The rapid development of the RF power electronics requires the introduction of wide bandgap material due to its potential in high output power density, high operation voltage and high input impedance GaN-based RF power devices have made substantial progresses in the last decade This paper attempts to review the latest developments of the GaN HEMT technologies, including material growth, processing technologies, device epitaxial structures and MMIC designs, to achieve the state-of-the-art microwave and millimeter-wave performance The reliability and manufacturing challenges are also discussed

GaN-Based RF Power Devices and Amplifiers

This tutorial presents an overview of the technological advances in millimeter-wave (mm-wave) circuit components, antennas, and propagation that will soon allow 60-GHz transceivers to provide multigigabit per second (multi-Gb/s) wireless communication data transfers in the consumer marketplace. Our goal is to help engineers understand the convergence of communications, circuits, and antennas, as the emerging world of subterahertz and terahertz wireless communications will require understanding at the intersections of these areas. This paper covers trends and recent accomplishments in a wide range of circuits and systems topics that must be understood to create massively broadband wireless communication systems of the future. In this paper, we present some evolving applications of massively broadband wireless communications, and use tables and graphs to show research progress from the literature on various radio system components, including on-chip and in-package antennas, radio-frequency (RF) power amplifiers (PAs), low-noise amplifiers (LNAs), voltage-controlled oscillators (VCOs), mixers, and analog-to-digital converters (ADCs). We focus primarily on silicon-based technologies, as these provide the best means of implementing very low-cost, highly integrated 60-GHz mm-wave circuits. In addition, the paper illuminates characterization techniques that are required to competently design and fabricate mm-wave devices in silicon, and illustrates effects of the 60-GHz RF propagation channel for both in-building and outdoor use. The paper concludes with an overview of the standardization and commercialization efforts for 60-GHz multi-Gb/s devices, and presents a novel way to compare the data rate versus power efficiency for future broadband devices.

http://faculty.poly.edu/~tsr/wp-content/uploads/publications/abstract17.pdf

State of the Art in 60-GHz Integrated Circuits and Systems for Wireless Communications

Due to limitations of low power density, high cost, heavy weight, etc., the development and application of battery-powered devices are facing with unprecedented technical challenges. As a novel pattern of energization, the wireless power transfer (WPT) offers a band new way to the energy acquisition for electric-driven devices, thus alleviating the over-dependence on the battery. This paper presents an overview of WPT techniques with emphasis on working mechanisms, technical challenges, metamaterials, and classical applications. Focusing on WPT systems, this paper elaborates on current major research topics and discusses about future development trends. This novel energy transmission mechanism shows significant meanings on the pervasive application of renewable energies in our daily life.

Wireless Power Transfer—An Overview

Gallium-nitride power transistor (GaN HEMT) and integrated circuit technologies have matured dramatically over the last few years, and many hundreds of thousands of devices have been manufactured and fielded in applications ranging from pulsed radars and counter-IED jammers to CATV modules and fourth-generation infrastructure base-stations. GaN HEMT devices, exhibiting high power densities coupled with high breakdown voltages, have opened up the possibilities for highly efficient power amplifiers (PAs) exploiting the principles of waveform engineered designs. This paper summarizes the unique advantages of GaN HEMTs compared to other power transistor technologies, with examples of where such features have been exploited. Since RF power densities of GaN HEMTs are many times higher than other technologies, much attention has also been given to thermal management-examples of both commercial “off-the-shelf” packaging as well as custom heat-sinks are described. The very desirable feature of having accurate large-signal models for both discrete transistors and monolithic microwave integrated circuit foundry are emphasized with a number of circuit design examples. GaN HEMT technology has been a major enabler for both very broadband high-PAs and very high-efficiency designs. This paper describes examples of broadband amplifiers, as well as several of the main areas of high-efficiency amplifier design-notably Class-D, Class-E, Class-F, and Class-J approaches, Doherty PAs, envelope-tracking techniques, and Chireix outphasing.

/pdf/a-review-of-gan-on-sic-high-electron-mobility-power-4mjzeqemry.pdf

A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs

The field of terahertz integrated technology has undergone significant development in the past ten years. This has included work on different substrate technologies such as III–V semiconductors and silicon, work on field-effect transistor devices and heterojunction bipolar devices, and work on both fully electronic and hybrid electronic–photonic systems. While approaches in electronic and photonics can often seem distinct, techniques have blended in the terahertz frequency range and many emerging systems can be classified as photonics-inspired or hybrid. Here, we review the development of terahertz integrated electronic and hybrid electronic–photonic systems, examining, in particular, advances that deliver important functionalities for applications in communication, sensing and imaging. Many of the advances in integrated systems have emerged, not from improvements in single devices, but rather from new architectures that are multifunctional and reconfigurable and break the trade-offs of classical approaches to electronic system design. We thus focus on these approaches to capture the diversity of techniques and methodologies in the field. This Review Article examines the development of terahertz integrated electronic and hybrid electronic–photonic systems, considering, in particular, advances that deliver important functionalities for applications in communication, sensing and imaging.

