Showing papers on "Copper plating published in 1989"
Patent•
24 Oct 1989
TL;DR: In this article, a method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat is presented. But the method requires the removal of a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electricallyconductive layer, plating a copper base into an opening in the base mask, stripping the plating masks, and stripping the electrical conductive layers below the stripped base mask.
Abstract: A method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.
130 citations
Patent•
12 Sep 1989TL;DR: In this article, a method for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate is described.
Abstract: A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.
81 citations
TL;DR: In this paper, the effects of nickel deposit and boric acid of hypophosphite-reduced electroless copper plating were studied by cyclic voltammetry and it was found that only those copper (II) complex ions that form dimeric structures have a significant plating rate.
Abstract: Effects of nickel deposit and boric acid of hypophosphite‐reduced electroless copper plating were studied by cyclic voltammetry. Nickel deposit can catalyze the oxidation of hypophosphite, and boric acid can enhance the reduction of nickel ion. In conjunction with the results of EPR studies of copper (II) complex ion and data of stability constants of copper (II) complex ion, it was found that the rate‐determining step in hypophosphite‐reduced electroless copper is the reduction of copper (II) complex ion and only those copper (II) complex ions that form dimeric structures have a significant plating rate.
58 citations
Patent•
19 May 1989TL;DR: In this paper, a method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards is presented, which comprises subjecting a copper foil clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper fo having an average thickness of 12 μm or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 μm/sec, thereby
Abstract: A method for preparing a thin copper foil-clad substrate for the manufacture therefrom of circuit boards, which comprises subjecting a copper foil-clad circuit board substrate comprising an electrically insulating support having provided on one or both sides thereof a copper foil having an average thickness of 12 μm or more to etching with an etching solution for copper, the etching being performed such that the whole surface of the copper foil is etched at a predetermined etching rate selected from the range of from 0.01 to 0.3 μm/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness, and the variation of the thickness of the copper foil remaining after the etching is within ±2.0 μm on the basis of a desired thickness.
44 citations
Patent•
21 Feb 1989
TL;DR: In this paper, an electromagnetic wave shielding circuit and the production method thereof are described, wherein the circuit comprises a base board, an electric circuit formed on the base board and an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coating over the electrically isolated coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuits an electromagnetic current which may be produced in the electric Circuit, said copper particle contained coating having contained therein 100% by weight of copper particles
Abstract: An electromagnetic wave shielding circuit and the production method thereof is described, wherein the circuit comprises a base board, an electric circuit formed on the base board, an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coated over the electrically isolating coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuit an electromagnetic wave current which may be produced in the electric circuit, said copper particle containing coating having contained therein 100% by weight of copper particles and 12%-25% by weight of epoxy resin for a binder.
40 citations
Patent•
01 May 1989
TL;DR: In this article, an ultrathin copper-clad laminate with a copper foil of 10 μm or less suited for flexible circuit boards can be produced in a short time using small equipment, and the copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm2 in current density.
Abstract: A process for producing a copper-clad laminate, which comprises a step (S2) of forming a copper foil of at least several micrometers on a planar conductive substrate by electrolysis, a step (S3) of roughening the surface of the copper foil, a step (S4) of laminating the copper foil together with the conductive substrate on an insulating substrate and tightly integrating the assembly by applying pressure and heat, and a step (S5) of separating only the conductive substrate. A metal film may exist between the conductive substrate and the copper foil. When the metal film has a thickness of 0.1 to 3 μm, only the conductive substrate is separated with the metal film being firmly adhered to the copper foil surface and, when the metal film has a thickness of 70 to 250 μm, it is separated together with the conductive substrate after the lamination. The copper foil formed by high-speed plating under the conditions of 6 to 12.0 m/sec in solution contact speed and 0.8 to 4.0 A/cm2 in current density has about the same flexibility as that of rolled and annealed copper. Thus, ultrathin copper-clad laminates with a copper foil of 10 μm or less suited for flexible circuit boards can be produced in a short time using small equipment.
39 citations
TL;DR: The organometallic compound allylcyclopentadienylpalladium can be easily prepared in high yield and exhibits unusual volatility at room temperature as mentioned in this paper, and it is an active catalyst for electroless copper plating.
Abstract: The organometallic compound allylcyclopentadienylpalladium can be easily prepared in high yield. The compound exhibits unusual volatility at room temperature. Phtotochemical decomposition of allylcyclopentadienylpalladium results in the deposition of film that consists of a homogeneous mixture of palladium particles in an organic matrix. Without further activation, the deposited film is an active catalyst for electroless copper plating. The plated copper was uniform and conformal and exhibited good electrical properties
33 citations
Patent•
10 Jul 1989
TL;DR: In this article, an improvement in the surface treatment of copper surfaces is presented, where an oxidized copper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent.
