Showing papers on "Substrate (printing) published in 2000"

Packaging of integrated circuits and vertical integration

Abstract: A first level packaging wafer (110) is made of a semiconductor or insulating material. The bumps (150B) on the wafer (110) are made using vertical integration technology, without solder or electroplating. More particularly, vias (160) are etched part way into a first surface of the substrate (140). Metal (150) is deposited into the vias (160). Then the substrate (140) is blanket-etched from the back side (110B) until the metal (150) is exposed and protrudes from the vias (160) to form suitable bumps (150B). Dicing methods and vertical integration methods are also provided. Solder or electroplating are used in some embodiments.

Exposure method and apparatus

Abstract: An apparatus for exposing a pattern, formed on a mask, on each of a plurality of partitioned areas on a photosensitive substrate by a step-and-repeat scheme includes a projection optical system for projecting the pattern of the mask on the photosensitive substrate, a substrate stage for holding the photosensitive substrate and two-dimensionally moving the photosensitive substrate within a plane perpendicular to the optical axis of the projection optical system, a detection unit for projecting a pattern image having a predetermined shape on the photosensitive substrate and photoelectrically detecting light reflected by the photosensitive substrate to detect a position at each of a plurality of points on the photosensitive substrate along the optical axis of the projection optical system, and a measurement unit for, when each of a plurality of measurement points in a partitioned area on which a pattern of the mask is to be exposed next coincides with or approaches the pattern image, detecting an offset amount between an imaging plane of the projection optical system and the next partitioned area along the optical axis during a stepping operation of the substrate stage, wherein the imaging plane and the next partitioned area are relatively moved along the optical axis in accordance with the measured offset amount before the pattern of the mask is exposed on the next partitioned area.

Three dimensional device integration method and integrated device

Abstract: A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a substrate used for thermal spreading, impedance matching or for RF isolation, an antenna, and a matching network comprised of passive elements. A second thermal spreading substrate may be bonded to the remaining portion of the semiconductor device. Interconnections may be made through the first or second substrates. The method may also include bonding a plurality of semiconductor devices to an element, and the element may have recesses in which the semiconductor devices are disposed. A conductor array having a plurality of contact structures may be formed on an exposed surface of the semiconductor device, vias may be formed through the semiconductor device to device regions, and interconnection may be formed between said device regions and said contact structures.

Liquid crystal display in which at least one pixel includes both a transmissive region and a reflective region

Abstract: A liquid crystal display device according to the present invention includes a first substrate, a second substrate, and a liquid crystal layer interposed between the first substrate and the second substrate. The first substrate includes: a plurality of gate lines; a plurality of source lines arranged to cross with the plurality of gate lines; a plurality of switching elements disposed in the vicinity of crossings of the plurality of gate lines and the plurality of source lines; and a plurality of pixel electrodes connected to the plurality of switching elements. The second substrate includes a counter electrode. A plurality of pixel regions are defined by the plurality of pixel electrodes, the counter electrode, and the liquid crystal layer interposed between the plurality of pixel electrodes and the counter electrode, and each of the plurality of pixel regions includes a reflection region and a transmission region.

High-density electronic package, and method for making same

Abstract: A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.

Conformal contact and pattern stability of stamps used for soft lithography

Abstract: Patterning in soft lithography techniques such as microcontact printing or light-coupling mask lithography is mediated by surface topographical patterns of elastomeric stamps: intimate contact with the substrate is achieved locally at the protruding areas, whereas a gap remains between the substrate and recessed zones. This principle challenges the properties of the stamp, especially when printing high-resolution or extreme aspect-ratio patterns with high accuracy. On the one hand, the stamp must be soft enough to enable conformal contact with the substrate, which means that it must adapt elastically without leaving voids created by the natural roughness of the substrate. On the other hand, a precise definition of micropatterns requires a rigid material. In this article, we analyze the conditions of elasticity, roughness, and energy of adhesion to establish conformal contact between an elastomer and the target surface. Furthermore, we address questions of replication accuracy and evaluate local elastic deformation induced by normal forces using model calculations for simple pattern geometries. Pressure applied during contact leads to a sagging or collapse of the unsupported areas. We discuss implications on both material and pattern design that allow spontaneous propagation of conformal contact while inhibiting the spreading of collapse.

