The planar lighting device includes a light guide plate having the light exit plane, two pairs of light entrance planes formed at the four sides of the light exit plane, and rear planes formed opposite to the light exit plane and inclined such that the light guide plate grows thicker toward the center thereof, a pair of main light sources and a pair of auxiliary light sources disposed opposite their respective light entrance planes to emit light to the respective light entrance planes, and illuminance distribution control unit to adjust the amount of light emitted by the main and auxiliary light sources to form a designated local illuminance distribution for any position desired in the light exit plane. The planar lighting device performs area control and line control to adjust illuminance at a light exit plane for any area desired and along any line desired, respectively.

Planar lighting device

A backlight unit for slimmed structure and exhibiting uniform brightness through the improvement of its luminance efficiency and the quality in appearance of which is improved by the removal of bright lines, and a liquid crystal display device having the same are disclosed. The backlight unit includes a plurality of light emitting lamps disposed above a cover bottom such that the light emitting lamps are arranged at regular intervals, a diffusion plate disposed above the light emitting lamps, the diffusion plate including a substrate, a light control part formed on the bottom surface of the substrate corresponding to the light emitting lamps, and lens parts mounted on the top surface of the substrate, and an optical film disposed above the diffusion plate.

Backlight unit and liquid crystal display device having the same

A backlight assembly includes a light guide plate (LGP) having a stepped portion formed at a corner of the LGP, an optical sheet disposed over the LGP and a receiving container receiving the LGP and the optical sheet. The receiving container includes a bottom plate, first through fourth sidewalls and a first LGP fixing portion. The second sidewall is adjacent to the first sidewall. The third sidewall faces the first sidewall. The fourth sidewall faces the second sidewall. The first through fourth sidewalls are extended upwardly from edge portions of the bottom plate. The first LGP fixing portion is formed at the first sidewall such that the LGP fixing portion corresponds to the stepped portion of the LGP. Therefore, a display device is easily assembled. Furthermore, a defilement that may occur during an assembling process may be reduced to enhance productivity.

Backlight assembly and display device having the same

A backlight provides uniform emanating light for a liquid crystal display. In the backlight, light emitted from a light source is incident on a receiving end surface of a light guide plate and emanates through a top surface toward a liquid crystal panel. A bottom surface includes a reflecting hollow wedge extending along the receiving end surface and varying in depth, as measured from the bottom surface, in correspondence with distance from the end surface. A dividing flat portion orthogonal to the reflecting hollow wedge divides the reflecting hollowed portion, and an output surface includes a prism having parallel ridges extending in a direction orthogonal to the receiving end surface.

Backlight for liquid crystal display device

A color Liquid Crystal Display (LCD) device for displaying a color image using at least four different primary colors, the device including an array of Liquid Crystal (LC) elements (214), driving circuitry (218) adapted to receive an input corresponding to the color image and to selectively activate the LC elements (214) of the LC array to produce an attenuation pattern corresponding to a gray-level representation of the color image, and an array of color sub-pixel filter elements (216) juxtaposed and in registry with the array of LC elements (214) such that each color sub-pixel filter element is in registry with one of the LC elements, wherein the array of color sub-pixel filter elements comprises at least four types of color sub-pixel filter elements, which transmit light of the at least four primary colors, respectively.

Device, system and method for color display

Light guiding plates BL1 to Bl3 are disposed and connected in series. Light guiding plate BL1 receives the basic light provided by the basic light source L1. The other basic light sources L2, L3 are disposed at the recess, which is formed near the front portion of the light guiding plate BL1, BL2, in order to provide the basic light for the light guiding plates BL2, BL3. To prevent the brilliance insufficiency generated at two ends of the electrode portions of the basic light sources L2, L3, the adjacent overlap portion of the light guiding plate is formed by the tongue-shaped overlap portions 17a, 17b, 27a, 27b and the stripe-shaped overlap portions 17c, 27c. The light guiding plates BL1 to Bl3 can also be formed by the unity-body light guiding plate. In addition, these two ends of the bending-shaped electrode can also be used as the basic light source. The invention provides the surface light source device that uses small structure to ensure large light emission.

Tandem surface light source device

Full intermetallic joints for chip stacking by using thermal gradient bonding

Mechanical strain/stress and crystal defects are produced in extremely thin wafers (thickness ∼10 µm) of 3D-LSIs not only during wafer thinning, but also after wafer bonding using fine-pitch, high-density microbumps and curing. Furthermore, the metal of through-Si via (TSV) and microbump not only becomes the cause of contamination, but also induces strain/stress (due to the difference in the co-efficient of thermal expansion (CTE) between Si and metal) in thinned Si substrate. X-ray photoelectron spectroscopy (XPS) results showed that the crystal quality of Si is highly deteriorated in the ultra-poly ground (UPG) surface after wafer thinning and stress relief. Micro-Raman spectroscopy (µRS) data revealed that a local tensile strain amount to 1.8 GPa was induced by 4×4 µm2 square sized Si microbumps in 10 µm-thick LSI wafers after bonding and curing. We have noticed that this locally induced strain/stress caused more than 10% change in the ON current of p-MOS transistor. CuSn microbumps have also induced strain/stress at Si wafer surface, and it penetrates deeper for larger bump size and wider for smaller bump pitch.

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

A new large core (0.5-1.0 mm) graded-index polymer optical fiber was proposed to solve the connection problem of the single-mode silica fiber indoor use for high speed multimedia network. The bending loss for 10-mm bending diameter was dramatically decreased from 20 dB to less than 1 dB by preparing the high numerical aperture graded-index polymer optical fiber. The bandwidth was 585.2 MHz km which was one hundred times larger than that of any existent step-index polymer optical fibers, and the attenuation was 150 dB/km at 650-nm wavelength. >

High-bandwidth, high-numerical aperture graded-index polymer optical fiber

A color liquid crystal display device is disclosed which is capable of securing sufficient luminance while achieving a high National Television System Committee (NTSC) ratio. Specifically, a liquid crystal display device is disclosed which includes a cold cathode fluorescent light tube as a light source, and a liquid crystal display panel for displaying images by controlling transmission of light from the cold cathode fluorescent light tube. The liquid crystal display panel includes a color filter substrate having color filter layers of red, green and blue, a thin film transistor (TFT) array substrate, and a liquid crystal material filled between the TFT array substrate and the color filter substrate. The cold cathode fluorescent light tube is a tri-phospher fluorescent fluorescent light tube, which utilizes Zn2SiO4:Mn as a green phosphor. The cold cathode fluorescent light tube and the color filter layers are optimized in a manner that a color reproduction region of the light emitted from the cold cathode fluorescent light tube through the color filter layers has an NTSC ratio of 85% or higher.

Akihiro Horibe

Papers

Tandem surface light source device

Full intermetallic joints for chip stacking by using thermal gradient bonding

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

High-bandwidth, high-numerical aperture graded-index polymer optical fiber

Liquid crystal display device and display device