Abstract: The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses between said copper foil surfaces and adjacent surfaces of resinous layers. It is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. In a method according to the invention, an oxidized copper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent. The result is a reticulated metallic copper microstructure capable of forming a strong adhesive bond with a resinous substrate, and having a high resistance to thermal, mechanical, and chemical (e.g. acid) stress.
30 citations
TL;DR: In this paper, a study has been made to determine the effect of an electrochemically produced titanium-oxide film on the nucleation of copper, and it was found that the oxide film played an important role during nucleation.
30 citations
Patent•
09 May 1989
TL;DR: A corrosion resistant coating and process comprises the following layers applied in sequence over a ferrous metal substrate: a micro-throwing nickel-zinc alloy plating; an optional galvanically protective zinc metal plating, a zinc-nickel alloy containing 5 to 30 weight percent nickel; and an organic coating such as paint as mentioned in this paper.
Abstract: A corrosion resistant coating and process comprises the following layers applied in sequence over a ferrous metal substrate: a micro-throwing nickel-zinc alloy plating; an optional galvanically protective zinc metal plating; a zinc-nickel alloy plating containing 5 to 30 weight percent nickel; and an organic coating such as paint. In place of the organic coating there may be utilized sequential layers of copper, nickel and chromium or chromium-substitute plating. The coating is preferably used with steel drill screw fasteners.
29 citations
TL;DR: In this paper, the effects of the pretreatment of copper in benzimidazole solutions on the anodic reactions have been observed by using the infrared reflection-absorption technique and X-ray photoelectron spectroscopy.
Patent•
29 Dec 1989
TL;DR: In this paper, an electroless copper plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator was presented. But the results were limited to the case when the trialkylenediamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator.
Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 12×10-4 to 12×10-3 mole/l of an iron ion compound as a reaction initiator and/or 192×10-4 to 192×10-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, α,α,α-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution
Patent•
23 Jan 1989
TL;DR: In this paper, a polyimide sheet is treated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties.
Abstract: Bath surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt which can also include a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which services the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating said porous metal layer.
Patent•
28 Sep 1989
TL;DR: In this article, cross-linked polymer microspheres are carefully separated into fractions of equal size and density by first using sieves and then using hydraulic separation in a cone Each fraction is separately plated with copper.
Abstract: Cross-linked polymer microspheres are carefully separated into fractions of equal size and density by first using sieves and then using hydraulic separation in a cone Each fraction is separately plated with copper The copper plated microspheres are again separated into fractions of equal size and density Each fraction is then given an additional metal plating The thus plated microspheres have uniformly thick plating and have a maximized surface area for the amount of metal plated making them particularly useful as catalysts or in electrical products or processes Microspheres having a plating of palladium exhibit a marked improvement in the adsorption of hydrogen both quantitatively and in rapidity
Patent•
05 Dec 1989
TL;DR: In this article, a method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance, characterised in that said bright plating film comprising a copper and a nickel plating layers formed on a basis material, a microporous layer of a thickness of 0.2-2µm codeposited on said nickel playing layer by adding calcium salt and titanium oxide to Watts bath type of Nickel plating bath, chromium plating surface with micropores of 20000-500000/cm², and is directed to the pl
Abstract: This invention is directed to a method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance, characterized in that said bright electroplating film comprising a copper and a nickel plating layers formed on a basis material or a nickel plating layer directly formed on a basis material, a microporous layer of a thickness of 0.2-2µm codeposited on said nickel plating layer by adding calcium salt and titanium oxide to Watts bath type of nickel plating bath, chromium plating layer with a thickness of 0.01-0.25µm on said microporous layer and a chromium plating surface with micropores of 20000-500000/cm², and is directed to the plating films obtained by the method.
Patent•
28 Sep 1989
TL;DR: A process for the formation of a chemical conversion coating on the surface of copper or a copper alloy comprises contacting the metal surface with an aqueous solution containing an imidazole compound having an alkyl group having 5 to 21 carbon atoms at the 2-position as discussed by the authors.
Abstract: A process for the formation of a chemical conversion coating on the surface of copper or a copper alloy comprises contacting the metal surface with an aqueous solution containing an imidazole compound having an alkyl group having 5 to 21 carbon atoms at the 2-position, wherein a substance capable of generating a copper ion or zinc ion is dissolved and contained in the aqueous solution containing the alkylimidazole compound.
