Showing papers on "Electroplating published in 1973"

Electrolyte for and method of bright electroplating of tin-lead alloy

Abstract: A method of and an electrolyte for the bright electroplating tin-lead alloys which comprises using as the plating solution a mixture which contains phenolsulfonates or cresolsulfonates of divalent tin and lead, with the "reaction products of aliphatic aldehydes with aromatic primary amines," and acetaldehyde.

Cyanide-free electroplating

Abstract: Improved cyanide-free aqueous electroplating baths for plating metals, the baths containing water soluble phosphonate chelating agents combined with at least one chelatable metal ion and containing as an additive at least one strong oxidizing agent, and electroplating processes employing said baths. Additional materials may also be added for further improvements.

Electrolytes for the electrolytic deposition of zinc

Abstract: An aqueous alkaline zinc bath is used for electroplating bright metallic zinc deposits on metal substrates said plating bath containing less than about 2 oz./gal. of cyanide therein, and comprising an aqueous alkaline solution having dissolved therein a soluble zinc compound capable of being plated by electrolytic deposition and a water soluble reaction product of an amine and an epihalohydrin containing recurring tertiary and/or quaternary amine groups and having a molecular weight above about 250 in an amount from at least about 0.1 gm./liter.

Electrolytic deposition of zinc

Abstract: An aqueous alkaline zinc bath for electroplating bright metallic zinc deposits on metal substrates is disclosed which comprises an aqueous alkaline substantially cyanide-free solution having dissolved therein at least one soluble zinc compound capable of being plated by electrolytic depositions and an effective amount of at least one substituted pyridine or quinoline compound possessing at least one amine containing substituent.

Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore

Abstract: Polyethyleneimines, derived from the polymerization of ethylene imines, substituted ethylene imines, or derived from the addition of ethylene imine to organic or inorganic molecules, are incorporated into gold and gold alloy plating baths as agents for the general improvement of the brightness of the electroplate and other physical properties of both the deposit obtained in the electroplating from such baths and of the operating conditions of the baths. The operating characteristics of the aqueous electroplating baths such as the maximum current density, the cathode current efficiency, the width of the pH range etc. are vastly improved over conventional plating baths. Furthermore, the incorporation of these polyethylene imines also results in minimizing the stress of the electrodeposit and in minimizing the variation of the stress with current density.

Purification of nickel and cobalt electroplating solutions

Abstract: Zinc, copper and/or iron impurities ordinarily associated with nickel or cobalt electroplating baths can be removed from solution by introducing an amount of a predetermined and selected mercaptobenzothiazole compound into the electroplating bath sufficient to convert the zinc, copper and/or iron impurities into relatively insoluble metal salts. The insoluble salts may then be removed from the bath by passing the treated solution through a standard filtering system.

Method for continuous high speed electroplating of strip, wire and the like

Abstract: A high ''''deposition'''' speed continuous electroplating method provides along the travel path of the workpiece an electroplating chamber with entrance and exits at opposite ends and an anode therewithin. The workpiece is passed through the chamber while electroplating solution is passed therethrough. Externally of the electroplating unit is provided electrical contact means for supplying current to the workpiece to develop a potential between it and the anode within the electroplating chamber, and the electrical contact means desirably provides adjustability to accommodate different workpiece sizes. The method also involves passing the workpiece continuously through a rinsing station to remove plating solution and a drying chamber in which gas inert to the workpiece and under pressure is caused to impinge upon the surface of the workpiece from directions spaced substantially about its periphery and thence to flow along the path of the workpiece to effect removal of moisture therefrom. The method is especially adapted to the plating of gold.

Apparatus and method for continuous selective electroplating

Abstract: Apparatus and method for continuous electroplating of selected portions of discrete electronic components. A movable plating belt adapted for carrying electroplating solution on the surface thereof, is continuously moved through an electroplating station, with the electroplating solution being applied to the belt upstream of the plating station. The components to be selectively plated are arrayed into a line and conveyed across the surface of the moving belt with the portions selected to be plated in contact with the electroplating solution. The direction of conveyance is skewed with respect to the line along which the said belt moves, whereby the trace of each conveyed component on the belt, continuously overlies fresh electroplating solution. A D.C. electrical potential is applied between the components and the backside of the plating belt, to enable the electroplating action.

Acid zinc electroplating electrolyte, process and additive

Abstract: Bright zinc electroplates can be deposited from electrolytes containing zinc chloride, ammonium chloride, and an addition agent comprising a mixture of certain nonionic polyoxyethylene compounds, certain ketones and certain carboxylic acids.

