Gallium nitride (GaN) power devices are an emerging technology that have only recently become available commercially. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This paper reviews the characteristics and commercial status of both vertical and lateral GaN power devices, providing the background necessary to understand the significance of these recent developments. In addition, the challenges encountered in GaN-based converter design are considered, such as the consequences of faster switching on gate driver design and board layout. Other issues include the unique reverse conduction behavior, dynamic $R_{\mathrm {{ds}},\mathrm {{on}}}$ , breakdown mechanisms, thermal design, device availability, and reliability qualification. This review will help prepare the reader to effectively design GaN-based converters, as these devices become increasingly available on a commercial scale.

Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges

The power converters based on a modular structure have gained importance for electric transportation applications, including electric vehicles (EVs), EV charging stations, railway traction, and electric ships. Modular multilevel converters (MMCs) are recognized as one of the promising topologies to improve the energy conversion efficiency and fault-tolerant ability of power conversion systems. This paper aims at a review of latest research contributions regarding the evolution of circuit topologies, operational challenges, control schemes, and fault-tolerant strategies of the MMC. Finally, the current state of the art, opportunities and the future perspective of MMC in electric transportation applications are addressed.

Modular Multilevel Converters for Transportation Electrification: Challenges and Opportunities

The systematic characterization of a 650-V/13-A enhancement-mode GaN power transistor with p-GaN gate is presented. Critical device parameters such as ON-resistance $R_{{\rm{ON}}}$ and threshold voltage $V_{{\rm{TH}}}$ are evaluated under both static and dynamic (i.e., switching) operating conditions. The dynamic R ON is found to exhibit different dependence on the gate drive voltage $V_{{\rm{GS}}}$ from the static $R_{{\rm{ON}}}$ . While reasonably suppressed at higher $V_{{\rm{GS}}}$ of 5 and 6 V, the degradation in dynamic R ON is significantly larger at lower $V_{{\rm{GS}}}$ of 3–4 V, which is attributed to the positive shift in $V_{{\rm{TH}}}$ under switching operations. In addition to characterization of discrete devices, a custom-designed double-pulse test circuit with 400-V, 10-A test capability is built to evaluate the transient switching performance of the p-GaN gate power transistors. Optimal gate drive conditions are proposed to: 1) provide sufficient gate over-drive to minimize the impact of the $V_{{\rm{TH}}}$ shift on the dynamic $R_{{\rm{ON}}}$ ; and 2) leave enough headroom to save the device from excessive gate stresses. Moreover, gate drive circuit design and board layout considerations are also discussed by taking into account the fast switching characteristics of GaN devices.

Maximizing the Performance of 650-V p-GaN Gate HEMTs: Dynamic RON Characterization and Circuit Design Considerations

Wide bandgap (WBG) device-based power electronics converters are more efficient and lightweight than silicon-based converters. WBG devices are an enabling technology for many motor drive applications and new classes of compact and efficient motors. This paper reviews the potential applications and advances enabled by WBG devices in ac motor drives. Industrial motor drive products using WBG devices are reviewed, and the benefits are highlighted. This paper also discusses the technical challenges, converter design considerations, and design tradeoffs in realizing the full potential of WBG devices in motor drives. There is a tradeoff between high switching frequency and other issues such as high dv/dt and electromagnetic interference. The problems of high common mode currents and bearing and insulation damage, which are caused by high dv/dt , and the reliability of WBG devices are discussed.

Wide Bandgap Devices in AC Electric Drives: Opportunities and Challenges

Modern civilization is related to the increased use of electric energy for industry production, human mobility, and comfortable living. Highly efficient and reliable power electronic systems, which convert and process electric energy from one form to the other, are critical for smart grid and renewable energy systems. The power semiconductor device, as the cornerstone technology in a power electronics system, plays a pivotal role in determining the system efficiency, size, and cost. Starting from the invention and commercialization of silicon bipolar junction transistor 60 years ago, a whole array of silicon power semiconductor devices have been developed and commercialized. These devices enable power electronics systems to reach ultrahigh efficiency and high-power capacity needed for various smart grid and renewable energy system applications such as photovoltaic (PV), wind, energy storage, electric vehicle (EV), flexible ac transmission system (FACTS), and high voltage dc (HVDC) transmission. In the last two decades, newer generations of power semiconductor devices based on wide bandgap (WBG) materials, such as SiC and GaN, were developed and commercialized further pushing the boundary of power semiconductor devices to higher voltages, higher frequencies, and higher temperatures. This paper reviews some of the major power semiconductor devices technologies and their potential impacts and roadmaps.