Patent•
24 Jul 1989TL;DR: In this article, a process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation, where at least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independently from the current to the soluble copper anode in order to reduce the level of bath impurities and maintain the quality of the deposit.
Abstract: A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independently from the current to the soluble copper anode in order to reduce the level of bath impurities and maintain the quality of the deposit.
Patent•
IBM1
TL;DR: An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described in this paper, where the bath contains sulfuric acid, copper sulfate, in solution with urea as a levelling agent, a cationic surfactant as a wetting agent and an ester of a sulfonic acid, Beta-phenylethyltosylate as a brightening agent.
Abstract: An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described, wherein the bath contains sulfuric acid, copper sulfate, in solution with urea as a levelling agent, a cationic surfactant as a wetting agent and an ester of a sulfonic acid, Beta-phenylethyltosylate as a brightening agent.
Patent•
21 Aug 1989
TL;DR: A multilayered sliding material of lead bronze containing graphite in the form of a bimetal, comprising a steel plate or steel plate having a copper plating coating and a sintered copper alloy bonded to the steel plate as mentioned in this paper.
Abstract: A multilayered sliding material of lead bronze containing graphite in the form of a bimetal, comprising a steel plate or a steel plate having a copper plating coating and a sintered copper alloy bonded to the steel plate, the sintered copper alloy having a composition consisting of 5 to 16 wt % Sn, 2 to 20 wt % Pb, 0.03 to 1 wt % P, 0.5 to 3.9 wt % graphite, and the balance Cu, wherein hardness of the alloy exceeds Hv 100.
Patent•
02 May 1989
TL;DR: In this article, the authors proposed a method to obtain a copper foil used for a printed circuit, which is excellent in heat resistant peel strength and hydrochloric acid resistance the same as a copper foils subjected to an Cu-Ni treatment, capable of being etched through a CuCl 2 etching liquid, and moreover, being subject to an alkali etching, and lower than an allowable level in magnetization, by a method wherein an electroplating layer formed of copper, cobalt, and nickel is formed on the surface of the copper foil.
Abstract: PURPOSE: To obtain a copper foil used for a printed circuit, which is excellent in heat resistant peel strength and hydrochloric acid resistance the same as a copper foil subjected to an Cu-Ni treatment, capable of being etched through a CuCl 2 etching liquid to form a printed circuit whose circuit pitch is 150μm or below and moreover capable of being subjected to an alkali etching, and lower than an allowable level in magnetization, by a method wherein an electroplating layer formed of copper, cobalt, and nickel is formed on the surface of the copper foil, which is subjected to an anticorrosion treatment. CONSTITUTION: Either of an electrolytic copper foil and a rolled copper foil can be used as a copper foil of this design. Usually, the surface of the copper foil is subjected to a roughing treatment. After a pretreatment, ternary alloy, for instance, composed of copper of 20-40mg/dm 2 - cobalt of 100-3000g/dm 2 - nickel of 100-1000μg/dm 2 is formed, at least, on one side of the copper foil through electroplating. Then, it is preferable that a film formed of only chrome oxide or mixture of chrome oxide and zinc/zinc oxide is formed as a required anticorrosion treatment. COPYRIGHT: (C)1990,JPO&Japio
Patent•
27 Feb 1989
TL;DR: In this paper, the authors proposed to reduce shearing resistance in punching, prevent crack from being formed between punched holes, and improve the quality of a printed circuit board by forming a prepared hole and by punching the printed circuit boards by a die punch with the diameter larger than that of the prepared hole.
Abstract: PURPOSE: To reduce shearing resistance in punching, prevent crack from being formed between punched holes, and improve the quality of a printed circuit board by forming a prepared hole and by punching the printed circuit board by a die punch with the diameter larger than that of the prepared hole CONSTITUTION: A small prepared hole 5d is bored in a printed circuit board 5a by a drill 5b Secondly, a conductive hole 5f formed by treating the prepared hole 5d by copper plating 5e is punched through by a die punch 5d with the diameter larger than that of the prepared hole 5d so as to form a nonconductive hole 5c in the printed circuit board 5a The stress formed then is relieved to a hole trunk part of the prepared hole 5d to drastically reduce the shearing resistance so that no crack is formed between the hole 5c and the hole 5c which are approached to each other by the impact of the punching
Patent•
16 Oct 1989TL;DR: In this paper, a method for electrolessly plating portions of semiconductor devices and the like comprises the steps of providing a first metal having a higher electromotive series than a coating metal, galvanically coupling a second metal to the first metal wherein a portion of the first sheet remains exposed and subjecting the second sheet and the exposed portion of sheet to an electroless coating metal plating solution.