Method and apparatus for growing thin films

Abstract: The invention relates to a method and apparatus for growing a thin film onto a substrate, in which method a substrate placed in a reaction space (21) is subjected to alternately repeated surface reactions of at least two vapor-phase reactants for the purpose of forming a thin film. According to the method, said reactants are fed in the form of vapor-phase pulses repeatedly and alternately, each reactant separately from its own source, into said reaction space (21), and said vapor-phase reactants are brought to react with the surface of the substrate for the purpose of forming a solid-state thin film compound on said substrate. According to the invention, the gas volume of said reaction space is evacuated by means of a vacuum pump essentially totally between two successive vapor-phase reactant pulses. By virtue of transporting the different starting material species at different times through the apparatus effectively isolates the starting materials from each other thus preventing their premature mutual reactions.

Multi-zone resistance heater

Abstract: A substrate holder for holding a substrate (e.g., a wafer or an LCD panel) during plasma processing. The substrate holder is a stack of processing elements which each perform at least one function. The elements include an electrostatic chuck (102), an He gas distribution system (122), multi-zone heating plates (132), and multi-zone cooling system (152). Each element is designed to match the characteristic of the processing system, e.g., by applying heat based on a heat loss characteristic of the substrate during normal processing. The integrated design allows for precise control of the operating conditions, including, but not limited to, fast heating and fast cooling of a substrate.

Thermal transfer element and process for forming organic electroluminescent devices

Abstract: Disclosed are thermal transfer elements and processes for patterning solvent-coated layers and solvent-susceptible layers onto the same receptor substrate. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor elements can include a substrate, an optional light-to-heat conversion layer, and a single or multicomponent transfer layer that can be imagewise transferred to a receptor to form an organic electroluminescent device, portions thereof, or components therefor. The methods offer advantages over conventional patterning techniques such as photolithography, and make it possible to fabricate new organic electroluminescent device constructions.

Novel chip interconnect and packaging deposition methods and structures

Abstract: The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed layer from a top surface of a substrate and then depositing a conductive material in the cavities of the substrate, where portions of the seed layer remains in the cavities. Another method includes forming an oxide layer on the top surface of the substrate such that the conductive material can be deposited in the cavities without the material being formed on the top surface of the substrate. The present invention also discloses methods for forming multi-level interconnects and the corresponding structures.

Hydrophobic coating including DLC on substrate

Abstract: A substrate is coated with a hydrophobic coating that includes highly tetrahedral amorphous carbon that is a form of diamond-like carbon (DLC). In certain embodiments, the coating is deposited on the substrate in a manner to increase its hydrophobicity (e.g. so that the coating has an initial contact angle θ of at least about 100 degrees; and/or a surface energy of no more than about 20.2 mN/m). In certain embodiments, the coating is deposited in a manner such that it has an average hardness of at least about 10 GPa, more preferably from about 20-80 GPa.

Tamper-resistant wireless article including an antenna

Abstract: A wireless article, such as an identification tag or badge, includes an electronic device mounted on a substrate and connected a loop antenna for receiving and/or transmitting radio frequency signals. Electrically conductive material disposed on the substrate or in holes through the substrate of the wireless article connect the antenna terminals to the electronic device contacts. The structure and materials of the wireless article may be rugged and strong to provide a tamper-resistant article, and/or may include one or more weakened or frangible portions that easily break to provide a tamper-destruct article. The wireless article may be arranged to resist heat, moisture and/or solvents, to function in severe environments such as laundering and industrial processes.

Personal care articles

Abstract: A compliant personal care article, can include: a personal care composition, including i) a surfactant; and ii) from about 3% to about 40%, by weight of the composition, of a water insoluble hygroscopic fiber, fine, or filament; and a first contact substrate adjacent to the composition, wherein the contact substrate is a multiplanar film, includes a surface aberration, and has a surface aberration area of about 45% to about 98%.

