K
Kuan-Neng Chen
Researcher at National Chiao Tung University
Publications - 284
Citations - 4668
Kuan-Neng Chen is an academic researcher from National Chiao Tung University. The author has contributed to research in topics: Anodic bonding & Wafer. The author has an hindex of 36, co-authored 267 publications receiving 4007 citations. Previous affiliations of Kuan-Neng Chen include Massachusetts Institute of Technology & National Tsing Hua University.
Papers
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Journal ArticleDOI
Wafer-level bonding/stacking technology for 3D integration
Cheng Ta Ko,Kuan-Neng Chen +1 more
TL;DR: Wafer-level bonding technologies are reviewed and described in detail, including bonding materials and bonding conditions, and the corresponding 3D integration technologies and platforms developed world-wide are addressed.
Journal ArticleDOI
Wafer-level 3D integration technology
Steven J. Koester,Albert M. Young,R.R. Yu,Sampath Purushothaman,Kuan-Neng Chen,D.C. La Tulipe,Narender Rana,Leathen Shi,M. R. Wordeman,Edmund J. Sprogis +9 more
TL;DR: An overview of wafer-level three-dimensional integration technology is provided, followed by a description of the possible process variations and integration schemes, as well as the process technology elements needed to implement 3D integrated circuits.
Proceedings ArticleDOI
Technology, performance, and computer-aided design of three-dimensional integrated circuits
TL;DR: The overall 3D integration process flow is discussed, as well as specific technological challenges and the issues they present to circuit designers and how these issues may be tackled during the placement, routing, and layout stages of physical design.
Journal ArticleDOI
Morphology and Bond Strength of Copper Wafer Bonding
TL;DR: The morphology and bond strength of copper-bonded wafer pairs prepared under different bonding/annealing temperatures and durations are presented in this article, where the interfacial morphology was examined by transmission electron microscopy while the bond strength was examined from a diesaw test.
Journal ArticleDOI
Low temperature bonding technology for 3D integration
Cheng Ta Ko,Kuan-Neng Chen +1 more
TL;DR: Various low temperature bonding technologies are reviewed and introduced, as well as the latest developments in world-wide companies and research institutes, to solve the performance degradation issue of the integrated devices.