: Plastic encapsulated ferrite core plug-in units are fabricated by an injection molding technique utilizing a hollow mold. Conducting paths on and through the units are transferred from the mold to the units such that the conducting paths are in a plane different from the nonconducting surface of the units. Copper plating applied to the entire unit is then removed from the plane established by the nonconducting surfaces only.
Patent•
29 Jan 1969TL;DR: An ELECTROLYTIC SOLUTION for ZINC PLATING CONTAINING ZINC ACETATE, ZINC CHLORIDE OR ZINC SULFATE, AMMONIUM CHLoride; SODIUM OR POTASSIUM GLUCONATE; BORIC ACID; and GLOSSING AGENTS can be found in this paper.
Abstract: AN ELECTROLYTIC SOLUTION FOR ZINC PLATING CONTAINING ZINC ACETATE, ZINC CHLORIDE OR ZINC SULFATE; AMMONIUM CHLORIDE; SODIUM OR POTASSIUM GLUCONATE; BORIC ACID; AND GLOSSING AGENTS. EQUAL OR SUPERIOR UNIFORM DEPOSITABILITY, CHROMATE TREATABILITY AND CORROSION RESISTANCE CAN BE OBTAINED WITH THE USE THEREOF.
Patent•
29 Aug 1969
TL;DR: In this paper, a process for op-plating copper on a base member is described, with the goal of determining the thickness of a part of the copper on the base member.
Abstract: A PROCESS FOR ELECTROPLATING COPPER ON A BASE MEMBER COMPRISING APPLYING TO THE MEMBER AN ESSENTIALLY SULFURFREE AQUEOUS ALKALINE CYANIDE PLATING BATH COMRPISING A SOURCE OF COPPER, AN ACETYLENIC ALCOHOL, A COMPLEXING AGENT AND A HYDROXY ACID. CURRENT IS CAUSED TO FLOW THROUGH THE MEMBER WHILE IN CONTACT WITH THE PLATING BATH FOR A PERIOD OF 20-60 SECONDS TO ELECTROPLATE COPPER ON SAID MEMBER. THEREAFTER A DEPLATING ELECTRIC CURRENT IS CAUSED TO FLOW THROUGH SAID MEMBER FOR A PERIOD OF 6-20 SECONDS TO DEPLATE A PART OF THE COPPER PLATED ON THE MEMBER. ALTERNATE PLATING AND DEPLATING CYCLES ARE CONTINUED UNTIL A DESIRED THICKNESS OF COPPER HAS BEEN DEPOSITED ON THE MEMBER.
Patent•
31 Dec 1969
TL;DR: In this article, the authors describe electroless plating with Cu or Cu-Sn to facilitate cold deformation, particularly in wire manufacture, takes place by treating surface of high grade steel with aqs. at 15-80 degrees C for 5-15 min., and then treating with known solutions for electroless deposition of Cu-containing metal coatings.
Abstract: Electroless plating with Cu or Cu-Sn, to facilitate cold-deformation, particularly in wire manufacture, takes place by treating surface of high grade steel with aqs. solutions containing non-oxidising mineral acids, pref. 90-140 g/l HCl and optionally 170-350 g/l H2SO4, and 30-100 g/l soluble Ti salt, pref. Na-, K- or NH4 fluorotitanate, pref. at 15-80 degrees C for 5-15 min., and then treating with known solutions for electroless deposition of Cu-containing metal coatings, pref. aqs. solutions containing 1-20 g/l Cu, 1-10 g/l chloride, 15-400 g/l H2SO4 and 0.01-3 g/l inhibitor.
Patent•
02 May 1969
TL;DR: In this article, the plating of zirconium and its alloys is described using chemical displacement, the workpiece being first pickled and then immersed in a bath of molten CuCl 2 in an inert atmosphere at 430‹ -600‹C. for 10 seconds to 20 minutes to obtain a copper coating.
Abstract: 1,239,863. Plating zirconium. EUROPEAN ATOMIC ENERGY COMMUNITY. May 2, 1969 [May 13, 1968], No. 22591/69. Heading C7F. Zirconium and its alloys are plated by chemical displacement, the workpiece being first pickled and then immersed in a bath of molten CuCl 2 in an inert atmosphere at 430‹ -600‹C. for 10 seconds to 20 minutes to obtain a copper coating. Residual salts adhering to the coated surface may be removed by immersion in a LiCl-KCl eutectic at 500‹C, for 8-10 seconds, followed by water rinsing. The Cu coating may be used as a base for electro-plated Ni, Au, Ag, Cr, Cd, Pb, As, or Sb, or as a base for coatings of Nb, Mo, or W deposited from their halides in the gaseous phase.
TL;DR: In this paper, a comparison between two separate solutions or one single solution is drawn, with respect to the throwing power, stability and grain structure of the deposit, and other electroplating systems used to deposit etch resists and solderable surfaces are also discussed.
Abstract: SummaryThe through-hole plating of printed circuits is essentially a method of electroplating non-conductors, and can be divided into four basic sections—cleaning, activation, metallization and electroplating. Activation consists of the absorption of tin compounds and a precious metal from either two separate solutions or one single solution; a comparison is drawn between these two methods indicating the advantages to be gained from the single stage solution. Electroless copper solutions are generally used for metallization and the working parameters of these are considered. Build up of the electroless film is carried out in copper electroplating solutions of which several types are available. A comparison is drawn between these solutions, with respect to throwing power, stability and grain structure of the deposit. Other electroplating systems used to deposit etch resists and solderable surfaces are also discussed.