Substrate processing method and substrate processing apparatus

Abstract: A developing unit, a coating unit and a plurality of cooling plates are arranged in a process station which performs a resist coating and so on and a wafer is transferred among them by a substrate transfer device. The temperature of an area to where the wafer is transferred is detected by a temperature/humidity detector and the temperature of the wafer which is cooled by the cooling plates is adjusted accordingly based on a detected value so that the temperature of the wafer when transferred to the coating unit becomes a coating temperature of a processing solution. Thereby, the wafer is transferred to the coating unit while maintaining its temperature with high accuracy to be coated with a resist solution, so that a formation of an uneven processing due to the temperature change can be prevented and a uniform processing can be performed.

Radio frequency identification tags and labels

Abstract: Radio frequency identification elements (15), including linerless or lined labels (56), are produced with enhanced effectiveness. The antenna (18) is printed with conductive ink or toner, and cross-over may be provided by spot printing a non-conductive material (21) over a portion of the antenna and then printing a conductive cross-over element (25) on the non-conductive material (21). Typically the antenna (18) is printed on one face (22) of a web (10), and the radio frequency identification chip (30) is moved into contact with the opposite face (27) of the web (10) so that the contacts (31) penetrate the web and engage the antenna so that the web material acts as a dielectric. Alternatively part of the antenna on the first face may be over-printed with a non-conductive material (40) and the chip attached to the first face passing through openings (41) in, or penetrating, the non-conductive material (40) to engage the antenna. A protective substrate (45, 46) or coating is provided on at least one of the chip and antenna, for example by heating heat expandable microspheres, or applying a substrate having hot melt adhesive. The antenna may be printed with a printing media comprising a carrier including resin and wax and containing conductive material in it, and by heating the carrier so that it becomes fluid and is applied as a thick film on the substrate, and by allowing the carrier to cool so as to provide a conductive antenna. The printing may be accomplished at a speed of about 500 feet per minute or more.

Optically variable security devices

Abstract: A security article (10) includes a light transmissive substrate (12) having a first surface and an opposing second surface, with the first surface having an optical interference pattern (14) such as a holographic image pattern or an optical diffraction pattern thereon. A color shifting optical coating (16) is formed on the substrate such as on the interference pattern or on the opposing second surface of the substrate, with the optical coating providing an observable color shift as the angle of incident light or viewing angle changes. Various processes can be utilized to form the security article (10), such as vacuum coating processes, lamination, laser scribing, and laser imaging. The security article (10) can be affixed to a variety of objects through various attachment mechanisms, such as pressure sensitive adhesives or hot stamping processes, to provide for enhanced security measures such as anticounterfeiting.

Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same

Abstract: A semiconductor package of this invention has an insulating substrates, wiring layers disposed on the surface of the insulating substrate, a semiconductor chip disposed in a device hole provided in the insulating substrate, inner-joint-conductors for connecting at least part of the bonding pads on the surface of the semiconductor chip to the corresponding inner-joint-conductors and connection lands connected to the wiring layers. The device hole is provided so that it goes through the center of the insulating substrate. The semiconductor chip is thinner than the insulating substrate. Then, this semiconductor chip is disposed in the device hole such that a bottom thereof is flush with a bottom plane of the insulating substrate. Further, this invention provides a MCM in which plural pieces of the thin semiconductor packages are laminated. In the MCM, the semiconductor packages are laminated such that top and bottom faces of the thin silicon chip are inverted. Predetermined connection lands are electrically connected to each other through a connecting conductor. This MCM has a high mechanical strength in its stacked structure and there is a low possibility that crack may occur in the package due to stress in the bending direction.

Support assembly with thermal expansion compensation

Abstract: A substrate support assembly 30 comprises a substrate support 38 and a collar 130 which may comprise at least one slit 150. The slit allows for thermal expansion compensation in the support assembly 30. The collar 130 may, for example, protect the dielectric 45 from erosion in a process chamber 25. In one version, the collar 130 comprises a clamping ring 200 on the dielectric 45.

Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby

Abstract: This invention discloses a crystalline substrate based device including a crystalline substrate (102) having formed thereon a microstructure (100); and at least one packaging layer (106) which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate (102) and the at least one packaging layer (106). A method of producing a crystalline substrate based device is also disclosed.

