Showing papers by "Alina Deutsch published in 2006"

Distortion Minimization for Packaging Level Interconnects

Abstract: We propose a novel high-speed serial signaling scheme that minimizes the distortion for multichip module (MCM) packaging level communication by intentionally adding leakage resistors between the signal trace and the ground. The new scheme is inspired by the theory of distortionless transmission line which states that if R/G = L/C, there will be no distortion at the receiver end and the signal propagates at the speed of light. The simulation results indicate that, using the shunt resistor scheme, 10+ Gbps bit rate is achievable over a 10 cm single-ended stripline without pre-emphasis or equalization

New Methodology for Combined Simulation of Delta-I Noise Interaction With Interconnect Noise for Wide, On-Chip Data-Buses Using

Abstract: A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with frequency-dependent properties needed for the multigigahertz clock frequencies. The interaction between delta-I noise, common-mode noise, and crosstalk and their effect on timing is illustrated with simulations using representative driver and receiver circuits and on-chip interconnections.

New methodology for combined Simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks

Abstract: A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with frequency-dependent properties needed for the multigigahertz clock frequencies. The interaction between delta-I noise, common-mode noise, and crosstalk and their effect on timing is illustrated with simulations using representative driver and receiver circuits and on-chip interconnections.

Attenuation Measurement Technique for Printed Circuit Board Traces in a Production Environment

Abstract: In this paper we explore an attenuation measurement technique for PCB traces that is simple, robust, and quick enough to be a viable solution for a printed circuit board production environment. The technique is based on time domain reflectometry and transmission (TDR/T) measurements of two traces of different length. The result is the trace attenuation with respect to frequency. The technique combines well-known time and frequency domain algorithms. Comparison of experimental data to alternative time and frequency domain approaches verify the proposed technique up to 15 GHz. The importance of a low reflection signal launch design is discussed.