I
Ibrahim Ahmad
Researcher at Universiti Tenaga Nasional
Publications - 204
Citations - 1061
Ibrahim Ahmad is an academic researcher from Universiti Tenaga Nasional. The author has contributed to research in topics: Threshold voltage & Taguchi methods. The author has an hindex of 15, co-authored 196 publications receiving 983 citations. Previous affiliations of Ibrahim Ahmad include National University of Malaysia & Tenaga Nasional.
Papers
More filters
Journal Article
Optimization of PV-Wind-Hydro-Diesel hybrid system by minimizing excess capacity
Juhari Ab Razak,Kamaruzzaman Sopian,Yusoff Ali,M. A. Alghoul,Azami Zaharim,Ibrahim Ahmad,Ibrahim Ahmad +6 more
Proceedings Article
Optimization of renewable energy hybrid system by minimizing excess capacity
TL;DR: In this article, the authors discussed the optimization of the hybrid system in context of minimizing the excess energy and cost of energy, and derived the system configuration based on a theoretical domestic load at a remote location and local solar radiation, wind and water flow rate data.
Journal ArticleDOI
Effect of wafer thinning methods towards fracture strength and topography of silicon die
TL;DR: Relatively, plasma etching shows higher fracture strength and flexibility compared to chemical wet etch, due to topography of the finished surface of plasma etch is smoother and rounded, leading to a reduced stress concentration, hence improved fracture strength.
Journal ArticleDOI
Evaluating the Soft Skills Performed by Applicants of Malaysian Engineers
Azami Zaharim,Ibrahim Ahmad,Yuzainee Md Yusoff,Yuzainee Md Yusoff,Mohd. Zaidi Omar,Hassan Basri +5 more
TL;DR: In this article, the authors proposed a formula to calculate the soft skills performed by engineering graduates, which was derived from a finding of survey on employer's preference for employability skills.
Journal ArticleDOI
Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping
TL;DR: In this paper, a double-pass sawing method was developed to reduce chipping/cracking induced by sawing, where the first pass dice through the wafer and varied the percentage of DAF thickness cut.