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Design Of Analog Cmos Integrated Circuits

This expanded and thoroughly revised edition of Thomas H. Lee's acclaimed guide to the design of gigahertz RF integrated circuits features a completely new chapter on the principles of wireless systems. The chapters on low-noise amplifiers, oscillators and phase noise have been significantly expanded as well. The chapter on architectures now contains several examples of complete chip designs that bring together all the various theoretical and practical elements involved in producing a prototype chip. First Edition Hb (1998): 0-521-63061-4 First Edition Pb (1998); 0-521-63922-0

The Design of CMOS Radio-Frequency Integrated Circuits: RF CIRCUITS THROUGH THE AGES

Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important antenna and packaging technology achievement in recent years. AiP technology has been widely adopted by chipmakers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. It is believed that AiP technology will also provide elegant antenna and packaging solutions to the fifth generation and beyond operating in the lower millimeter-wave (mmWave) bands. Thus, one can conclude that AiP technology has emerged as the mainstream antenna and packaging technology for various mmWave applications. This article will provide an overview of the development of AiP technology. It will consider antennas, packages, and interconnects for AiP technology. It will show that the antenna choice is usually based on those popular antennas that can be easily designed for the application, that the package choice is governed for automatic assembly, and that the materials and processes choices involve tradeoffs among constraints, such as electrical performance, thermal–mechanical reliability, compactness, manufacturability, and cost. This article also shows a probe-based setup to measure mmWave AiP impedance and radiation characteristics. It goes on to give AiP examples implemented, respectively, in a low-temperature co-fired ceramic, an embedded wafer level ball grid array process, and a high-density interconnect processes. Finally, this article will summarize and present some recommendations on research topics to further the state of the art of AiP technology.

An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

A clear trend in wireless applications during the last decade has been the push towards higher integration, and multi-mode and multi-band operation, in order to enable low-cost high-functionality consumer devices. As the deployment of silicon-based MMW technology becomes widespread, similar trends may be expected in the MMW space

A Single-Chip Dual-Band 22–29-GHz/77–81-GHz BiCMOS Transceiver

The normalized autocorrelation function of a Gaussian process may be recovered from second order moments of their polarity, through the arcsin law. By analogy, it is possible to calculate the normalized autocorrelation function of a circularly complex Gaussian process from the knowledge of moments of its instantaneous phase. In the present paper, two estimators of the normalized autocorrelation function based on the phase only are presented. Their theoretical accuracy is evaluated and compared to the accuracy of the direct estimate. >

Estimation of the autocorrelation function of complex Gaussian stationary processes by amplitude clipped signals

This paper presents the analysis and implementation of a millimeter-wave (mm-wave) I/Q modulator and determines the impact of I- and Q-channel nonlinearity, PA nonlinearity, and other nonideal circuit implementations on the error vector magnitude (EVM). The modulator is fabricated in 120-nm SiGe BiCMOS process and occupies an area of 5 mm2 . For a 64-QAM constellation at a 42-GHz carrier frequency, the EVM is less than 2.5% at 48-Mbps data rate. The on-chip digital-to-analog conversion resolution is capable of employing digital pre-distortion (DPD) and calibration. An external power amplifier is linearized to improve the EVM with DPD. To the best of the authors' knowledge, this is the lowest EVM reported at these mm-wave frequencies.

Linearity Considerations for Low-EVM, Millimeter-Wave Direct-Conversion Modulators

In this article, we present a low-power, small form-factor, 60-GHz packaged radio featuring broad beam coverage. We increase angular coverage by beam switching between two orthogonally pointed low directivity beams that are created using two different antennas integrated in package. The resulting wide angular coverage of the radio makes radio links robust to movement and rotation; this improvement overcomes a key challenge for millimeter-wave (mmWave) deployment in portable electronics. We incorporate a 3.2 mm $\times $ 3.2 mm 32-nm CMOS radio integrated circuit (IC) in the package for radio functions. The IC includes TX and RX RF front ends, up- and down-conversion mixers, TX and RX analog baseband circuits, a common PLL, TX and RX LO chains, and ADCs and a micro-controller for built-in self-test (BIST). The IC is flip-chip packaged on a four-layer organic package comprising two TX antennas and two RX antennas. In board-level over-the-air measurements of the half-duplex packaged radio, 17.1-dBm effective isotropic radiated power (EIRP) and 6.1-dB noise figure are achieved in the TX and RX modes respectively, with power consumption below 250 mW in either mode. We characterized the radio over the air using 802.11ad waveforms; the radio is 802.11ad compliant in both TX and RX modes at data rates up to the maximum 802.11ad PHY rate of 4.62 Gb/s (raw data rate >7 Gb/s) with a TX EVM $\pi $ steradians in first-of-a-kind measurements. The radio maintains 802.11ad compliance over 2.9 $\pi $ steradians solid angle.

