Denys Marchenko

TL;DR: An overview of the most recent developments and improvements to the low-loss TriPleX Si3N4 waveguide technology is presented in this article, which can be combined to design complex functional circuits, but more important are manufactured in a single monolithic flow to create a compact photonic integrated circuit.

TL;DR: In this paper, the authors demonstrate the first stress-optic modulator in a silicon nitride-based waveguide platform (TriPleX) in the telecommunication C-band.

TL;DR: The next generation of applications in integrated microwave photonics, such as optical beam forming networks or programmable photonic processors, requires complex chip designs with hundreds or even thousands of actuators and low propagation losses.

TL;DR: The first PIC based handheld and integrated common path based spectral domain OCT system is described and demonstrated and Broadband AWG operation from visible to 1700 nm has been shown in the platform and Photonic Design Kits are available enabling custom made designs in a system level design environment.

TL;DR: Photonic integration technology that will enable the development of transceivers interfacing the optical and wireless interfaces in future 5G networks, along with preliminary results from system testbeds are presented.