Showing papers on "Plating published in 1969"

Method of metal coating and electrically heating a subterranean earth formation

Abstract: A method is described for electrically heating a subterranean earth formation by metallizing a portion of the formation and connecting a source of electric energy to the metallized portion. The formation may be metallized by electroless metal plating and/or by introducing liquid metal. An amount of electric current sufficient to produce heat is flowed through the metallized portion of the formation. Fluid may be injected while the current is being applied. (10 claims)

Metal ion recovery system

Abstract: A metal ion recovery system first removes most of the plating solution from recently plated articles in a relatively concentrated form and removes the remainder of the solution in much less concentrated form. These solutions are treated separately with only the lower concentrated solution being completely deionized to remove said metal ions therefrom.

Electroplating a ductile zinc-nickel alloy onto strip steel

Abstract: A METHOD OF ELECTROPLATING A NICKEL-ZINC ALLOY ON A STEEL STRIP IS DESCRIBED, IN WHICH THE PLATING BATH IS MAINTAINED WITHIN A SELECTED PH RANGE, THROUGH USE OF A PRESELECTED RATIO OF NICKEL TO ZINC IN THE BATH, AND A PRESELECTED PLATING CURRENT DENSITY, WHEREBY AN ELECTROPLATED COATING IS FORMED HAVING A NICKEL CONTENT OF FROM 9.5 TO 12.5%, WHICH COATING HAS A LOW INTERNAL STRESS, AND INCREASED RESISTANCE TO CORROSION.

Method of making metal-plated plastic articles

Abstract: A platable plastic component and a nonplatable plastic component are joined together into a multicomponent article. The entire multicomponent article is then processed in an operation for plating plastics having the steps of introducing the multicomponent article into a strong oxidizing acid solution, followed by introducing the article into a noble metal solution, then introducing the article into an electroless nickel or copper bath, and finally further processing the article in conventional plating baths.

Process for hydrocarbon soluble metal salts

Abstract: HYDROCARBON-SOLUBLE ORGANIC METAL SALTS OF MOLYBDENUM, TUNGSTEN AND VANDAIUM ARE PREPARD BY REACTING THE INORGANIC METAL OXIDE OR ACID OF MOLYBDENUM, TUNGSTEN OR VANADIUM WITH A LIQUID ALKOXYACETIC ACID TO FORM AN ORGANIC-SOLUBLE INTERMEDIATE AND THEN REACTING THE INTERMEDIATE WITH A CARBOXYLIC ACID. THE COMPOUNDS PREPARED BY THE PROCESS OF THIS INVENTION ARE USEFUL AS CATALYSTS FOR THE EPOXIDATION OF OLEFINS, AS LUBRICANT ADDITIVES, OR AS METAL PLATING AGENTS.

Codeposition of a metal and fluorocarbon resin particles

Abstract: FINE PARTICLES OF FLUOROCARBON RESINS SUCH AS TEFLON PARTICLES CAN BE READILY CODEPOSITED WITH METALS WHEN THEY ARE DISPERSED IN AQUEOUS PLATING BATHS, WHEN THERE IS ALSO PRECENT IN THE BATHS A FLUOROCARBON SURFACTANT SUCH AS PERFLUORO N-OCTANOIC ACID, PERFLUORO N-OCTYL SULFONIC ACID, PERFLUORO P-ETHYL CYCLOHEXYL SULFONIC ACID, OR THEIR SALTS. SUCH 2-PHASE COMPOSITE PLATES HAVE GOOD ANTI-SEIZING AND ANTI-FRICTION PROPERTIES.

Monolithic electric wave filters

Abstract: A crystal wafer supports two or more pairs of opposing electrodes to form a monolithic crystal filter. The wafer material has a high piezoelectric coupling coefficient. Inharmonic oscillations are suppressed by plating the electrodes on the surfaces of recesses in the faces of the wafer.

Mechanism of Bonding Electroless Metal to Organic Substrates

Abstract: The use of electroless metal bonded organic substrates has many possible applications. The present state‐of‐the‐art is limited to a few organic substrates. Initial studies included the mechanism of bonding electroless copper to acrylonitrile‐butadiene‐styrene and to polysulfone. This was investigated by using a scanning electron microscope to view the interfacial surfaces of substrates subsequent to chemical processing and electroless and electrolytic plating. The examination revealed that interlocking surfaces were present which permitted mechanical interaction at the copper‐organic interface. When these surfaces were replicated on epoxy, bonding between this surface and electroless copper was obtained.

