A review on highly ordered, vertically oriented TiO2 nanotube arrays: Fabrication, material properties, and solar energy applications

In this review, the structural, mechanical, thermal, and chemical properties of substrates used for gallium nitride (GaN) epitaxy are compiled, and the properties of GaN films deposited on these substrates are reviewed. Among semiconductors, GaN is unique; most of its applications uses thin GaN films deposited on foreign substrates (materials other than GaN); that is, heteroepitaxial thin films. As a consequence of heteroepitaxy, the quality of the GaN films is very dependent on the properties of the substrate—both the inherent properties such as lattice constants and thermal expansion coefficients, and process induced properties such as surface roughness, step height and terrace width, and wetting behavior. The consequences of heteroepitaxy are discussed, including the crystallographic orientation and polarity, surface morphology, and inherent and thermally induced stress in the GaN films. Defects such as threading dislocations, inversion domains, and the unintentional incorporation of impurities into the epitaxial GaN layer resulting from heteroepitaxy are presented along with their effect on device processing and performance. A summary of the structure and lattice constants for many semiconductors, metals, metal nitrides, and oxides used or considered for GaN epitaxy is presented. The properties, synthesis, advantages and disadvantages of the six most commonly employed substrates (sapphire, 6H-SiC, Si, GaAs, LiGaO 2 , and AlN) are presented. Useful substrate properties such as lattice constants, defect densities, elastic moduli, thermal expansion coefficients, thermal conductivities, etching characteristics, and reactivities under deposition conditions are presented. Efforts to reduce the defect densities and to optimize the electrical and optical properties of the GaN epitaxial film by substrate etching, nitridation, and slight misorientation from the (0 0 0 1) crystal plane are reviewed. The requirements, the obstacles, and the results to date to produce zincblende GaN on 3C-SiC/Si(0 0 1) and GaAs are discussed. Tables summarizing measures of the GaN quality such as XRD rocking curve FWHM, photoluminescence peak position and FWHM, and electron mobilities for GaN epitaxial layers produced by MOCVD, MBE, and HVPE for each substrate are given. The initial results using GaN substrates, prepared as bulk crystals and as free-standing epitaxial films, are reviewed. Finally, the promise and the directions of research on new potential substrates, such as compliant and porous substrates are described.

Substrates for gallium nitride epitaxy

In a wavelength converted semiconductor light emitting device with at least two wavelength converting materials, the wavelength converting materials in the device are arranged relative to the light emitting device and relative to each other to tailor interaction between the different wavelength converting materials in order to maximize one or more of the luminous equivalent, color rendering index, and color gamut of the combined visible light emitted by the device.

Wavelength-converted semiconductor light-emitting device

We have derived consistent sets of band parameters band gaps, crystal field splittings, band-gap deformation potentials, effective masses, and Luttinger and EP parameters for AlN, GaN, and InN in the zinc-blende and wurtzite phases employing many-body perturbation theory in the G0W0 approximation. The G0W0 method has been combined with density-functional theory DFT calculations in the exact-exchange optimized effective potential approach to overcome the limitations of local-density or gradient-corrected DFT functionals. The band structures in the vicinity of the point have been used to directly parametrize a 44 k·p Hamiltonian to capture nonparabolicities in the conduction bands and the more complex valence-band structure of the wurtzite phases. We demonstrate that the band parameters derived in this fashion are in very good agreement with the available experimental data and provide reliable predictions for all parameters, which have not been determined experimentally so far.

