1. Introduction and overview 2. Film stress and substrate curvature 3. Stress in anisotropic and patterned films 4. Delamination and fracture 5. Film buckling, bulging and peeling 6. Dislocation formation in epitaxial systems 7. Dislocation interactions and strain relaxation 8. Equilibrium and stability of surfaces 9. The role of stress in mass transport.

Thin Film Materials: Stress, Defect Formation and Surface Evolution

The electrostriction of elastomeric polymer dielectrics with compliant electrodes is potentially useful as a small-scale, solid-state actuator technology. Electrostrictive polymer (EP) materials are capable of efficient and fast response with high strains (> 30%), good actuation pressures (up to 1.9 MPa), and high specific energy densities (up to 0.1 J g−1). In this article, the mechanism of electrostriction is shown to be due to the electrostatic attraction of free charges on the electrodes. Although EP actuators are electrostatics based, they are shown to produce 5–20 times the effective actuation pressure of conventional air-gap electrostatics at the same electric field strength. The thin uniform dielectric films necessary for fabrication of EP actuators have been fabricated by techniques such as spin coating, casting, and dipping. A variety of materials and techniques have been used to produce the compliant electrodes, including lift-off stenciling techniques for powdered graphite, selective wetting of ionically conductive polymers, and spray coating of carbon blacks and fibrils in polymeric binders. Prototype actuators have been demonstrated in a variety of configurations such as stretched films, stacks, rolls, tubes, and unimorphs. Potential applications of the technology in areas such as microrobots, sound generators, and displays are discussed in this article.

Electrostriction of polymer dielectrics with compliant electrodes as a means of actuation

The micromachining technology that emerged in the late 1980s can provide micron-sized sensors and actuators. These micro transducers are able to be integrated with signal conditioning and processing circuitry to form micro-electromechanical-systems (MEMS) that can perform real-time distributed control. This capability opens up a new territory for flow control research. On the other hand, surface effects dominate the fluid flowing through these miniature mechanical devices because of the large surface-to-volume ratio in micron-scale configurations. We need to reexamine the surface forces in the momentum equation. Owing to their smallness, gas flows experience large Knudsen numbers, and therefore boundary conditions need to be modified. Besides being an enabling technology, MEMS also provide many challenges for fundamental flow-science research.

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Micro-electro-mechanical-systems (mems) and fluid flows

We review the methods which have been developed over the past several years to determine the behavior of solids whose properties vary randomly at the microscopic level, with principal attention to systems having composition variation on a well-defined structure (random "alloys"). We begin with a survey of the various elementary excitations and put the dynamics of electrons, phonons, magnons, and excitons into one common descriptive Hamiltonian; we then review the use of double-time thermodynamic Green's functions to determine the experimental properties of systems. Next we discuss these aspects of the problem which derive from the statistical specification of the microscopic parameters; we examine what information can and cannot be obtained from averaged Green's functions. The central portion of the review concerns methods for calculating the averaged Green's function to successively better approximation, including various self-consistent methods, and higher-order cluster effects. The last part of the review presents a comparison of theory with the experimental results of a variety of properties---optical, electronic, magnetic, and neutron scattering. An epilogue calls attention to the similarity between these problems and those of other fields where random material heterogeneity has played an essential role.

The theory and properties of randomly disordered crystals and related physical systems

A Three Dimensional Structure (3DS) Memory (100) allows for physical separation of the memory circuits (103) and the control logic circuit (101) onto different layers (103) such that each layer may be separately optimized. One control logic circuit (101) suffices for several memory circuits (103), reducing cost. Fabrication of 3DS memory (100) involves thinning of the memory circuit (103) to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections (105) are used. The 3DS memory (100) manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Three dimensional structure memory

Two microfabricated structures for the in situ measurement of mechanical properties of thin films, a suspended membrane, and an asymmetric ‘‘released structure,’’ are reported. For a polyimide film on silicon dioxide, the membrane measurements yield a residual tensile stress of 30 MPa and a Young’s modulus of 3 GPa. The released structures measure the ratio of residual stress to Young’s modulus, and yield 0.011 at strains comparable to the suspended membranes, and 0.015 at larger strains. The ultimate strain as measured by both structures is approximately 4%.

Microfabricated structures for the in situ measurement of residual stress, Young’s modulus, and ultimate strain of thin films

All dielectric measurements involve the determination of the electrical polarization and conduction properties of a sample subjected to a time-varying electric field. Section 2 addresses dielectric measurement methods, the various instruments and electrodes, and their calibrations. Section 3 examines the microscopic mechanisms giving rise in the observed microscopic dielectric properties, and Section 4 explores in detail the effects of temperature and cure on these properties. Finally, Section 5 contains a selected bibliography of applications of dielectric analysis to the study of thermoset cure.

Dielectric Analysis of Thermoset Cure.

This is a report on work in progress on microelectrical and mechanical systems (MEMS)-based gas turbine engines, turbogenerators, and rocket engines currently under development at MIT. Fabricated in large numbers in parallel using semiconductor manufacturing techniques, these engines are based on micro-high speed rotating machinery with the same power density as that achieved in their more familiar, full-sized brethren. The micro-gas turbine is a 1 cm diameter by 3 mm thick SiC heat engine designed to produce 10-20 W of electric power or 0.050.1 Nt of thrust while consuming under 10 grams/hr of H 2 . Later versions may produce up to 100 W using hydrocarbon fuels. A liquid fuel, bi-propellant rocket motor of similar size could develop over 3 lb of thrust. The rocket motor would be complete with turbopumps and control valves on the same chip. These devices may enable new concepts in propulsion, fluid control, and por table power generation.

Micro-heat engines, gas turbines, and rocket engines -the mit microengine project-

A microfabricated floating-element shear-stress sensor for measurements in turbulent boundary-layers is reported. Using surface micromachining of polyimide, a 500- mu m*500- mu m probe has been fabricated incorporating a differential-capacitor readout circuit. A model for the sensor response is described and is used for the design of an element to measure shear stresses of 1 Pa in air. The sensor is packaged for calibration in laminar flow, and electrical results obtained match the expected response. >

Design and calibration of a microfabricated floating-element shear-stress sensor

A multi-layer interconnect structure of alternating dielectric (e.g., polyimide) and metal (e.g., copper) is built on a substrate supporting a continuous layer of metal. This metal layer is used as an electrode for plating vias through all the dielectric layers. Once the desired number of layers are formed, the substrate is removed and the continuous metal layer is patterned. Solid metal vias having nearly vertical side walls can be stacked vertically, producing good electrical and thermal transfer paths and permitting small, closely-spaced conductors. Further, by mixing geometrical shapes of conductors, a variety of useful structures can be achieved, such as controlled impedance transmission lines and multiconductor TAB tape with interconnects on tape of different dimensions than TAB fingers.

Stephen D. Senturia

Papers

Microfabricated structures for the in situ measurement of residual stress, Young’s modulus, and ultimate strain of thin films

Dielectric Analysis of Thermoset Cure.

Micro-heat engines, gas turbines, and rocket engines -the mit microengine project-

Design and calibration of a microfabricated floating-element shear-stress sensor

High-density, multi-level interconnects, flex circuits, and tape for TAB