Substrate processing apparatus

Abstract: A substrate processing apparatus which includes a substrate retention mechanism having retention rollers, including a plurality of driving rollers, for holding a substrate by abutting the retention rollers against different peripheral edge portions of the substrate, and a rotative driving mechanism for rotating the plurality of driving rollers The plurality of driving rollers preferably include a pair of driving rollers generally opposed to each other diametrically of the substrate to be held Further, the retention rollers preferably all serve as the driving rollers

Lighting devices using a plurality of light sources

Abstract: A device is disclosed that uses a plurality of light sources. The light sources may be light emitting diodes (LEDs). The light sources are arranged and mounted to a deformable flexible substrate. The light sources are arranged and mounted to the substrate as to emit their radiation perpendicular to the substrate. The substrate is flexed in a concave or convex manner by motor, magnetic field or other mechanical means. The light sources may emit their radiation perpendicular to the substrate, or the may diverge or converge their radiation away from the substrate. Perforations in the substrate provide cooling to the light sources by convection or forced air. A threaded holder may be screwed onto threads on a case in order to bend the flexible substrate to change the direction of light from the light sources mounted to the flexible substrate.

Apparatus for fabrication of thin films

Abstract: The invention relates to an apparatus for growing thin films onto a substrate by exposing the substrate to alternate surface reactions of vapor-phase reactants for forming a thin film onto the substrate by means of said surface reactions. The apparatus comprises a vacuum vessel (1), a reaction chamber (2) with a reaction space into which the substrate can be transferred and which has infeed channels (6) for feeding therein the reactants used in said thin film growth process, as well as outlet channels (4) for discharging gaseous reaction products and excess reactants. According to the invention, said reaction chamber comprises a base part (9, 10) mounted stationary in respect to the interior of said vacuum vessel (1) and a movable part (18) adapted to be sealably closable against said base part of said reaction chamber. The invention makes it possible to improve the cleanliness of the substrate load chamber and to reduce the degree of substrate contamination. The apparatus is intended for use in the fabrication of thin films by means of the ALE method for semiconductor layer structures and display units.

Apparatus for atomic layer chemical vapor deposition

Abstract: An atomic layer deposition (ALD) reactor (13) is disclosed that includes a substantially cylindrical chamber (15) and a wafer substrate (22) mounted within the chamber (15). The ALD reactor (13) further includes at least one injection tube (14) mounted within the chamber (15) having a plurality of apertures (32) along one side that directs gas emanating from the apertures (32) towards the wafer substrate (22). While gas is pulsed from the injection tube (14), either the wafer substrate (22) or the injection tube (14) is continuously rotated in a longitudinal plane within the chamber (15) to ensure complete and uniform coverage of the wafer substrate (22) by the gas.

Ceramic heater system and substrate processing apparatus having the same installed therein

Abstract: A ceramic heater system has a ceramic heater base having a substrate-mounting surface formed on the top surface thereof and a heater, buried in the heater base, for heating a substrate. A fluid passage is formed buried in the heater base below where the heater is buried. The heater base is cooled as a fluid whose temperature is lower than the temperature of the heater base is let flow in the fluid passage. A substrate processing apparatus has the ceramic heater system installed in a process chamber whose vacuum state can be maintained, a gas supply mechanism for feeding a gas into the process chamber, and a power supply. The substrate processing apparatus performs a heat treatment, etching and film deposition on a substrate placed in the process chamber.

Double substrate reflective spatial light modulator

Abstract: A spatial light modulator includes an upper optically transmissive substrate held above a lower substrate containing addressing circuitry. One or more electrostatically deflectable elements are suspended by hinges from the upper substrate. In operation, individual mirrors are selectively deflected and serve to spatially modulate light that is incident to, and then reflected back through, the upper substrate. Motion stops may be attached to the reflective deflectable elements so that the mirror does not snap to the bottom substrate. Instead, the motion stop rests against the upper substrate thus limiting the deflection angle of the reflective deflectable elements.

Plasma processing apparatus

Abstract: According to the present invention, a plasma processing apparatus for performing surface processing of a substrate by means of plasma discharge is provided comprising: a processing chambers 10R and 10L for performing surface processing of a substrate W; a load-lock chamber 11 which is arranged in between these processing chambers 10R and 10L; and transporting mechanisms which are capable of performing substrate transport between load-lock chamber 11 and processing chamber 10R, and between load-lock chamber 11 and processing chamber 10L; these transporting mechanisms are freely movable in a reciprocating manner in the direction in which processing chamber 10R, load-lock chamber 11, and processing chamber 10L are contiguously arranged; wherein, upper wing 20U and lower wing 20L, which are spaced apart in a vertical manner with respect to each other, are provided as the aforementioned transporting mechanisms.