A 250-mW 60-GHz CMOS Transceiver SoC Integrated With a Four-Element AiP Providing Broad Angular Link Coverage

The analysis and implementation of a dual-band direct-conversion millimeter-wave transmitter is presented. The proposed dual-band modulator uses high-impedance loads at two frequencies for the local oscillator driving amplifiers and power amplifier (PA) pre-amplifiers. To correct the amplitude and phase imbalance of the in-phase and quadrature channels at Q- and W-bands, the paper suggests a digitally controlled quadrature error correction stage to finely calibrate these errors and lower the error vector magnitude (EVM) without increasing the baseband digital-to-analog converter resolution. The transmitter is fabricated in 0.12- μm silicon-germanium BiCMOS process and occupies an area of 5.5 mm
 2
. At 45-GHz carrier frequency, error correction improves the sideband suppression ratio (SSR) by 10 dB at 2.4-MHz IF frequency. The EVM is lowered from 3.21% to 2.38% for a 64-QAM constellation at a 2.4-Ms/s symbol rate. At 94-GHz carrier frequency, the SSR is improved from 24 to 41 dBc at 2.4-MHz IF frequency, and the EVM is lowered by more than 1% for a 16-QAM constellation at 3-Ms/s symbol rate. A dual-band PA breakout measurement indicates the peak power-added efficiency of 15% with 14-dBm maximum saturated power (Psat) at 43 GHz and 9-dBm Psat at 82 GHz is achieved.

A Dual-Band Millimeter-Wave Direct-Conversion Transmitter With Quadrature Error Correction

The variance of the output of a cross-correlation detector, which is called a quadrature cross-correlation detector, is estimated. In this type of detector two zero-mean Gaussian quadrature processes \alpha(t) and \beta(t) of a complex process (\alpha(t) -j \beta(t)) are cross correlated. This cross-correlation function R_{A} (\tau) is estimated when neither of the two processes is distorted (the analog method), when both processes are distorted by a signum function before being cross correlated (the polarity coincidence method), and when one of the two processes is distorted by either a signum function or by a "comparator logic" function (the relay method). These quadrature cross-correlation detectors then are compared on the basis of output signal-to-noise ratio (s/n) and the clipping and relay losses are computed for two test quadrature processes of an Edgeworth-expansion-approximated power spectrum. Since R_{A} (0) is zero, the four corresponding differential estimators, such as (R_{A} (\tau) - R_{A} (0)) are also estimated and are compared on the basis of s/n. For these differential estimators, the clipping and relay losses are computed for the two test processes. In all cases the exact expressions for the s/n are derived as a function of \tau . Some applications of these correlation detectors are outlined. The mathematical techniques employed here are thought to have potential usefulness for related problems in statistical communication theory and signal processing.

Estimation of a quadrature cross- correlation detector by analog, polarity-coincidence, and relay methods (Corresp.)

This paper presents an analog circuit scheme to steer phased-array receivers in the direction of an incoming signal. The proposed circuit technique utilizes a coupled-oscillator array along with a coupled-phased-locked loop to auto-align an N-element receive array towards the direction of the incident RF signal. A four-element receiver array is implemented in 45-nm CMOS SOI process and achieves auto-steering range of ±35° from broadside. A three-element version of the array demonstrates higher auto-steering angle covering ±70° range. The receiver also performs signal demodulation for the incident modulated RF signal, allowing high-data rate communication. A 60-Mbps 64-QAM modulated RF signal is demodulated with error-vector-magnitude (EVM) less than 4% across the steering angle range. The chip area is 3.45 mm2 including a pad frame with 30-mW/element power consumption. To the best of authors' knowledge, this is the first demonstration of an analog self-steering array in an integrated circuit.

Arpit K. Gupta

Papers

Linearity Considerations for Low-EVM, Millimeter-Wave Direct-Conversion Modulators

A 250-mW 60-GHz CMOS Transceiver SoC Integrated With a Four-Element AiP Providing Broad Angular Link Coverage

A Dual-Band Millimeter-Wave Direct-Conversion Transmitter With Quadrature Error Correction

Estimation of a quadrature cross- correlation detector by analog, polarity-coincidence, and relay methods (Corresp.)

A Self-Steering Receiver Array Using Jointly Coupled Oscillators and Phased-Locked Loops