Showing papers on "Electroplating published in 1976"

Method for evaluating the quality of electroplating baths

Abstract: A working electrode is swept through a voltammetric cycle, including a metal plating range and a metal stripping range, for at least two baths of known plating quality and a bath whose quality is to be evaluated. The current utilized during the metal stripping range is correlated to the quality of the baths of known quality. The current utilized to strip the metal in the bath of unknown quality is compared to the correlation and its quality evaluated. In a preferred embodiment, an inert working electrode is swept by a function generator through the voltammetric cycle. A counter electrode immersed in the plating bath is coupled in series with the function generator and a coulometer to measure the charge during the metal stripping portion of the cycle.

Nickel-iron (80:20) alloy thin film electroplating method and electrochemical treatment and plating apparatus

Abstract: A thin film of low magnetostriction Permalloy 80% nickel - 20% iron ± 1% is electroplated in a bath having a ratio of about 18:1 to 24:1 g/liter ratio of Ni to Fe ions with a plating current density from 10 ma/cm 2 - 200 ma/cm 2 when plating in sheet form or an Ni/Fe ratio of 25:1 to 85:1 with a current density of 2 ma/cm 2 - 110 ma/cm 2 when plating through a mask The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing Fresh solution is added to the bath from a reservoir where the above adjustments are made The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber Complexing agents are avoided High speed plating is obtained with about 244 g/l of Ni ++ , 105 g/l of Fe ++ , 25 g/l of H 3 BO 3 , 02 g/l of Na saccharin and a pH of 15 to 36

Composite and method for making thin copper foil

Abstract: The improved method of the invention comprises disposing a chromium oxide release layer on the surface of a thin inexpensive metal carrier, such as foil, depositing copper on the release layer to form a thin copper foil, and readily peeling the thus-formed copper foil from the release layer on the carrier. The release layer can be formed in situ from chromium metal electroplated on the carrier. The freshly prepared release layer contains numerous small sites on which electroplating of the copper can be easily carried out to produce pore-free copper foil. The method, which employs the carrier-release layer composite of the invention, is inexpensive and efficient, since readily available, inexpensive metal carriers can be used and no complicated copper foil-carrier separation steps need be resorted to. Moreover, it can increase the bondability of the thin copper foil thus produced to plastic during lamination thereof.

Process in the production of a multilayer printed board

Abstract: In a process for the production of a multilayer printed board built up by starting from a desired number of insulating bases clad on both sides with an unpatterned metal layer, the improvement consisting in that the metal layers, whereout conductive patterns are to be etched and which layers are to be hidden inside the finished multilayer printed board, are coated with a plating resist in the shape of a negative of the desired conductive pattern, that the remaining visible parts of the metal layers, which are to form the conductive patterns, are coated by electroplating with a thin, rough, adhesion-promoting metal layer comprising copper, zinc, nickel, tin or any one of their alloys, that an etch resist layer of nickel, tin or any one of their alloys is electroplated on top of the adhesion-promoting layer, if the latter consists of copper, zinc or any one of their alloys, that the negative plating resist is removed, that the parts of the metal layers thus uncovered are etched away and that the insulating bases provided with conductive patterns are laminated to a multilayer printed board.

Methods for making transistor structures

Abstract: In one embodiment, an extremely short channel FET is made by forming a metal layer over a wafer, depositing silicon dioxide over part of the metal layer, oxidizing the exposed metal, controllably etching a portion of the silicon dioxide to expose a small strip of the nonoxidized metal layer, electroplating the exposed metal strip, thereby to form an extremely narrow gate electrode, removing the deposited SiO 2 , the metal oxide and the remaining metal layer to leave only the gate electrode, and using the gate electrode as a mask for ion implanting source and drain regions. Since the gate electrode can be made so narrow, the channel region is correspondingly short to give extremely high frequency capabilities. Other embodiments are also described.

