We present a comprehensive, up-to-date compilation of band parameters for the technologically important III–V zinc blende and wurtzite compound semiconductors: GaAs, GaSb, GaP, GaN, AlAs, AlSb, AlP, AlN, InAs, InSb, InP, and InN, along with their ternary and quaternary alloys. Based on a review of the existing literature, complete and consistent parameter sets are given for all materials. Emphasizing the quantities required for band structure calculations, we tabulate the direct and indirect energy gaps, spin-orbit, and crystal-field splittings, alloy bowing parameters, effective masses for electrons, heavy, light, and split-off holes, Luttinger parameters, interband momentum matrix elements, and deformation potentials, including temperature and alloy-composition dependences where available. Heterostructure band offsets are also given, on an absolute scale that allows any material to be aligned relative to any other.

Band parameters for III–V compound semiconductors and their alloys

We present a comprehensive and up-to-date compilation of band parameters for all of the nitrogen-containing III–V semiconductors that have been investigated to date. The two main classes are: (1) “conventional” nitrides (wurtzite and zinc-blende GaN, InN, and AlN, along with their alloys) and (2) “dilute” nitrides (zinc-blende ternaries and quaternaries in which a relatively small fraction of N is added to a host III–V material, e.g., GaAsN and GaInAsN). As in our more general review of III–V semiconductor band parameters [I. Vurgaftman et al., J. Appl. Phys. 89, 5815 (2001)], complete and consistent parameter sets are recommended on the basis of a thorough and critical review of the existing literature. We tabulate the direct and indirect energy gaps, spin-orbit and crystal-field splittings, alloy bowing parameters, electron and hole effective masses, deformation potentials, elastic constants, piezoelectric and spontaneous polarization coefficients, as well as heterostructure band offsets. Temperature an...

Band parameters for nitrogen-containing semiconductors

GaN based HFETs are of tremendous interest in applications requiring high power at microwave frequencies. Although excellent current-voltage (I-V) characteristics and record high output power densities at microwave frequencies have been achieved, the origin of the 2DEG and the factors limiting the output power and reliability of the devices under high power operation remain uncertain. Drain current collapse has been the major obstacle in the development of reliable high power devices. We show that the cause of current collapse is a charging up of a second virtual gate, physically located in the gate drain access region. Due to the large bias voltages present on the device during a microwave power measurement, surface states in the vicinity of the gate trap electrons, thus acting as a negatively charged virtual gate. The maximum current available from a device during a microwave power measurement is limited by the discharging of this virtual gate. Passivated devices located adjacent to unpassivated devices on the same wafer show almost no current collapse, thus demonstrating that proper surface passivation prevents the formation of the virtual gate. The possible mechanisms by which a surface passivant reduces current collapse and the factors affecting reliability and stability of such a passivant are discussed.

The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs

The macroscopic nonlinear pyroelectric polarization of wurtzite AlxGa1-xN, InxGa1-xN and AlxIn1-xN ternary compounds (large spontaneous polarization and piezoelectric coupling) dramatically affects the optical and electrical properties of multilayered Al(In)GaN/GaN hetero-, nanostructures and devices, due to the huge built-in electrostatic fields and bound interface charges caused by gradients in polarization at surfaces and heterointerfaces. Models of polarization-induced effects in GaN-based devices so far have assumed that polarization in ternary nitride alloys can be calculated by a linear interpolation between the limiting values of the binary compounds. We present theoretical and experimental evidence that the macroscopic polarization in nitride alloys is a nonlinear function of strain and composition. We have applied these results to interpret experimental data obtained in a number of InGaN/GaN quantum wells?(QWs) as well as AlInN/GaN and AlGaN/GaN transistor structures. We find that the discrepancies between experiment and ab initio theory present so far are almost completely eliminated for the AlGaN/GaN-based heterostructures when the nonlinearity of polarization is accounted for. The realization of undoped lattice-matched AlInN/GaN heterostructures further allows us to prove the existence of a gradient in spontaneous polarization by the experimental observation of two-dimensional electron gases?(2DEGs). The confinement of 2DEGs in InGaN/GaN QWs in combination with the measured Stark shift of excitonic recombination is used to determine the polarization-induced electric fields in nanostructures. To facilitate inclusion of the predicted nonlinear polarization in future simulations, we give an explicit prescription to calculate polarization-induced electric fields and bound interface charges for arbitrary composition in each of the ternary III-N alloys. In addition, the theoretical and experimental results presented here allow a detailed comparison of the predicted electric fields and bound interface charges with the measured Stark shift and the sheet carrier concentration of polarization-induced 2DEGs. This comparison provides an insight into the reliability of the calculated nonlinear piezoelectric and spontaneous polarization of group III nitride ternary alloys.

http://iopscience.iop.org/article/10.1088/0953-8984/14/13/302/pdf

Pyroelectric properties of Al(In)GaN/GaN hetero- and quantum well structures

Gallium-nitride power transistor (GaN HEMT) and integrated circuit technologies have matured dramatically over the last few years, and many hundreds of thousands of devices have been manufactured and fielded in applications ranging from pulsed radars and counter-IED jammers to CATV modules and fourth-generation infrastructure base-stations. GaN HEMT devices, exhibiting high power densities coupled with high breakdown voltages, have opened up the possibilities for highly efficient power amplifiers (PAs) exploiting the principles of waveform engineered designs. This paper summarizes the unique advantages of GaN HEMTs compared to other power transistor technologies, with examples of where such features have been exploited. Since RF power densities of GaN HEMTs are many times higher than other technologies, much attention has also been given to thermal management-examples of both commercial “off-the-shelf” packaging as well as custom heat-sinks are described. The very desirable feature of having accurate large-signal models for both discrete transistors and monolithic microwave integrated circuit foundry are emphasized with a number of circuit design examples. GaN HEMT technology has been a major enabler for both very broadband high-PAs and very high-efficiency designs. This paper describes examples of broadband amplifiers, as well as several of the main areas of high-efficiency amplifier design-notably Class-D, Class-E, Class-F, and Class-J approaches, Doherty PAs, envelope-tracking techniques, and Chireix outphasing.

