Showing papers on "Electronic packaging published in 1986"
Patent•
30 Oct 1986TL;DR: In this article, a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout is proposed for housing semiconductor devices.
Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
105 citations
Patent•
27 Nov 1986
TL;DR: In this paper, the filling material quantity is weighed by means of a weighing device (W) which is placed onto a normal tubular-bag machine (S), where the feed device is for a large part supported on weighing cells (30, 32).
Abstract: Process for the metering and packaging of pourable materials and packaging machine for carrying out the process. In the packaging of bulk material in relatively large packaging portions, volumetric metering is generally used. The desired accuracy consequently cannot be achieved, particularly where larger portions are concerned. To solve this problem, according to the invention the filling-material quantity is weighed, specifically by means of a weighing device (W) which is placed onto a normal tubular-bag machine (S). The feed device for the filling material is for a large part supported on weighing cells (30, 32). The packaging machine is suitable for the metering and packaging of all bulk materials conveyable by means of a worm and can therefore be used in a versatile way in the packaging industry.
51 citations
TL;DR: A wafer-scale packaging technology has the potential to provide the flexibility of hybrid techniques with the reliability and density of monolithic fabrication.
Abstract: A wafer-scale packaging technology is discussed. Pretested IC chips are mounted in holes etched through silicon wafers. Chips are interconnected via the wafer using standard multilevel metallization processes. The packaging technology has the potential to provide the flexibility of hybrid techniques with the reliability and density of monolithic fabrication.
41 citations
TL;DR: In this article, a lateral fiber-detector coupling scheme employing a 45° mirror fabricated on the end of the fiber has been presented, which shows its greatest promise at very high speeds where the IC interconnect issue is emerging as one of utmost relevance.
Abstract: As part of a project to develop a high speed (500 MHz) monolithic silicon fiber-optic digital receiver IC, we have produced a novel and practical lateral fiber-detector coupling scheme employing a 45° mirror fabricated on the end of the fiber. Coupling losses of 1.1 dB have been achieved. The technique shows its greatest promise at very high speeds where the IC interconnect issue is emerging as one of utmost relevance. In the work described here, the laterally coupled IC's were packaged in high speed metal flat packs. This technique rendered a fiber-optic digital receiver compatible with two-dimensional layout techniques common in high speed electronics. However, the lateral coupler concept itself is not dependent on the use of metal flat packs. In fact, it is likely to find its greatest utility in the optical coupling of many fibers to a single IC. In this paper, system design considerations, fabrication techniques, and measured results for the lateral coupler concept are discussed.
25 citations
28 May 1986
22 citations
Journal Article•
19 citations
TL;DR: In this article, a non-conventional route to formation of dense glass-ceramics at relatively low temperatures was described, where organometallic precursors were used to synthesize powders with controlled purity and stoichiometry in the MgO/Al2O3/SiO2 system.
Abstract: This paper describes a non-conventional route to formation of dense glass-ceramics at relatively low temperatures. Organometallic precursors were used to synthesize powders with controlled purity and stoichiometry in the MgO/Al2O3/SiO2 system. These amorphous powders sintered by viscous flow to form a dense glass below 1000°C. Further heating resulted in the formation of very fine grained glass-ceramics. Beta-quartz, cordierite, and cordierite-mullite glass-ceramics were obtained with attractive properties for electronic packaging.
12 citations
01 Jan 1986
TL;DR: A broad range of materials, including metals, polymers and ceramics, were discussed at the Symposium as discussed by the authors, where interfaces between various materials was a major concern, especially the role of interfaces in adhesion.
Abstract: : The symposium explored the materials science aspects of electronic packaging. Electronic packaging has come to include interconnection technology, which involves aspects of on-chip processing, such as deposited dielectrics, interconnects and encapsulants, as well as chip carrier and printed circuit board fabrication. A very broad range of materials was discussed at the symposium, including metals, polymers and ceramics. The interfaces between various materials was a major concern, especially the role of interfaces in adhesion. Ceramics are in widespread use as chip carriers, and for this use, there is a need for low dielectric constant materials, for contolled thermal properties, and for ceramics with small shrinkage and good dimensional stability during firing. Methods were reported for making porous ceramics to reduce the dielectric constant. Interfaces between ceramics and glasses and between glasses and polymers play an important role in the properties of chip carriers and printed circuit boards. Several authors reported on the processing and properties of of polymides which are used extensively for on-chip deposited dielectric layers.
4 citations
01 Jan 1986
IBM1
TL;DR: In this article, the effects of ambient and diffusion barriers on the metal-metal interactions are described, where extensive interactions across the diffusion barrier are observed, and their impact on the packaging applications discussed.
Abstract: Metal-metal interactions have been of vital importance to various technologies, including packaging of electronic materials. Extensive interdiffusion and outdiffusion can lead to undesired alloy formation, and oxide formation on the surface which can hinder subsequent bonding processes. Furthermore, the interactions can be profoundly affected by the ambient gases used, either in the joining process or during subsequent storage and operation. One therefore needs a specially designed metallurgy, a diffusion barrier layer, or a proper ambient to deal with such concerns. The effects of ambient and diffusion barriers on the metal-metal interactions are described. Examples are illustrated where extensive interactions across the diffusion barrier are observed, and their impact on the packaging applications discussed.
01 Jan 1986
TL;DR: In this article, the authors discuss the use of heat pipes in electronic packaging applications and their performance characteristics, and examples of how thermal problems can be solved using heat pipes, and how thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions.
Abstract: Some of the advanced thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions are discussed. Heat pipes in actual electronic packaging applications, and those under development, are discussed. Performance characteristics of heat pipes are given, and examples are described of how thermal problems in electronic packaging are solved through the use of heat pipes.