An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Damascene copper electroplating for on-chip interconnections, a process that we conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition. We discuss here the relationship of additives in the plating bath to superfilling, the phenomenon that results in superconformal coverage, and we present a numerical model which accounts for the experimentally observed profile evolution of the plated metal.

Damascene copper electroplating for chip interconnections

Formally we have arrived at the middle of the book. So you may need a pause for recovering, a pause which we want to fill up by some fixed point theorems supplementing those which you already met or which you will meet in later chapters. The first group of results centres around Banach’s fixed point theorem. The latter is certainly a nice result since it contains only one simple condition on the map F, since it is so easy to prove and since it nevertheless allows a variety of applications. Therefore it is not astonishing that many mathematicians have been attracted by the question to which extent the conditions on F and the space Ω can be changed so that one still gets the existence of a unique or of at least one fixed point. The number of results produced this way is still finite, but of a statistical magnitude, suggesting at a first glance that only a random sample can be covered by a chapter or even a book of the present size. Fortunately (or unfortunately?) most of the modifications have not found applications up to now, so that there is no reason to write a cookery book about conditions but to write at least a short outline of some ideas indicating that this field can be as interesting as other chapters. A systematic account of more recent ideas and examples in fixed point theory should however be written by one of the true experts. Strange as it is, such a book does not seem to exist though so many people are puzzling out so many results.

Fixed Point Theory

The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die We present photonic networks-on-chip (NoC) as a solution to reduce the impact of intra-chip and off-chip communication on the overall power budget A photonic interconnection network can deliver higher bandwidth and lower latencies with significantly lower power dissipation We explain why on-chip photonic communication has recently become a feasible opportunity and explore the challenges that need to be addressed to realize its implementation We introduce a novel hybrid micro-architecture for NoCs combining a broadband photonic circuit-switched network with an electronic overlay packet-switched control network We address the critical design issues including: topology, routing algorithms, deadlock avoidance, and path-setup/tear-down procedures We present experimental results obtained with POINTS, an event-driven simulator specifically developed to analyze the proposed idea, as well as a comparative power analysis of a photonic versus an electronic NoC Overall, these results confirm the unique benefits for future generations of CMPs that can be achieved by bringing optics into the chip in the form of photonic NoCs

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Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors

Here we show through an order-of-magnitude analysis that the enhancement in the effective thermal conductivity of nanofluids is due mainly to the localized convection caused by the Brownian movement of the nanoparticles. We also introduce a convective-conductive model which accurately captures the effects of particle size, choice of base liquid, thermal interfacial resistance between the particles and liquid, temperature, etc. This model is a combination of the Maxwell-Garnett (MG) conduction model and the convection caused by the Brownian movement of the nanoparficles, and reduces to the MG model for large particle sizes. The model is in good agreement with data on water, ethylene glycol, and oil-based nanofluids, and shows that the lighter the nanoparticles, the greater the convection effect in the liquid, regardless of the thermal conductivity of the nanoparticles.

Brownian-motion-based convective-conductive model for the effective thermal conductivity of nanofluids

A Silicon Based Package (SBP) is formed starting with a thick wafer, which serves as the base for the SBP, composed of silicon which has a first surface and a reverse surface which are planar. Then form an interconnection structure including metal capture structures in contact with the first surface and multilayer conductor patterns over the first surface. Form a temporary bond between the SBP and a wafer holder, with the wafer holder being a rigid structure. Thin the reverse side of the wafer to a desired thickness to form an Ultra Thin Silicon Wafer (UTSW) for the SBP. Form via holes with tapered or vertical sidewalls, which extend through the UTSW to reach the metal capture structures. Then form metal pads in the via holes which extend through the UTSW, making electrical contact to the metal capture structures. Then bond the metal pads in the via holes to pads of a carrier.

Silicon based package

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Toward Real-time Modeling of Human Heart Ventricles at Cellular Resolution: Multi-hour Simulation of Drug-induced Arrhythmias

We report on a demonstration of loose multiphysics coupling between a basin modeling code and a seismic code running on a large parallel machine. Multiphysics coupling, which is one critical capability for a high performance computing (HPC) framework, was implemented using the MOAB open-source mesh and field database. MOAB provides for code coupling by storing mesh data and input and output field data for the coupled analysis codes and interpolating the field values between different meshes used by the coupled codes. We found it straightforward to use MOAB to couple the PBSM basin modeling code and the FWI3D seismic code on an IBM Blue Gene/P system. We describe how the coupling was implemented and present benchmarking results for up to 8 racks of Blue Gene/P with 8192 nodes and MPI processes. The coupling code is fast compared to the analysis codes and it scales well up to at least 8192 nodes, indicating that a mesh and field database is an efficient way to implement loose multiphysics coupling for large parallel machines.

Coupling a Basin Modeling and a Seismic Code using MOAB

Computational Fluid Dynamics (CFD) is an increasingly important application domain for computational scientists. In this paper, we propose and analyze optimizations necessary to run CFD simulations consisting of multi-billion-cell mesh models on large processor systems. Our investigation leverages the general industrial Navier-Stokes open-source CFD application, Code_Saturne, developed by Electricite de France (EDF). Our work considers emerging processor features such as many-core, Symmetric Multi-threading (SMT), Single Instruction Multiple Data (SIMD), Transactional Memory, and Thread Level Speculation. Initially, we have targeted per-node performance improvements by reconstructing the code and data layouts to optimally use multiple threads. We present a general loop transformation that will enable the compiler to generate OpenMP threads effectively with minimal impact to overall code structure. A renumbering scheme for mesh faces is proposed to enhance thread-level parallelism and generally improve data locality. Performance results on IBM Blue Gene/P supercomputer and Intel Xeon Westmere cluster are included.

Accelerating Computational Fluid Dynamics on the IBM Blue Gene/P Supercomputer

A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio <1.5/spl times/10/sup -15/ was measured at 8 Gbit/s.

John H. Magerlein

Papers

Silicon based package

Toward Real-time Modeling of Human Heart Ventricles at Cellular Resolution: Multi-hour Simulation of Drug-induced Arrhythmias

Coupling a Basin Modeling and a Seismic Code using MOAB

Accelerating Computational Fluid Dynamics on the IBM Blue Gene/P Supercomputer

Novel packaging of parallel-optical interconnects for high-end servers