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A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs

In the growth of InGaN/GaN multiple quantum well (MQW) structures, a novel defect (called the “V-defect”) initiates at threading dislocations in one of the first quantum wells in a MQW stack. This defect is common to almost all InGaN MQW heterostructures. The nature of the V-defect was evaluated using transmission electron microscopy (TEM), scanning TEM (STEM), and low-temperature cathodoluminescence (CL) on a series of In0.20Ga0.80N/GaN MQW samples. The structure of the V-defect includes buried side-wall quantum wells (on the {1011} planes) and an open hexagonal inverted pyramid which is defined by the six {1011} planes. Thus, in cross section this defect appears as an open “V”. The formation of the V-defect is kinetically controlled by reduced Ga incorporation on the pyramid walls ({1011} planes). The V-defect is correlated with the localized excitonic recombination centers that give rise to a long-wavelength shoulder in photoluminescence (PL) and CL spectra. This long-wavelength shoulder has the fol...

Structural origin of V-defects and correlation with localized excitonic centers in InGaN/GaN multiple quantum wells

The formation of the two-dimensional electron gas (2DEG) in unintentionally doped AlxGa1−xN/GaN (x⩽0.31) heterostructures grown by rf plasma-assisted molecular-beam epitaxy is investigated. Low-temperature electrical-transport measurements revealed that the two-dimensional electron gas density strongly depends on both the thickness of the AlGaN layer and alloy composition. The experimental results agree very well with the theoretical estimates of the polarization-induced 2DEG concentrations. Low-temperature electron mobility was found to be much higher in the structures with lower electron sheet densities. Interface roughness scattering or alloy disorder scattering are proposed to be responsible for this trend. A maximum mobility of 51 700 cm2/V s (T=13 K) was obtained in the Al0.09Ga0.91N/GaN structure with a two-dimensional electron gas density of 2.23×1012 cm−2.

Polarization-induced charge and electron mobility in algan/gan heterostructures grown by plasma-assisted molecular-beam epitaxy

The surfaces of GaN films grown by metalorganic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE) were studied using atomic force microscopy (AFM). Due to the high dislocation densities in the films (108 cm−2), the typical surface morphologies of layers grown by both techniques were dominated by three dislocation mediated surface structures—pinned steps, spiral hillocks, and surface depressions. The characteristics of these surface structures were found to depend on growth technique (MOCVD vs MBE) and the group-III to group-V ratio used in the growth of MBE GaN films. Pinned steps, created by the intersections of mixed character dislocations with the free surface, were found on all GaN films. The pinned steps were observed to be predominantly straight on the MOCVD GaN and curved into spiral hillock formations on the MBE GaN. Spiral growth hillocks form when pinned steps grow outward and around the dislocation under step-flow growth conditions. The tightness of the spiral hillocks on MBE G...

Dislocation mediated surface morphology of GaN

The morphology and electrical properties of homoepitaxial GaN layers grown by molecular beam epitaxy at 720 °C were investigated as a function of Ga/N ratio. GaN films grown with low Ga/N ratios (N-stable regime) are semi-insulating and have heavily pitted morphologies. GaN films grown with higher Ga/N ratios (intermediate regime) have fewer pits with areas of atomically flat surface. The room-temperature electron mobilities in samples grown in the intermediate regime are greater than 800 cm2/V s and increase with Ga/N ratio. At the highest Ga/N ratios (Ga-droplet regime), Ga droplets formed on the surface during growth. Although the surface morphology is free of pits and atomically flat for films grown within the Ga-droplet regime, the mobility decreases significantly compared to films grown in the intermediate regime. Room-temperature electron mobilities as high as 1191 cm2/V s were measured in a GaN film grown with the highest Ga/N ratio within the intermediate regime.

Optimization of the surface morphologies and electron mobilities in GaN grown by plasma-assisted molecular beam epitaxy

Plasma-assisted molecular-beam epitaxy is used to grow a set of two-dimensional electron-gas AlN/GaN structures with AlN barrier thicknesses varied between 24 and 50 A The density of the two-dimensional electron gas formed at the GaN/AlN interface increases from 151×1013 cm−2 for the AlN barrier width of 24 A to 365×1013 cm−2 for the AlN barrier width of 49 A The increase in the electron sheet density is accompanied by a decrease in electron mobility related to tensile strain relaxation and enhanced interface roughness scattering It is shown that room-temperature sheet resistances below 200 Ω/□ can be achieved in AlN/GaN high electron mobility transistor structures with 35–45 A AlN barriers

C. R. Elsass

Papers

Structural origin of V-defects and correlation with localized excitonic centers in InGaN/GaN multiple quantum wells

Polarization-induced charge and electron mobility in algan/gan heterostructures grown by plasma-assisted molecular-beam epitaxy

Dislocation mediated surface morphology of GaN

Optimization of the surface morphologies and electron mobilities in GaN grown by plasma-assisted molecular beam epitaxy

Two-dimensional electron-gas AlN/GaN heterostructures with extremely thin AlN barriers