scispace - formally typeset
K

Ku-Feng Lin

Researcher at TSMC

Publications -  34
Citations -  890

Ku-Feng Lin is an academic researcher from TSMC. The author has contributed to research in topics: Transistor & Sense amplifier. The author has an hindex of 12, co-authored 34 publications receiving 809 citations. Previous affiliations of Ku-Feng Lin include Industrial Technology Research Institute & National Tsing Hua University.

Papers
More filters
Proceedings ArticleDOI

A 4Mb embedded SLC resistive-RAM macro with 7.2ns read-write random-access time and 160ns MLC-access capability

TL;DR: This work proposes process/resistance variation-insensitive read schemes for embedded RRAM to achieve fast read speeds with high yields and an embedded mega-bit scale, single-level-cell (SLC) RRAM macro with sub-8ns read-write random-access time is presented.
Proceedings ArticleDOI

19.4 embedded 1Mb ReRAM in 28nm CMOS with 0.27-to-1V read using swing-sample-and-couple sense amplifier and self-boost-write-termination scheme

TL;DR: This study develops a swing-sample-andcouple (SSC) voltage-mode sense amplifier (VSA) to overcome (1), enabling 1.8× greater SM for lower RD-VDDMIN and 1.7× faster T-sub>AC across various V, compared to conventional differential-input (CD) VSAs.
Proceedings ArticleDOI

A low store energy, low VDDmin, nonvolatile 8T2R SRAM with 3D stacked RRAM devices for low power mobile applications

TL;DR: This work demonstrates the first fabricated macro-level RRAM-based nonvolatile SRAM (nvSRAM) that use a new 8T2R (Rnv8T) cell to achieve fast NVM storage and low VDDmin read/write operations.
Journal ArticleDOI

A High-Speed 7.2-ns Read-Write Random Access 4-Mb Embedded Resistive RAM (ReRAM) Macro Using Process-Variation-Tolerant Current-Mode Read Schemes

TL;DR: This study fabricated a 4-Mb ReRAM macro to confirm the effectiveness of the proposed schemes for both SLC and MLC operations and proposes two process-variation-tolerant schemes for current-mode read operation of ReRAM: parallel-series reference-cell (PSRC) and process-temperature-aware dynamic BL-bias (PTADB) schemes.
Proceedings ArticleDOI

A 0.5V 4Mb logic-process compatible embedded resistive RAM (ReRAM) in 65nm CMOS using low-voltage current-mode sensing scheme with 45ns random read time

TL;DR: A body-drain-driven CSA (BDD-CSA) with dynamic BL bias voltage (VBL) and small VHR for larger sensing margins is developed to achieve a lower VDDmin, faster read speed, and better tolerance of read cell current (ICELL) and BL leakage current (IBL-LEAK) variations compared to conventional CSAs.