Abstract: A method for electrolessly plating portions of semiconductor devices and the like comprises the steps of providing a first metal having a higher electromotive series than a coating metal, galvanically coupling a second metal to the first metal wherein a portion of the first metal remains exposed and then subjecting the second metal and the exposed portion of the first metal to an electroless coating metal plating solution. The method employs no masks and is ideal for plating small areas such as single ball bonds and limited numbers of ball bonds on a single semiconductor chip.
Patent•
07 Feb 1989
TL;DR: In this paper, a process for making a copper-plated aluminum wire by scraping an alumina film formed on an outer circumferential surface on an aluminum core wire in a deaeration tank was described.
Abstract: A process for making a copper-plated aluminum wire by first scraping an alumina film formed on an outer circumferential surface on an aluminum core wire in a deaeration tank and then plating a pure copper on the scraped aluminum core wire to form a copper-plated aluminum wire without forming an alumina layer between the aluminum core wire and the outer copper plating layer.
Patent•
23 Mar 1989
TL;DR: The surface of a copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion as discussed by the authors.
Abstract: The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using the copper foil or a copper clad laminate for the internal layer as the cathode.
Patent•
30 Mar 1989
TL;DR: In this article, a multi-layer printed circuit board is manufactured by forming a wiring pattern layer on a ceramic substrate through copper plating and forming an insulating layer thereon and then repeating the steps for forming both layers.
Abstract: A ceramic multi-layer printed circuit board is manufactured by forming a wiring pattern layer on a ceramic substrate through copper plating and forming an insulating layer thereon and then repeating the steps for forming both layers.
Patent•
23 Feb 1989
TL;DR: In this article, a formaldehyde-free electroless copper plating solution, containing a solution soluble divalent copper compound in a concentration between about 1/2 and 2 g/l; a reducing agent for the copper compound and a complexing and chelating agent mixture of between about 5 and 100 ml/l of an alkanol amine having at least one alkyl group with one to three carbon atoms.
Abstract: This invention relates to a formaldehyde-free electroless copper plating solution, containing a solution soluble divalent copper compound in a concentration between about 1/2 and 2 g/l; a reducing agent for the copper compound in an amount of between about 1 and 3 g/l; a complexing and chelating agent mixture of between about 5 and 100 ml/l of an alkanol amine having at least one alkyl group with one to three carbon atoms and between about 1 and 10 g/l of an ethylene diamine compound of the formula ##STR1## wherein R is an alkyl moiety having between 1 and 3 carbon atoms and X is --OH or --COOH; the solution preferably having a pH between about 7 and 8.5 and a temperature preferably between about 130° and 150° F., with the complexing and chelating agent mixture being present to provide stability to the solution and to enable the solution to provide a uniform plating rate of copper upon a substrate which is immersed therein.
Patent•
15 Dec 1989
TL;DR: In this article, a non-oxide ceramic material such as aluminum nitride can be metallized with copper by directly bonding a thin sheet of copper to a substrate of the nonoxide ceramic materials instead of using a conventional manner in which a paste comprising a powder of copper and a binder is applied to a ceramic substrate by printing.
Abstract: A non-oxide ceramic material such as aluminum nitride can be metallized with copper by directly bonding a thin sheet of copper to a substrate of the non-oxide ceramic material instead of using a conventional manner in which a paste comprising a powder of copper and a binder is applied to a ceramic substrate by printing. This metallization is effected by placing the non-oxide ceramic material either in contact with or in close proximity to copper containing a copper oxide, followed by heating them in a non-oxidizing atmosphere at a temperature lower than the melting point of copper, but at which the dissociation of the copper oxide contained in copper can occur, so as to dissociate at least part of the copper oxide into metallic copper and oxygen to thereby provide a strong bondage between the surfaces of said non-oxide ceramic material and copper. The metallized non-oxide ceramic material can be used as a substrate for use in IC devices.
Patent•
IBM1
TL;DR: An additive plating bath and process for use in printed circuit manufacturing for applying copper to thick film patterns is described in this paper.The bath includes a low concentration of sulfuric acid, copper sulfate, urea, glycerin and a surface active agent in an aqueous solution.
Abstract: An additive plating bath and process are described for use in printed circuit manufacturing for applying copper to thick film patterns, said bath includes a low concentration of sulfuric acid, copper sulfate, urea, glycerin and a surface active agent in an aqueous solution.
Patent•
20 Nov 1989
TL;DR: In this article, a solution of soluble copper salt and an acid electrolyte was used for electroplating walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at at least 0.100 inches.
Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.