Method of selectively electroplating an area of a surface

Abstract: A method of selectively plating an area of a substrate surface is disclosed. The method comprises contact masking at least one charged anode, spaced from the surface, with a dielectric member which is maintained between the anode and the surface, along their corresponding opposed surface areas, out of contact with the surface. The surface is cathodically charged. The masked anode is contacted with a stream of an electroplating electrolyte. The stream of electrolyte then contacts at least a portion of the charged surface, including the area to be plated, to fully flow electrolyte thereover to selectively electroplate the area.

Qualitative observations on the diffusion of copper and gold through a nickel barrier

Abstract: To retard failure of gold plated copper parts by diffusion of copper to the gold surface, a layer of nickel is frequently used between the copper and gold as a diffusion barrier. To evaluate the mechanisms whereby the nickel retards the motion of copper atoms to the gold surface, planar tri-couples of Cu/Ni/Au were prepared by electroplating nickel and gold layers on OFHC copper coupons. Diffusion anneals were carried out at temperatures from 150 to 750°C. A qualitative evaluation of diffusion behavior was provided by an electron microprobe utilizing X-ray wavelength dispersive analysis on polished cross sections. Results demonstrate that the nickel layer retards but does not block the transport of copper to the gold surface. Possible mechanisms for the anomalous buildup of copper at the gold/nickel interface and gold at the copper/nickel interface are discussed.

Electroplating aluminum stock

Abstract: A process for the production of electroplated aluminium stock, such as strip or wire, comprises passing the stock continuously through a bath having a high dissolving power for aluminium oxide, such as strong aqueous sulphuric acid and phosphoric acid and subsequently through an electroplating bath, the first bath having a cathode electrode and the electroplating bath having an anode electrode so that the stock is anodic in the first bath. The stock may pass through one or more intermediate non-electrolytic treatment stages, such as immersion tinning or zincating. It may also pass through one or more electrolytic pretreatment stages during its passage between the first bath and the electroplating bath. In such pretreatment stages, such as the application of a bronze strike, there may be an anode electrode at the same potential as the anode in the electroplating bath.

Plating baths for depositing cobalt-lead nickel-lead alloys or combinations thereof and method of coating aluminum articles therewith

Abstract: A method of plating cobalt-lead or nickel-lead alloys upon aluminum base articles. The plating baths comprise salts of the plating metals and have a pH of from 7-12. Both electroless and electroplating bath compositions are disclosed.

Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys

Abstract: A non-cyanide silver and silver-alloy electroplating bath composed of silver salts with imides of organic dicarboxylic acids which form a useful complex. Alloy deposits of silver with up to 5 percent of Copper, Cadmium, Gold, Antimony, Palladium and similar related metals can be prepared.

Electrolytic process employing electrodes having coatings which comprise platinum

Abstract: A method of carrying out an electrolytic process utilizing an electrode formed of a film-forming metal having applied thereto coatings of a precious metal compound capable of decomposing upon heating, said compound being decomposed by heating, and a further layer of precious metal electroplated on to said fired compound layer.

Method, electrolyte and additive for electroplating a cobalt brightened gold alloy

Abstract: Disclosed are methods and electrolytes for the electrodeposition of a gold alloy containing 0.05 to 0.4 per cent by weight of cobalt. The electrolytes comprise aqueous acidic solutions containing nitrilotriacetic acid.

Non-cyanide acidic silver electroplating bath and additive therefore

Abstract: A non-cyanide acidic silver electroplating bath contains a soluble silver salt, a thiosulfate, a bisulfite buffer and a sulfate.

Apparatus for electroplating metal surfaces, in particular cut edges formed by stacking sheet metal panels cut to size

Abstract: A substantially sealed electrolyte container is provided for electroplating articles, and an evacuating means is provided for evacuating the space above the electrolyte surface in the electrolyte container. The article to be electroplated forms the anode or cathode electrode. The electrolyte container is subdivided by porous partitions, which do not disturb the electrical field of force, into cathode and anode chambers, and separate gas extraction means are provided for said chambers. Beneath the electrolyte level in the cathode and anode chambers electrolyte extraction and supply means are provided by means of which the electrolyte is extracted, degassed and returned to the cathode and anode chambers.