Electroplating solder-bump connectors on microcircuits

Abstract: A silicon wafer containing 100 to 300 microcircuits is coated with a patterned layer of glass and then a conducting layer of chromium and copper which connects, through openings in the glass, to circuit terminals and also to the silicon substrate at the scribe positions. A patterned photoresist then exposes only the terminal areas. An electroplating connection to the silicon substrate provides uniform, low-resistance current paths through the metallization at the scribe positions to the plating sites over the terminal positions for the electrodeposition of soldier.

Metal plating of thermoplastics

Abstract: A method of electrolessly plating a thermoplastic substrate with a metal, such as copper, nickel or cobalt, prior to application of an electrolytically deposited metal A novel surface treatment step which includes an improved neutralizer for the conventional chrome-containing chemical etch, is effective in promoting electroless metal coverage and the adhesion between the electroless metal layer and the substrate

Manufacture of magnetic particles by electrodeposition of iron,cobalt,or nickel in dialkyl sulfoxide

Abstract: The invention relates to the preparation of fine ferromagnetic particles by electrodeposition of iron, nickel, cobalt, or mixtures of these metals, in a dialkyl sulfoxide bath, such as dimethyl sulfoxide, the particles produced at the electrode being removed at desired intervals. Heat-stable organic binders may be dissolved in the plating bath during electrodeposition to coat the formed particles and thereby inhibit surface oxidation and agglomeration. The particles are oblong in shape and, coated or uncoated, are especially useful for magnetic recording media, magnetic cores, magnetically responsive fluid suspensions and permanent magnets.

Method for the production of abrasive brushing elements

Abstract: An abrasive brushing element such as a wire bristle, a strip or a plate having the tip and a substantial portion thereof clad with a layer of a metal such as nickel, wherein is bound a layer or more of very fine abrasive powder, such as tungsten carbide. The article is produce by crushing a material of high hardness to a very fine particle size and imparting an electrostatic charge at the surface thereof. The fine particles are then caused to electrostatically adhere at the tip and along a substantial portion of the brushing element while metal plating, preferably with nickel at least that portion of the brushing element.

Method of conditioning aluminous surfaces for the reception of electroless nickel plating

Abstract: ALUMINUM AND ALUMINUM ALLOYS ARE SUBJECTED TO A PREPLATING TREATMENT WHICH CONDITIONS THE SURFACES OF THESE METALS FOR RECEIVING ELECTROLESSLY DEPOSITED NICKEL PLATING DIRECTLY THEREON. A CLEAN ALUMINOUS SURFACE IS PREPARED FOR ELECTROLESS PLATING BY ETCHING IN AN ALKALINE SOLUTION AND THEN PICKLING IN AN ACIDIC SOLUTION CONTAINING CHLORIDE IONS. AN ALKALINE SOLUTION CONTAINING HYPOPHOSPHITE IONS IS EMPLOYED TO ACTIVATE THE ALUMINOUS SURFACE WHICH IS THEN PROVIDED WITH A THIN ELECTROLESS NICKEL STRIKE COAT BY IMMERSION IN AN AMMONICAL SOLUTION CONTAINING NICKEL IONS, HYPOPHOSPHITE IONS, AND A CHELATING AGENT. AFTER THE ELCTROLESS STRIKE COAT IS APPLIED, THE ALUMINOUS SURFACE IS PROVIDED WITH A PLATING OF ELECTRLESS NICKEL IN A CONVENTIONAL, ESSENTALLY HALOGEN-FREE BATH.

Method of making multilayer printed circuits

Abstract: INCLUDE A VINYL PHENOLIC GLASS CLOTH LAYER WHICH IS LAMINATED ON ONE SIDE. ALSO DURING THE PROCESS AN ACRYLIC RESIN PROTECTIVE COATING IS APPLIED WHICH TOGETHER WITH THE VINYL PHENOLIC LAYER, PROVIDES SELECTIVELY REMOVABLE MASKS WHICH FACILITATE REMOVAL OF ELECTROLESS SURFACE PLATING ON EXPOSED CIRCUIT FACES AND DRILLING HOLES THROUGH THE BOARDS. THEREAFTER, PLATED CONNECTIONS ARE PROVIDED VIA THE HOLES BETWEEN THE CIRCUITS ON THE BOARDS. IMPROVED METHODS OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARDS ARE DESCRIBED WHEREIN AT LEAST ONE EXPOSED CIRCUIT FACE IS PREFABRICATED BEFORE THE BOARDS ARE LAMINATED TOGETHER BY MEANS OF A NON-FLOWING "B" STAGE EPOXY GLASS SHEETS AND IN A FIXTURE HAVING FLOWABLE MATERIAL CONFINED ON OPPOSITE SIDES OF THE PACKAGE (VIZ THE LAYERS TO BE LAMINATED), THEREBY PERMITTING THE USE OF SUCH NONFLOWING MATERIAL WHICH REDUCES SHRINKAGE, IMPROVES LAMINATION QUALITY, MAINTAINS REGISTRATION AMONG THE BOARDS, AND SIMPLIFIES FIXTURING. THE LAMINATION PACKAGES MAY ALSO