Liquid crystal display device and method of producing the same

Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystal display device and a method for its production by which better display quality than a conventional device can be obtained. SOLUTION: The device has a structure having a perpendicular alignment liquid crystal 29 sealed between a TFT substrate 10 and a CF substrate 20. A pixel electrode 16a having a slit 16b is formed on the TFT substrate 10. On the CF substrate 20, a spacer 25a to hold the cell gap and a projection 25b to regulate the domain are formed. For example, a positive photoresist is applied on a common electrode 24. Then the photoresist is subjected to first exposure by using a mask which shields the spacer forming region and the projection forming region against light, and then subjected to second exposure by using a mask which shields the spacer forming region against light. Then the photoresist is developed to form the spacer 25a and the projection 25b with different heights at a time.

Process for making active interposer for high performance packaging applications

Abstract: An integrated circuit (IC) package process is provided that includes forming a first via hole in a first substrate. Patterning signal lines on a first surface and a second surface of the first substrate. Attaching a second substrate to the first surface of the first substrate. Electronically connecting a portion of the signal lines of the first substrate and the second substrate. Attaching an electrical element to the first surface of the first substrate. Forming a via hole in a third substrate. Introducing conductive material over a first surface and a second surface of the third substrate. Forming a second circuit pattern on the first surface and the second surface of the third substrate. Additionally, attaching the third substrate to the first substrate with a second layer of adhesive. In an alternative embodiment, a process includes forming a via hole in a first substrate. Introducing conductive material over a first surface and a second of the first substrate, wherein the introducing conductive material over the first surface and the second surface of the first substrate fills the via hole to form a via and a through hole. Forming a first circuit pattern on the first surface and the second surface of the first substrate. Forming solder pads on the first circuit pattern. Attaching a second substrate to the first substrate. Attaching an electrical element to the first substrate. Forming a via hole in a second substrate. Introducing conductive material over a first surface and a second of the second substrate. Forming a second circuit pattern on the first surface and the second surface of the second substrate, and attaching the first substrate to the second substrate.

Nanotube-based high energy material and method

Abstract: A carbon-based material containing an allotrope of carbon, such as single-walled carbon nanotubes, is capable of accepting an intercalated alkali metal The material exhibits a reversible capacity ranging from approximately 650mAh/g to 1,000mAh/g The high capacity of the material makes it attractive for a number of applications, such as a battery electrode (50) material A method of producing a single-walled carbon nanotube includes purifying an as-recovered nanotube material, and depositing the purified material onto a conductive substrate (42) The coated substrate (42) is incorporated into an electrochemical cell, and its ability to accept intercalated materials, such as an alkali metal (eg lithium) is measured

Source for thermal physical vapor deposition of organic electroluminescent layers

Abstract: A thermal physical vapor deposition electroluminescent source includes a housing defining an enclosure having side walls and a bottom wall, the enclosure receiving solid organic electroluminescent material which can be vaporized, and the width of the housing having a dimension w h ; and the housing has a conductive portion defining a vapor efflux aperture slit having a width w s for permitting vaporized electroluminescent materials to pass through the slit onto a surface of a substrate. A conductive baffle member has width b, the baffle member being centered on the slit and spaced from the side walls and spaced from the top plate by a distance m, the baffle member substantially providing a line-of-sight covering of the slit preventing direct access of vaporized electroluminescent materials to the slit, and preventing particulate electroluminescent materials from passing through the slit; and a straight-line projection from an edge of the slit to an edge of the baffle member onto a side wall defining a position on the side wall such that such position is spaced from the top plate by a dimension L. The ratio of the dimensions w h to w s is in a range of from 1.5 to 6.0; the ratio of L to w s is in a range of from 2 to 6; and the ratio of m to L is in a range of from 0.15 to 0.40. Heat is applied to different parts of the housing to cause vapor deposition.