Method of manufacture of x-ray tube having focusing cup with non emitting coating

Abstract: An X-ray tube is described including a focusing cup electrode coated with a high work function material, such as platinum or gold, to prevent the field emission of electrons from such cup. The method of applying the non-emitting coating is preferably sputtering or ion plating, but may also be electroplating followed by vacuum fusion in the case of gold or other low melting point metals.

Method and apparatus for carrying out continuous thick chrome plating of bar, wire and tube, both externally and internally

Abstract: A method and apparatus for bar electroplating including continuously supplying a plurality of bars successively; cleaning the surface of the bars to be plated; heating the bars up to a plating temperature and accomplishing the bar plating operation by feeding the bars along a straight path through an electrode immersed in an electroplating tank.

Coated plating rack

Abstract: A rack for supporting electrically non-conductive articles during the successive chemical or electroless plating and electroplating of such articles has its metal frame covered with a plastic resin coating in which there is dispersed one or more organosulphur compounds so that plating material will not adhere to the rack during the chemical or electroless plating of articles supported thereby nor during the subsequent further electroplating of such articles.

Electrodeposition of wear resistant and oil retentive nickel coatings and article having such a coating

Abstract: A method for providing wear resistance and an oil retention in the surface of a workpiece by means of electroplating the workpiece in a nickel plating bath to form a layer of porous nickel on the surface of the workpiece. To this end, the nickel plating bath contains one or a mixture of powdered ceramic materials in an amount within the range of from 50 to 500 grams per liter of the plating bath and a surface active agent selected from non-ionic ethers of polyethylene glycol such as polypropylene glycol polyethylene glycol ether and secondary alcoholic ethoxylate, in an amount within the range of from 0.5 to 5.0 percent by weight based on the total amount of the plating bath.

Zinc plating process and electrolytes therefor

Abstract: This invention relates to a method of producing bright zinc electrodeposits over a wide current density range, free of ''''spores'''' and/or striations, which comprises passing current from an anode to a metal cathode for a time period sufficient to deposit a bright zinc electrodeposit upon said cathode; the current passing through an aqueous bath composition containing at least one zinc compound providing zinc ions for electroplating zinc, A. AT LEAST ONE BATH SOLUBLE SURFACTANT SELECTED FROM THE GROUP CONSISTING OF BATH SOLUBLE POLYETHERS, SUBSTITUTED POLYETHERS, AND SUBSTITUTED NON-AROMATIC NITROGEN HETEROCYCLIC SURFACTANTS, AND B. AT LEAST ONE AROMATIC, NON-CARBONYL CONTAINING NITROGEN HETEROCYCLIC COMPOUND.

Electrodeposition of rhodium

Abstract: A technique is described for electroplating rhodium utilizing a soluble rhodium anode. The technique involves maintaining a constant rhodium concentration in the electrolyte by continuous dissolution of a rhodium anode, such dissolution being effected by imposing a pulsed signal on the anode.

Method for electroplating

Abstract: Zinc die castings are treated with an aqueous solution of an organophosphorus chelating agent prior to immersion in the electroplating bath in order to inhibit immersion plating of Cu II from cyanide-free copper plating electrolytes.

Electroplating solutions for depositing silver alloys and a method of forming silver alloys by electroplating

Abstract: An iodide-containing electroplating solution for depositing alloys of silver with another metal such as copper, indium, zinc or mixtures thereof. The solution comprises a silver salt, an iodide and a salt of one or more of the above metals.

Process for stripping nickel from articles and composition utilized therein

Abstract: The present invention is directed to the chemical removal of adherent nickel deposits on plating racks and the like employing a composition which contains therein nitric acid and sources of chloride, copper and tellurium or selenium ions and to a process for stripping such unwanted deposits from electroplating apparatus without noticeable damage to the base metal and at speeds not normally obtainable with prior art compositions and methods.

Method for the uniform electroplating of sheet and strip

Abstract: In the continuous electroplating of sheet and strip, heavy edge build up is avoided by the use of a new anode design. Proper anode design is achieved by (1) determining the coating weight profile produced by a rectangular anode of full pass width and (2) shaping the anode by tapering a portion of the sides thereof to a width approximately equal to the predetermined width of uniform plating.

