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Jochen Rentsch

Researcher at Fraunhofer Society

Publications -  170
Citations -  2338

Jochen Rentsch is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Passivation & Silicon. The author has an hindex of 22, co-authored 164 publications receiving 2090 citations. Previous affiliations of Jochen Rentsch include University of Freiburg.

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Very low surface recombination velocity on p-type c-Si by high-rate plasma-deposited aluminum oxide

TL;DR: In this article, highly negatively charged aluminum oxide layers were produced using an inline plasma-enhanced chemical vapor deposition system, leading to very low effective recombination velocities (∼10 cm)s−1) on low resistivity p-type substrates.
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Tunnel oxide passivated carrier-selective contacts based on ultra-thin SiO2 layers

TL;DR: In this article, the ozone-based oxide layers were applied to the electron-selective contact (n-TOPCon) on planar and textured surfaces, and the oxide properties as stoichiometry and layer thickness were analyzed by means of X-ray photoelectron spectroscopy (XPS), spectral ellipsometry (SE) and transmission electron microscopy (TEM).
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High-Efficiency c-Si Solar Cells Passivated With ALD and PECVD Aluminum Oxide

TL;DR: In this paper, ultrathin (7 nm) atomic layer deposited Al2O3 layers and highdeposition-rate plasma-enhanced chemical vapor deposited AlOx layers have been applied and characterized as rear-surface passivation for high-efficiency silicon solar cells.
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Simple Cleaning and Conditioning of Silicon Surfaces with UV/Ozone Sources☆

TL;DR: In this paper, the applicability of three methods to clean and condition the surface of silicon wafers by an ultra-thin oxide layer were tested: two UV/O 3 sources (an Hg vapor lamp and a high efficiency excimer module) as well as a wet chemical oxidation in HNO 3.
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Recent developments in rear-surface passivation at Fraunhofer ISE

TL;DR: In this paper, Fraunhofer ISE used a low-temperature passivation stack of hydrogenated amorphous silicon and plasma-enhanced chemical vapor deposition (PECVD) silicon oxide to achieve an efficiency of up to 21.7%.