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L. Perraud

Researcher at University of Grenoble

Publications -  9
Citations -  34

L. Perraud is an academic researcher from University of Grenoble. The author has contributed to research in topics: Optical proximity correction & Engineering. The author has an hindex of 2, co-authored 7 publications receiving 29 citations.

Papers
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Proceedings ArticleDOI

Template affinity role in CH shrink by DSA planarization

TL;DR: In this paper, the authors investigate the potential of DSA to address contact and via levels patterning with high resolution by performing either CD shrink or contact multiplication, and compare different DSA processes based on several success criteria such as: CD control, defectivity, and placement control.
Proceedings ArticleDOI

Study of SRAF placement for contact at 45 nm and 32 nm node

TL;DR: This article proposes to study the placement of scatter-trenches assist features for the contact layer using process window simulation with different SRAF sizes and distance to the main OPC to establish the trends for size and placement.
Proceedings ArticleDOI

Roughness measurement of 2D curvilinear patterns: challenges and advanced methodology

TL;DR: This article proposes to use a dedicated edge detection algorithm to measure LER of 2D curvilinear patterns on CD-SEM images with excellent correlation between the input roughness parameters and the measured parameters for both 1D and 2D synthetic images.
Proceedings ArticleDOI

Determining the validity domain of roughness measurements as a function of CD-SEM acquisition conditions

TL;DR: The goal of this study is to present the impact of the CD-SEM image acquisition conditions in the roughness measurement, and propose a method to determine the validity domain of the roughs measurements as a function of the acquisition conditions.
Proceedings ArticleDOI

193i lithography for contact doubling with grapho-epitaxy DSA: a simulation study

TL;DR: In this paper, the impact of 193i scanner variations on BCP overlay for contact doubling was studied and a grapho-epitaxy combined with cylindrical BCP is a good candidate.