Electrodeposition of Coherent Boron

Abstract: Pure coherent boron has been electrodeposited from a fused fluoride mixture. A eutectic mixture of and KF is used as the electrolyte, with BF3 gas dissolved to form the tetrafluoborate ion which reacts at the cathode to produce boron. The boron as plated is of 95% or better purity, and is homogeneous and uncracked, up to 25 mils thickness. The substrates plated include steel, copper, graphite, tungsten, and molybdenum. Temperatures of plating range from 600° to 700°C, with plating rates up to 6 mils/hr.

Process for electroplating an aluminum wire

Abstract: Aluminum wire, of either pure aluminum or an aluminum alloy, is plated with a firm layer of at least one of nickel, copper, tin, zinc, or cadmum by treating the wire with an aqueous solution of hydrofluoric and hydrochloric acids and then electroplating the wire with the metal. The electrolyte is a solution of a fluoroborate or sulfamate salt of the metal. The aluminum wire so plated possesses superior conductivity and may be readily soldered.

Methods of electroplating zinc and cyanide free or low cyanide zinc plating baths therefor

Abstract: Cyanide-free or low cyanide alkaline zinc plating solutions containing a soluble silicate and a process of plating bright zinc from cyanide-free or low cyanide containing alkaline zinc plating solutions containing a soluble silicate.

Method of electroplating tubing prior to terne alloy coating

Abstract: Ferrous metal is provided with a corrosion resistant coating having a surprisingly great ability to retard the formation of rust when subjected to salt spray testing. Successive thin layers of copper and nickel are electroplated on steel tubing after which the tubing is terne coated by hot immersion. The corrosion resistance which is achieved by this combination of layers greatly exceeds the sum of the corrosion resistance of each layer when used alone.

Acid zinc-electroplating process and product thereof

Abstract: A LAYER OF ZINC IS FORMED ON STEEL PLATES BY ELECTROLYSIS FROM AN ACID-ZINC ELECTROPLATING BATH CONTAINING 0.05 TO 0.3 G./L, OF CR+6IONS. THE PLATED STEEL IS CHARACTERIZED BY EXCELLENT CORROSION RESISTANCE, AND PROVIDED EXCELLENT ADHESION TO ORDINARY PAINTS. IN A SECOND EMBODIMENT OF THIS INVENTION, THE STEEL MAY HAVE AN INITIAL PLATE OF ZINC IN A THICKNESS OF AT LAST 1X10**3U PRIOR TO SAID ELECTROLYSIS TREATMENT.

Gold alloy electroplating bath

Abstract: An improved bath for the electrolytic deposition of gold or gold alloys on electrically conductive objects contains an alkali metal gold sulfite, a gold alloy metal, an electrically conductive salt, a chelating agent, a water soluble salt of cadmium, a water soluble salt of copper, a water soluble salt of nickel, and a specified organic phosphorus compound. The bath is useful for depositing white gold on conductive objects.

Surface treatment of tinplate for improving sulfur resistance

Abstract: Surface treatment of tin-plated steel for food can and the like for improving sulfur resistance, by applying chromate treatment on the plated tin, immediately after electroplating thereof, in an aqueous solution containing 6-valent chromium ions, and then heating at a temperature above 100 DEG C.

Density control for electroplatable polymer compositions

Abstract: A plastic composition especially suitable for use in barrel electroplating processes is prepared by incorporating in the plastic a siliceous filler and a heavy filler such as barium sulfate or zinc oxide in amounts such that the density of the molded composition is greater than the density of the plating bath.

Non-cyanide zinc plating

Abstract: A non-cyanide zinc electroplating bath which contains a linear polyether and a bath soluble heterocyclic nitrogen compound to improve the quality of the zinc electrodeposits obtained Additionally, the electroplating baths may also contain an organic chelating agent With this bath, zinc electrodeposits having improved brightness and leveling are produced even from baths having a relatively low zinc content, over a relatively wide pH and current density range These baths have further been found to be useful in both barrel and rack plating processes

Electroplating gold alloys and electrolytes therefor

Abstract: Disclosed is an electrolyte for the deposition of predominantly gold alloy deposits, a method for the preparation and use of the electrolyte, and an article obtained by such electrodeposition. These electrolytes contain soluble gold and base metal salts, a buffer system effective at pH 4-6, and either a soluble aluminum compound or formate or oxalate ions. Preferably, the electrolyte contains both the aluminum and formate or oxalate ions.

Bright gold electroplating bath and method of electroplating bright gold

Abstract: A bright gold electroplating bath comprising: an aqueous solution of an alkali metal gold cyanide; as an alloying agent, cobalt or nickel, in the form of a complex with at least aminoguanidine and a chelating phosphonic acid; and as conducting and buffering agents, one or more bath soluble phosphates.