Capacitor including an electroplated layer thereover

Abstract: A solid electrolyte film-forming capacitor is provided which includes an electroplated conductive layer over the capacitor. The electroplated layer provides greater resistance to mechanical shock and allows the welding of a cathode termination means to the electroplated layer of the capactior. Also provided is a method for electroplating the capacitor which includes placing an electroprocessed capacitor in an electroplating vessel which contains a plating source and electroplating solution, providing a voltage source and connecting the positive terminal of the voltage source to the anode side of the capacitor and to the plating source and the negative terminal of the voltage source to a conducting layer on the anode body, and then electroplating a layer containing metal over the capacitor.

Ceramic capacitor with nickel-solder electrodes

Abstract: A tubular ceramic body has formed thereon inner and outer electrodes each comprising a nickel layer in direct contact with the ceramic body and a solder layer overlying the nickel layer. Of tin-lead composition, the solder layer is intended to make leads or the like readily solderable to the electrodes. According to the manufacturing process of the capacitor, the nickel layer is formed by electroless plating, and the solder layer by electroplating.

The Anodic Behaviour of Nickel in Nickel Sulphamate Electroplating Solutions

Abstract: This paper describes some aspects of the anodic behaviour of non-activated and sulphur-activated nickel in nickel sulphamate solutions and relates these to the performance of these materials in com...

Method of making a thin-copper foil-carrier composite

Abstract: The present invention is directed to an improved method of making a thin copper foil preferably about 0.5 oz. per sq. ft. or less in weight, and carrier composite by forming, as by electroplating, the thin foil on a metallic surface such as a plating belt, then contacting the exposed side of the thin foil, while it is still on that metallic surface, with fusible solid plastic particles, depositing such particles on that exposed side of the foil and coalescing them together by sufficient heat to form them into a unitary plastic sheet, but insufficient to permit the plastic to migrate through any openings in the foil onto the metallic surface. The thus formed copper foil plastic carrier sheet composite is then readily removed from the metallic surface without any damage to the foil and without plastic build-up on the metallic plating surface. The method therefore can be operated efficiently continuously over long periods of time to produce a high quality composite product suitable for a variety of uses.

Method and composition for plating palladium

Abstract: This invention relates to the palladium plating of electrical parts, such as frames, pins, connectors and in general various types of electrical contacts. More particularly, this invention relates to a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added. The method is adapted for rack plating of parts having an irregular shaped configuration as well as those having a uniform configuration.

Process for manufacturing strip lead frames

Abstract: There is disclosed a process for producing strip material useful for making lead frames which includes preparing a ferritic stainless steel substrate as a thin strip and, before subjecting it to finish rolling, electroplating it with a first layer of copper and an outside layer of nickel or tin, after which the strip is precision rolled to final gauge. There is also disclosed the product from this process which is a precision rolled strip having a core of ferritic stainless steel and a continuous surface layer of nickel or tin with an intermediate layer of copper.

Method of regenerating a chromium electroplating bath

Abstract: Trivalent chromium electroplating baths which have developed characteristic faults due to accumulation of trace metal contaminants are treated with just sufficient of a water soluble ferrocyanide to restore the bath to normal working order.

Electroplating baths for nickel and brightener- leveler compositions therefor

Abstract: OF THE DISCLOSURE An aqueous acid nickel electroplating bath containing as a brightener-leveling agent the reaction product of an acetylenic diester of a halogenated saturated aliphatic acid with a het-erocyclic compound containing a tertiary nitrogen atom. -i-

Process for forming a gold-chromium alloy from an electrodeposited gold-chromium surface

Abstract: The invention relates to a process for heat diffusion of an electrodeposited gold layer on a chromium surface by simultaneously depassivating and cathodically gold plating a chromium surface by immersion and electroplating into an acid gold bath solution and diffusing the gold-chromium coating by heat to form a gold-chromium alloy which is abrasion resistant and which has a hardness substantially greater than that of a gold plated coating on a chromium surface which has not been heat diffused.

Bright low karat silver gold electroplating

Abstract: Disclosed is an aqueous electroplating bath and process for obtaining bright deposits of silver-gold alloys. The bath contains a polyakylene imine and an alkylene polyamine.