Terahertz integrated electronic and hybrid electronic–photonic systems

A high-efficiency wideband code-division multiple-access (W-CDMA) base-station amplifier is presented using high-performance GaN heterostructure field-effect transistors to achieve high gain and efficiency with good linearity For high efficiency, class J/E operation was employed, which can attain up to 80% efficiency over a wide range of input powers and power supply voltages For nonconstant envelope input, the average efficiency is further increased by employing the envelope-tracking architecture using a wide-bandwidth high-efficiency envelope amplifier The linearity of overall system is enhanced by digital pre-distortion The measured average power-added efficiency of the amplifier is as high as 507% for a W-CDMA modulated signal with peak-to-average power ratio of 767 dB at an average output power of 372 W and gain of 100 dB We believe that this corresponds to the best efficiency performance among reported base-station power amplifiers for W-CDMA The measured error vector magnitude is as low as 174% with adjacent channel leakage ratio of -510 dBc at an offset frequency of 5 MHz

High-Efficiency Envelope-Tracking W-CDMA Base-Station Amplifier Using GaN HFETs

A single-stage stacked field-effect transistor (FET) linear power amplifier (PA) is demonstrated using 0.28-?m 2.5-V standard I/O FETs in a 0.13-?m silicon-on-insulator (SOI) CMOS technology. To overcome the low breakdown voltage limit of MOSFETs, a stacked-FET structure is employed, where four transistors are connected in series so that their output voltage swings are added in phase. With a 6.5-V supply, the measured PA achieves a small-signal gain of 14.6 dB, a saturated output power of 32.4 dBm, and a maximum power-added efficiency (PAE) of 47% at 1.9 GHz. Using a reverse-link IS-95 code division multiple access modulated signal, the PA shows an average output power of up to 28.7 dBm with a PAE of 41.2% while meeting the adjacent channel power ratio requirement. Using an uplink wideband code division multiple access modulated signal, the PA shows an average output power of up to 29.4 dBm with a PAE of 41.4% while meeting the adjacent channel leakage ratio requirement. The stacked-FET PA is designed to withstand up to 9 V of supply voltage before reaching its breakdown limit. This is the first reported stacked-FET linear PA in submicrometer SOI CMOS technology that delivers watt-level output power in the gigahertz frequency range with efficiency and linearity performance comparable to those of GaAs-based PAs.

A Watt-Level Stacked-FET Linear Power Amplifier in Silicon-on-Insulator CMOS

In this paper, a range-adaptive wireless power transfer (WPT) system is proposed to achieve high efficiency over a wide range of distances by using tunable impedance matching techniques. A multiloop topology is employed to greatly reduce the variation in the input impedance of the WPT system with respect to the distance, where one of the four loops with a different size is selected, depending on the distance. It enables the design of a simple tunable matching circuit using a single variable capacitor. An algorithm is written to find the optimum loop and capacitance in the matching network, based on the measured input return loss using a directional coupler and rectifiers. The fabricated WPT system shows a range-adaptive operation with high efficiency over a wide range of distances. It attains 48% efficiency at a distance of 100 cm with a maximum efficiency of 92% at a distance of 10 cm.

Range-Adaptive Wireless Power Transfer Using Multiloop and Tunable Matching Techniques

A high performance W-CDMA base station power amplifier is presented, which uses an envelope tracking bias system along with an advanced 0.4mum gate length LDMOS transistor, to achieve high efficiency. High linearity is also achieved by employing digital predistortion. For a target WCDMA envelope with a peak-to-average power ratio of 7.6 dB, the measured overall power-added efficiency (PAE) is as high as 40.4 %. Within this system, the RF power amplifier has an average drain efficiency of approximately 64%, and the envelope amplifier has about 60% efficiency. After the memoryless digital predistortion the normalized power RMS error is 3.3%, at an average output power of 27 W and gain of 14.9 dB. After memory mitigation the normalized power RMS error drops to below 1.0%. The efficiency ranks among the highest reported for a single stage LDMOS W-CDMA base station amplifier

High Efficiency Envelope Tracking LDMOS Power Amplifier for W-CDMA

In this letter, a fully integrated 20-dBm RF power amplifier (PA) is presented using 0.25-mum-gate silicon-on-sapphire metal-oxide-semiconductor field-effect transistors (MOSFETs). To overcome the low breakdown voltage limit of MOSFETs, a stacked FET structure is employed, where transistors are connected in series so that each output voltage swing is added in phase. By using triple-stacked FETs, the optimum load impedance for a 20-dBm PA increases to 50Omega, which is nine times higher than that of parallel FET topology for the same output power. Measurement of a single-stage linear PA shows small-signal gain of 17.1 dB and saturated output power of 21.0dBm with power added efficiency (PAE) of 44.0% at 1.88 GHz. With an IS-95 code division multiple access modulated signal, the PA shows an average output power of 16.3 dBm and PAE of 18.7% with adjacent channel power ratio below -42dBc

Jinho Jeong

Papers

High-Efficiency Envelope-Tracking W-CDMA Base-Station Amplifier Using GaN HFETs

A Watt-Level Stacked-FET Linear Power Amplifier in Silicon-on-Insulator CMOS

Range-Adaptive Wireless Power Transfer Using Multiloop and Tunable Matching Techniques

High Efficiency Envelope Tracking LDMOS Power Amplifier for W-CDMA

A 20 dBm Linear RF Power Amplifier Using Stacked Silicon-on-Sapphire MOSFETs