Tin plating bath and method

Abstract: An aqueous bath for electroplating tin upon various conductive substrates contains stannous ion, sulfate radical, an imidazoline derivative, a carbinamine compound, and a cyclic aldehyde or ketone brightener. The bath is highly acid and is operable to produce dense, smooth, bright, adherent deposits, particularly at relatively high current densities. These deposits exhibit excellent solderability as plated and after prolonged aging. In addition, the bath avoids step plating when holes are present in the workpiece, and it minimizes the tendency for pitting to occur in the deposit.

The Effect of Brightener Additions on the Relation between Porosity and Plating Conditions for Gold Electrodeposits

Abstract: SummaryA detailed study has been made of the effect of additions of nickel ions to an acid citrate gold bath, and of sulphated castor oil to an alkaline bath with free cyanide on the porosity of gold deposited from the baths. As most of the bath operating conditions have themselves a marked influence on porosity, the effects of the brighteners were studied in terms of the modification they made to the relations between porosity and other bath factors. It was generally found that under most conditions deposits from the bright baths were less porous than those from the same bath without the brightener, but operated under identical conditions. There were a few exceptions to this rule.

Automatic process and apparatus for uniform electroplating within porous structures

Abstract: An automatic process for uniformly electroplating the internal surfaces of conducting porous structures. The method is particularly suitable for the electrodeposition of a catalytic material within a fuel cell electrode. A potential pulse travels through the porous structure upon the initial application of a plating potential to the structure causing local depletion of the ions in solution within the pores of the structure. Exhaustion of ions is sensed causing cessation of the applied potential while scheduling a flow of fresh plating solution through the electrode. Replenishment of ions triggers a new plating cycle.

Bath and process for chemical metal plating

Abstract: A BATH FOR PLATING A MATERIAL WITH A TRANSITION METAL SELECTED FROM THE CLASS CONSISTING OF NICKEL, COBALT, IRON AND CHROMIUM BY CHEMICAL DEPOSITION WHICHOMPRISES AN AQUEOUS SOLUTION OF A COORDINATION COMPOUND OF THE TRANSITION METAL WITH A SATURATED SHORT CHAIN CARBOXYLIC ACID HAVING 1-CARBON ATOMS AND THE HYDROXY DERIVATIVES OF THE ACID, A LIGAND COMPLEXING AGENT SELECTED FROM THE GROUP OF PYROPHOSPHORIC ACID, ASCORBIC ACID, ERYTHORBIC ACID, THE WATER-SOLUBLE SALTS THEREOF AND THEIR MIXTURES, AND A TRANSITION METAL REDUCING AGENT. THE BATH HAS A PH RANGING FROM 1-14 AND CONTAINS LESS THAN ABOUT 3400 P.P.M. OF CHLORIDE AND/OR SULFATE ANIONS. WHEN THE MATERIAL BEING PLATED IS BISMUTH, CADMIUM, TIN, LEAD OR ZINC, THE BATH CONTAINS LESS THAN 1000 P.P.M. OF THESE ANIONS.

Stannous solutions containing hydroxy carboxylic acid ions their preparation and their use in plating tin on conductive surfaces particularly on aluminum

Abstract: SOLUTIONS OF SIMPLE OR COMPLEX SALTS OF TIN AND GLUCONIC ACID OR SIMILAR POLYHYDROXY CARBOXYLIC ALIPHATIC ACID, MADE NEUTRAL OR NEARLY SO BY ADDITION OF A NONMETAL BASE SUCH AS AMMONIUM HYDROXIDE, ARE USEFUL IN FORMING A DENSE, ADHERENT TIN PLATE ON CONDUCTIVE SURFACES. THEY ARE PARTICULARLY USEFUL IN PLATING TIN METAL ON ALUMINUM OR ALUMINUM ALLOYS.

Method for electroplating gold

Abstract: In an improved gold plating process the alkali metal concentration in the bath is maintained substantially constant during the plating operation by contacting the plating bath with an ammoniated cation exchange resin to replace alkali metal ions with ammonium ions and operating the ion exchanged plating bath at 60 DEG -90 DEG C. This process is particularly applicable when heavy coatings are desired, for example, in electroforming processes.