Nickel electroplating bath for satin finish and method

Abstract: A nickel electroplating emulsion bath for obtaining a satin-finish which comprises an aqueous acidic continuous phase nickel salt solution, an alcohol soluble polyamide resin dispersed therein and a polishing agent and the method for using the bath. The polyamide resin is a member selected from the group consisting of a copolymer of dimer acid and an aliphatic amine, a copolymerized nylon and a modified nylon. The electroplating bath preferably also contains a cationic surface active agent selected from the group consisting of an aliphatic and/or aromatic quaternary ammonium salt and an aliphatic and/or aromatic fluorosulfonylamine quaternary ammonium salt. The use of the electroplating bath provides a means for obtaining a uniform satin-finish nickel plate surface on the material plated.

Electrodes for electrochemical processes - using porous outer layer of filings bonded to the core by electroplating

Abstract: Electrode for ue in electrochemical processes, consist of a core made at least partly of metal and covered at least partially by >=1 surface layer, the core is a porous layer of metal particles, bonded to teh core by metal deposited electrochemically. An inter. layer of metal is pref. employed between the core and the metal particles, and the metal is pref. employed between the core and the metal particles, and the metals pref. consist of Ni, Fe, Co, Ag, a metal of the Pt group, or an alloy of these metals. Metal may be deposited by electroless plating or using external current, and layer is pref. applied by electroplating. The electrodes are used esp. as anodes or cathodes in fuel cells, in electrolysis plants, or for cathodic protection, e.g. as an oxygen electrode in the electrolysis of water.

Method of making metal-plastic laminates

Abstract: An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil while providing at the interface prior to laminating of the foil to the plastic at least a mono molecular film of an organic silicon compound. After laminating the treated metal foil to the substrate under heat and pressure, the foil is chemically stripped from the substrate, leaving a surface of improved receptivity for conventional electroless plating and electroplating procedures, or other metallizing techniques. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment of the interface, especially in respect to adhesive strength at elevated temperature.

Film processing apparatus for the electrolytic recovery of silver

Abstract: Silver is recovered from used film plates by passing them into a solution into which their silver material is dissolved and by electroplating the dissolved silver out of the solution. Electrical circuits are provided to increase the magnitude of a continuous plating current in proportion to the rate of film and silver input and to decrease the current gradually to coincide with the decrease in silver concentration as plating continues.

The Effects of Gold and Nickel Plating Thicknesses on the Strength and Reliability of Thermocompression-Bonded External Leads

Abstract: External leads intended for thermocompression (TC) bonding to Au-metallized thin-film circuits are typically Cu-based alloys plated with Au or a combination of Ni and Au. The objective of this work was an evaluation of the Ni/Au system to determine the optimum plating thicknesses for reliable TC bonding. Also investigated was the minimum Au thickness necessary for TC bonding when the Ni diffusion barrier was omitted. Four criteria were evaluated: initial bondability; bond strength after accelerated aging; susceptibility to cracking in a 90° bend test; and fatigue behavior. The test vehicle was a 32-lead dual-in-line package utilizing alumina substrates metallized with Ti/Pd/Au films and Cu lead frames (CDA 102 and 110) electroplated with Ni and Au in the ranges of 0 - 41 µm and 0.4 - 20 µm, respectively (0 - 1630 and 15 - µin, respectively). Optimum strength and reliability with the Ni/Au system were obtained for a Ni plating thickness of 0.25 - 1.3 µm (10 -50 µin) and a minimum Au plating thickness of 2.5 µm (100 µin). For the special case of zero Ni thickness, acceptable TC bonds were obtained with as little as 0.6 µm (25 µin) of Au.

Holding device for small parts to be electroplated

Abstract: The holding device is formed of an elongated bar with slots to receive a base of the parts to be electroplated and contact strips in the slots to electrically contact the received parts. Resilient electrical contact-making elements are disposed in facing relation to the contact strips to clamp the parts in place and to provide an additional electrical contact. The device also includes a plastic cover over the contact bar and resilient elements to protect the bar and elements. The bar is also provided with a hook at one end for securement to a frame for electroplating.