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Consistent set of band parameters for the group-III nitrides AlN, GaN, and InN

With the increasing requirements for microelectromechanical systems (MEMS) regarding stability, miniaturization and integration, novel materials such as wide band gap semiconductors are attracting more attention. Polycrystalline SiC has first been implemented into Si micromachining techniques, mainly as etch stop and protective layers. However, the outstanding properties of wide band gap semiconductors offer many more possibilities for the implementation of new functionalities. Now, a variety of technologies for SiC and group III nitrides exist to fabricate fully wide band gap semiconductor based MEMS. In this paper we first review the basic technology (deposition and etching) for group III nitrides and SiC with a special focus on the fabrication of three-dimensional microstructures relevant for MEMS. The basic operation principle for MEMS with wide band gap semiconductors is described. Finally, the first applications of SiC based MEMS are demonstrated, and innovative MEMS and NEMS devices are reviewed.

http://iopscience.iop.org/article/10.1088/0022-3727/40/20/S19/pdf

Group III nitride and SiC based MEMS and NEMS: materials properties, technology and applications

We review the influence of GaN crystal polarity on various properties of epitaxial films and electronic devices. GaN films grown on sapphire by MOCVD or HVPE usually exhibit Ga-face polarity. N-face polarity is obtained either on the backside of such layers after removal from the substrate, or by turning the crystal polarity in MBE growth via a thin AlN buffer layer. In addition to rather obvious differences in their structural and morphological features, Ga- and N-face samples differ also in their electronic properties. Thus, different Schottky barrier heights are observed for both polarities, the position and detailed properties of spontaneously formed two-dimensional electron gases vary with polarity, and the adsorption of gases and ions also show an influence of the two different surfaces. A particular interesting possibility is the growth of lateral polarity heterostructures with predetermined macroscopic domains of different polarity separated by inversion domain boundaries. These structures make use of the crystal polarity as a new degree of freedom for the investigation of electronic properties of III-nitrides and for novel devices.

Playing with Polarity

Besides silicon carbide, group-III nitrides are also suitable large-band-gap semiconductor materials for high-temperature gas sensor devices. Exposing GaN-based Schottky diodes with catalytically active platinum electrodes to hydrogen, we observed a decrease of the rectifying characteristics which we attribute to a decrease in Schottky barrier height. Current–voltage and elastic recoil detection measurements were used to investigate the H-sensing behavior of such devices. Our results indicate an interfacial effect as the origin of the sensor response to hydrogen.

Hydrogen response mechanism of Pt-GaN Schottky diodes

High electron mobility transistors (HEMT) based on GaN/AlGaN-heterostructures have been fitted with catalytically active platinum (Pt) gate electrodes to induce gas sensitivity. Due to the wide bandgap of group III-nitride materials, such transistors can be operated at temperatures high enough for triggering a wide range of gas sensing reactions at the Pt gate. Depending on gate porosity, either selective hydrogen sensors or sensors with a broad-band sensitivity towards a range of reducing and oxidizing gas species can be made. Applying porous Pt electrodes and sensor operation temperatures of about 400 °C, hydrogen (H2), carbon monoxide (CO), acetylene (C2H2) and nitrous oxide (NO2) could be detected via sizable changes in the source drain current.

Gas sensitive GaN/AlGaN-heterostructures

GaN-based heterostructures for sensor applications

In the present article recent results concerning sensor applications of AlGaN layers and AlGaN/GaN heterostructures are summarized. The piezoresistive effect in piezoelectric AlGaN layers is investigated and the dependence of the piezoresistive gauge factor on the Al content is attributed to the influence of strain induced piezoelectric fields. An enhancement of this effect is observed in AlGaN/GaN heterostructures resulting in high longitudinal gauge factors.



The response of gas sensitive Pt:GaN Schottky diodes to hydrogen and hydrogen containing gases is analyzed up to temperatures of 600 °C and employed to realize gas sensitive field effect transistors which are demonstrated to operate up to 400 °C. In addition, ion sensitive field effect transistors (ISFETs) have also been fabricated on the basis of AlGaN/GaN heterostructures. The GaN surface shows a high pH sensitivity which is attributed to the presence of a thin native metal oxide layer on the surface. (© 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

J. Schalwig

Papers

Playing with Polarity

Hydrogen response mechanism of Pt-GaN Schottky diodes

Gas sensitive GaN/AlGaN-heterostructures

GaN-based heterostructures for sensor applications

Electronics and sensors based on pyroelectric AlGaN/GaN heterostructures – Part B: Sensor applications