Power Semiconductor Devices for Smart Grid and Renewable Energy Systems

The double pulse test (DPT) is a widely accepted method to evaluate the dynamic behavior of power devices. Considering the high switching-speed capability of wide band-gap devices, the test results are very sensitive to the alignment of voltage and current (V-I) measurements. Also, because of the shoot-through current induced by Cdv/dt (i.e., cross-talk), the switching losses of the nonoperating switch device in a phase-leg must be considered in addition to the operating device. This paper summarizes the key issues of the DPT, including components and layout design, measurement considerations, grounding effects, and data processing. Additionally, a practical method is proposed for phase-leg switching loss evaluation by calculating the difference between the input energy supplied by a dc capacitor and the output energy stored in a load inductor. Based on a phase-leg power module built with 1200-V/50-A SiC MOSFETs, the test results show that this method can accurately evaluate the switching loss of both the upper and lower switches by detecting only one switching current and voltage, and it is immune to V-I timing misalignment errors.

Methodology for Wide Band-Gap Device Dynamic Characterization

Normally-off GaN-on-Si heterojunction field-effect transistors (HFETs) have been developed with up to 650 V blocking capability, fast switching, and low conduction losses in commercial devices. The natively depletion-mode device can be modified to be normally-off using a variety of techniques. For a power electronics engineer accustomed to Si-based converter design, there is inherent benefit to understanding the unique characteristics and challenges that distinguish GaN HFETs from Si MOSFETs. Dynamic Rds-on, self-commutated reverse conduction, gate voltage and current requirements, and the effects of very fast switching are explained from an applications perspective. This paper reviews available literature on commercial and near-commercial GaN HFETs, to prepare engineers with Si-based power electronics experience to effectively design GaN-based converters.

Application-Based Review of GaN HFETs

GaN heterojunction field-effect transistors (HFETs) in the 600-V class are relatively new in commercial power electronics. The GaN Systems GS66508 is the first commercially available 650-V enhancement-mode device. Static and dynamic testing has been performed across the full current, voltage, and temperature range to enable GaN-based converter design using this new device. A curve tracer was used to measure R ds-on across the full operating temperature range, as well as the self-commutated reverse conduction (i.e. diode-like) behavior. Other static parameters such as transconductance and gate current were also measured. A double pulse test setup was constructed and used to measure switching loss and time at the fastest achievable switching speed, and the subsequent over-voltages due to the fast switching were characterized. Based on these results and analysis, an accurate loss model has been developed for the GS66508 to allow for GaN-based converter design and comparison with other commercially available devices in the 600-V class.

Characterization of an enhancement-mode 650-V GaN HFET

Arm inductor in a modular multilevel converter (MMC) is used to limit the circulating current and dc short circuit fault current. The circulating current in MMC is dominated by second-order harmonic, which can be largely reduced with circulating current suppressing control. By analyzing the mechanism of the circulating current suppressing control, it is found that the circulating current at switching frequency becomes the main harmonic when suppression control is implemented. Unlike the second-order harmonic that circulates only within the three phases, switching frequency harmonic also flows through the dc side and may further cause high-frequency dc voltage harmonic. This paper develops the theoretical relationship between the arm inductance and switching frequency circulating current, which can be used to guide the arm inductance selection. The experimental results with a downscaled MMC prototype verify the existence of the switching frequency circulating current and its relationship with arm inductance.

Edward A. Jones

Papers

Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges

Methodology for Wide Band-Gap Device Dynamic Characterization

Application-Based Review of GaN HFETs

Characterization of an enhancement-mode 650-V GaN HFET

Circulating Current Suppressing Control’s Impact on Arm Inductance Selection for Modular Multilevel Converter