Metal plating of substrates

Abstract: Substrates are plated with metals by subjecting the substrate to low oxidation state phosphorus compounds, usually in a solvent, followed by subjecting the treated substrate to a metal salt or complex thereof. The low oxidation state phosphorus compounds, wherein the phosphorus has an oxidation state of less than 5, i.e., an oxidation number of -3 to +3, can be prepared by reacting elemental phosphorus, preferably elemental white phosphorus (which include various impure or commercial grades sometimes referred to as yellow phosphorus), with a nucleophilic reagent or organometallic compound. The resulting treated substrate is electroless metal plated and/or electroplated to provide an adherently bound metal layer on the substrate. In one embodiment, the substrate is subjected to a low oxidation state phosphorus compound and thereafter electroless metal plated.

Nonaqueous electroplating solutions and processing

Abstract: Nonaqueous electroplating solutions containing dimethyl sulfoxide and a plating metal salt, a process for electroplating using these solutions wherein the solution is heated to a temperature between about 160* and 200* F. and a modified process for selectively electroplating as a composite coating more than one material at separate plating rates.

Electroless plating solution and process

Abstract: A process and solution for electroless plating of articles with a highly-stabilized electroless plating solution while maintaining high plating rates. An article having a catalytic noble metal on its surface is first electrolessly plated with a thin coating of metal plating, and is further electrolessly plated in a solution having an inhibitor concentration which prevents plating on an article having the catalytic noble metal on its surface but does not prevent plating on an article having the thin coating of plating metal.

Electroless copper plating

Abstract: COPPER SURFACES ARE PLATED IN A PROCESS COMPRISING ETCHING, ACTIVATING, ELECTROLESS AND/OR ELECTROLYTIC COPPER DEPOSITION, AND HEATING OR BAKING AT A TEMPERATURE OF ABOUT 150* TO ABOUT 450*F. FOR ABOUT 10 MIN. TO ABOUT 2 HOURS OR MORE. SUBSTANTIAL IMPROVEMENT IN THE ADHESION BETWEEN THE COOPER SURFACE AND THE METAL DEPOSITED BY ELECTROLESS AND/OR ELECTROLYTIC PLATING IS ACHIEVED. PROCESSES FOR PLATING ON COPPER-CLAD PLASTIC SUBSTRATES AND FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS ARE ALSO SET FORTH.

Electrodeposition of metallic boride coatings

Abstract: TITANIUM DIBORIDE IS ELECTROPLATED ON CONDUCTIVE SUBSTRATES FROM A FUSED, BORATE-TYPE BATH. USE OF A TITANIUM DIBORIDE ANODE ALLOWS INCREASED PLATING RATES, ENHANCES BATH STABILITY AND DECREASES BATH CONDITIONING TIME COMPARED TO USE OF A TITANIUM METAL ANODE.

Force-applying tools

Abstract: Force-applying hand tools, such as wrench sockets, are disclosed produced by powder metallurgy. The working portion of the tool comprises a porous sintered body of heat treatable steel composition of high strength having an average density of at least 85 percent of true density and having an adherent plating of a protective metal coating on the surface thereof.

Continuous plating method

Abstract: A method of continuously plating aluminum wire or strip stock. The stock passes through an alkaline etch bath, an acid oxidizing bath, a conditioner bath containing tin, and a bronze-plating bath in which bronze is plated on the aluminum. The conditions of concentration, temperature, and solution movement are all controlled so as to achieve continuous plating of bronze while feeding the stock at a relatively high speed. Following the bronze plating, further plating and/or drawing steps may be carried out.

Electrolytic codeposition of fine particles with copper

Abstract: FINE PARTICLES OF MANY NON-CONDUCTING MATERIALS DO NOT CODEPOSIT READILY FROM AQUEOUS ACIDIC COPPER ELECTROPLATING BATHS, UNLESS THERE IS PRESENT IN THE BATH ALIPHATIC AMINES, ESPECIALLY POLYAMINES OR IMINES, OR AMINO ACIDS SUCH AS ALANINE OR EDTA. THESE AMINO COMPOUNDS ARE ESPECIALLY EFFECTIVE IN ACID COPPER SULFATE PLATING BATHS FOR THE CODEPOSITION OF DISPERSED FINE, BATH-INSOLUBLE, NONCONDUCTING PARTICLES. THESE 2-PHASE COMPOSITE COPPER PLATES HAVE ENGINEERING USE POSSIBLITIES FOR ANTI-FRICTION AND ANTI-SEIZING PROBLEMS.