Light-Emitting Diodes. (Monographs in Electrical and Electronic Engineering.) By A. A. Bergh and P. J. Dean. Pp. viii+591. (Clarendon: Oxford; Oxford University: London, 1976.) £22.

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Light-emitting diodes

Six years after their birth, terahertz quantum-cascade lasers can now deliver milliwatts or more of continuous-wave coherent radiation throughout the terahertz range — the spectral regime between millimetre and infrared wavelengths, which has long resisted development. This paper reviews the state-of-the-art and future prospects for these lasers, including efforts to increase their operating temperatures, deliver higher output powers and emit longer wavelengths.

Terahertz quantum-cascade lasers

International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Manufacturing processes that can create extremely small machines have been developed in recent years. Microelectromechanical systems (MEMS) refer to devices that have characteristic length of less than 1 mm but more than 1 micron, that combine electrical and mechanical components and that are fabricated using integrated circuit batch-processing techniques. Electrostatic, magnetic, pneumatic and thermal actuators, motors, valves, gears, and tweezers of less than 100-μm size have been fabricated. These have been used as sensors for pressure, temperature, mass flow, velocity and sound, as actuators for linear and angular motion and as simple components for complex systems such as micro-heat-engines and micro-heat-pumps The technology is progressing at a rate that fa r exceeds that of our understanding of the unconventional physics involved in the operation as well as the manufacturing of those minute devices. The primary objective of this article is to critically review the status of our understanding of fluid flow phenomena particular to microdevices. In terms of applications, the paper emphasizes the use of MEMS as sensors and actuators for flow diagnosis and control.

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The Fluid Mechanics of Microdevices—The Freeman Scholar Lecture

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

This is a report on work in progress on microelectrical and mechanical systems (MEMS)-based gas turbine engines, turbogenerators, and rocket engines currently under development at MIT. Fabricated in large numbers in parallel using semiconductor manufacturing techniques, these engines are based on micro-high speed rotating machinery with the same power density as that achieved in their more familiar, full-sized brethren. The micro-gas turbine is a 1 cm diameter by 3 mm thick SiC heat engine designed to produce 10-20 W of electric power or 0.050.1 Nt of thrust while consuming under 10 grams/hr of H 2 . Later versions may produce up to 100 W using hydrocarbon fuels. A liquid fuel, bi-propellant rocket motor of similar size could develop over 3 lb of thrust. The rocket motor would be complete with turbopumps and control valves on the same chip. These devices may enable new concepts in propulsion, fluid control, and por table power generation.

Micro-heat engines, gas turbines, and rocket engines -the mit microengine project-

Wafer Level 3-D ICs Process Technology

We present an overview of a new monolithic fabrication technology known as three-dimensional integration. 3D integration refers to any process by which multiple conventional device layers may be stacked and electrically interconnected. By combining state-of-the-art single-wafer integration with a high-density inter-wafer interconnect, our 3D integration process is capable of providing improved circuit performance in terms of metrics such as wire length, area, timing, and energy consumption. In this paper, we will discuss the overall 3D integration process flow, as well as specific technological challenges and the issues they present to circuit designers. We will also describe how these issues may be tackled during the placement, routing, and layout stages of physical design. Finally, we will present some performance results that may be obtained by integrating circuits in three dimensions.

Technology, performance, and computer-aided design of three-dimensional integrated circuits

The morphology and bond strength of copper-bonded wafer pairs prepared under different bonding/annealing temperatures and durations are presented. The interfacial morphology was examined by transmission electron microscopy while the bond strength was examined from a diesaw test. Physical mechanisms explaining the different roles of postbonding anneals at temperatures above and below 300°C are discussed. A map summarizing these results provides a useful reference on process conditions suitable for actual microelectronics fabrication and three-dimensional integrated circuits based on Cu wafer bonding. © 2003 The Electrochemical Society. All rights reserved.

https://iopscience.iop.org/article/10.1149/1.1626994/pdf

Morphology and Bond Strength of Copper Wafer Bonding

MIT is developing a MEMS-based gas turbine generator. Based on high speed rotating machinery, this 1 cm diameter by 3 mm thick SiC heat engine is designed to produce 10-20 W of electric power while consuming 10 grams/hr of H/sub 2/. Later versions may produce up to 100 W using hydrocarbon fuels. The combustor is now operating and an 80 W micro-turbine has been fabricated and is being tested. This engine can be considered the first of a new class of MEMS device, power MEMS, which are heat engines operating at power densities similar to those of the best large scale devices made today.

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Chuan Seng Tan

Papers

Micro-heat engines, gas turbines, and rocket engines -the mit microengine project-

Wafer Level 3-D ICs Process Technology

Technology, performance, and computer-aided design of three-dimensional integrated circuits

Morphology and Bond Strength of Copper Wafer Bonding

Power MEMS and microengines