J
John H. Magerlein
Researcher at IBM
Publications - 51
Citations - 2039
John H. Magerlein is an academic researcher from IBM. The author has contributed to research in topics: Microchannel & Layer (electronics). The author has an hindex of 22, co-authored 51 publications receiving 1935 citations. Previous affiliations of John H. Magerlein include Veeco & GlobalFoundries.
Papers
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Proceedings ArticleDOI
High Performance and Sub-Ambient Silicon Microchannel Cooling
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,Raschid J. Bezama,Kenneth C. Marston,Roger R. Schmidt +8 more
TL;DR: In this paper, a single-phase Si microchannel coolers were designed and characterized in single chip modules in a laboratory environment using either water at 22°C or a fluorinated fluid at temperatures between 20 and −40°C as the coolant.
Journal ArticleDOI
Dielectric Charging in Electrostatically Actuated MEMS Ohmic Switches
Zhen Peng,Cristiano Palego,Subrata Halder,James C. M. Hwang,Christopher V. Jahnes,K. F. Etzold,J.M. Cotte,John H. Magerlein +7 more
TL;DR: In this article, the authors used a control voltage high enough to establish metal-metal contact between the signal electrodes while avoiding contact between dielectric-covered actuation electrodes, and showed that the effect of polarization charge appears to be negligible.
Patent
Method of fabricating a high Q factor integrated circuit inductor
Daniel C. Edelstein,Panayotis C. Andricacos,John M. Cotte,Hariklia Deligianni,John H. Magerlein,Kevin S. Petrarca,Kenneth J. Stein,Richard P. Volant +7 more
TL;DR: In this article, the authors proposed a method of forming an inductor by forming a dielectric layer on a top surface of a substrate, after forming a lower trench in the dielectrics layer, after creating a resist layer on top of the resist layer, and after filling the lower trench with a conductor in order to form the inductor.
Proceedings ArticleDOI
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
Evan G. Colgan,Bruce K. Furman,John H. Magerlein,Jeremy D. Schaub,Clint L. Schow,Daniel J. Stigliani,J. Torok,Alan F. Benner,Dale Becker,George A. Katopis,J. Abshier,W. Dyckman,B.E. Lemoff,M.E. Ali,George Panotopoulos,E. de Groot,G.M. Flower,Glenn H. Rankin,A.J. Schmit,K.D. Djordjev,M.R.T. Tan,Ashish Tandon,W. Gong,R.P. Telia,B. Law,Steven A. Rosenau,L.A. Buckman Windover,D.W. Dolfi +27 more
TL;DR: In this article, the direct integration of dense 48-channel parallel multiwavelength optical transmitter and receiver subassemblies directly onto a first level package using a flex lead attach has been demonstrated.
Patent
Integrally formed microchannel cooling device and apparatus (apparatus and method of cooling by microchannel) of semiconductor integrated circuit package
Raschid J. Bezama,Evan G. Colgan,John H. Magerlein,Roger R. Schmidt,エヴァン・ジョージ・コルガン,ジョン・ハロルド・マーゲレイン,ラシード・ジョゼ・ベザマ,ロジャー・レイ・シュミット +7 more
TL;DR: In this paper, the authors proposed a microchannel cooling method to improve cooling capability with respect to a high power density region of a semiconductor chip higher than the average in power density.