We report the fabrication of transparent field-effect transistors using a single-crystalline thin-film transparent oxide semiconductor, InGaO 3 (ZnO) 5 , as an electron channel and amorphous hafnium oxide as a gate insulator. The device exhibits an on-to-off current ratio of ∼10 6 and a field-effect mobility of ∼80 square centimeters per volt per second at room temperature, with operation insensitive to visible light irradiation. The result provides a step toward the realization of transparent electronics for next-generation optoelectronics.

http://science.sciencemag.org/content/sci/300/5623/1269.full.pdf

Thin-Film Transistor Fabricated in Single-Crystalline Transparent Oxide Semiconductor

The demand for compact ultraviolet laser devices is increasing, as they are essential in applications such as optical storage, photocatalysis, sterilization, ophthalmic surgery and nanosurgery. Many researchers are devoting considerable effort to finding materials with larger bandgaps than that of GaN. Here we show that hexagonal boron nitride (hBN) is a promising material for such laser devices because it has a direct bandgap in the ultraviolet region. We obtained a pure hBN single crystal under high-pressure and high-temperature conditions, which shows a dominant luminescence peak and a series of s-like exciton absorption bands around 215 nm, proving it to be a direct-bandgap material. Evidence for room-temperature ultraviolet lasing at 215 nm by accelerated electron excitation is provided by the enhancement and narrowing of the longitudinal mode, threshold behaviour of the excitation current dependence of the emission intensity, and a far-field pattern of the transverse mode.

Direct-bandgap properties and evidence for ultraviolet lasing of hexagonal boron nitride single crystal.

A natural superlattice homologous single crystal thin film, characterized in that it comprises a composite oxide which is represented by the formula M1M2O3(ZnO)m, wherein M1 is at least one of Ga, Fe, Sc, In, Lu, Yb, Tm, Er, Ho and Y, M2 is at least one of Mn, Fe, Ga, In and Al, and m is a natural number of 1 or more, and has been grown epitaxially on an epitaxial thin film formed on a single crystal substrate, or on said single crystal substrate from which said epitaxial thin film has disappeared, or on a ZnO single crystal; a method for preparing the natural superlattice thin film which comprises depositing the composite oxide, and diffusing the resultant laminated film by heating it. The natural superlattice homologous single crystal thin film is suitably used in an optical device, an electronic device, an X-ray optical device and the like.

Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film

A nitride semiconductor light-emitting device has an active layer of a single-quantum well structure or multi-quantum well made of a nitride semiconductor containing indium and gallium. A first p-type clad layer made of a p-type nitride semiconductor containing aluminum and gallium is provided in contact with one surface of the active layer. A second p-type clad layer made of a p-type nitride semiconductor containing aluminum and gallium is provided on the first p-type clad layer. The second p-type clad layer has a larger band gap than that of the first p-type clad layer. An n-type semiconductor layer is provided in contact with the other surface of the active layer.

Nitride semiconductor light emitting device

The field of AlGaInN ultraviolet UV light-emitting diodes (LEDs) is reviewed, with a summary of the state-of-the-art in device performance and enumeration of applications. Performance-limiting factors for high-efficiency UV LEDs are identified and recent advances in the development of deep UV emitters are presented.

https://iopscience.iop.org/article/10.1088/0268-1242/26/1/014036/pdf

Advances in group III-nitride-based deep UV light-emitting diode technology

PROBLEM TO BE SOLVED: To obtain a semiconductor light emitting device using a gallium nitride series semiconductor, wherein the semiconductor light emitting device such as a light emitting diode or the like having a high luminous efficiency even by using a silicon substrate is obtained. SOLUTION: The semiconductor light emitting device has such a structure that the surface of an active layer 6 composed of the gallium nitride series semiconductor has the uneven structure of a pyramid shape, and the recess of this uneven structure is filled with a first clad layer 7 composed of a p-type gallium nitride series semiconductor. Preferably, the dislocation defect density of a second clad layer 5 composed of an n-type gallium nitride series semiconductor forming a part of an underlaying layer of the active layer 6 is 10 9 to 10 11 /cm 2 , and preferably, the gap of a dislocation defect in the second clad layer 5 is 120 to 170 nm. Further, preferably, the entire thickness of the underlaying layer is 3 μm or less. The active layer 6 is formed by an organic metal vapor deposition, and its film forming pressure conditions are set to atmospheric pressure or rather lower pressure than the atmospheric pressure. COPYRIGHT: (C)2005,JPO&NCIPI

Semiconductor light-emitting device

In a semiconductor light-emitting element, an underlayer is made of AlN layer, and a first cladding layer is made of an n-AlGaN layer. A light-emitting layer is composed of a base layer made of i-GaN and plural island-shaped single crystal portions made of i-AlGaInN isolated in the base layer. Then, at least one rare earth metal element is incorporated into the base layer and/or the island-shaped single crystal portions.

Semiconductor light-emitting element

We propose a procedure to grow GaN quantum dots (QDs) on AlN by using the Ga surfactant effect in plasma-assisted molecular beam epitaxy. Self-formed GaN islands were spontaneously generated under vacuum, after evaporation of the Ga bilayer stabilizing the two-dimensional GaN layer grown under Ga-rich conditions. Island characteristics (size and density) are studied as a function of the nominal amount of GaN deposited. We demonstrate that the QD density can be controlled in the 3×1010 cm−2–2×1011 cm−2 range. It is shown that beyond a given amount of GaN nominally deposited, there is a coexistence between elastic and plastic relaxation, with GaN islands being formed on a partially relaxed two-dimensional GaN layer thicker than two monolayers.

Structure of GaN quantum dots grown under “modified Stranski–Krastanow” conditions on AlN

We report on the controlled growth by molecular beam epitaxy of 20-period Si-doped GaN∕AlN quantum dot (QD) superlattices, in order to tailor their intraband absorption within the 1.3–1.55μm telecommunication spectral range. The QD size can be tuned by modifying the amount of GaN in the QDs, the growth temperature, or the growth interruption time (Ostwald ripening). By adjusting the growth conditions, QDs with height (diameter) within the range of 1–1.5nm (10–40nm), and density between 1011 and 1012cm−2 can be synthesized, fully strained on the AlN pseudosubstrate. To populate the first electronic level, silicon can be incorporated into the QDs without significant perturbation of the QD morphology. All the samples exhibit strong p-polarized intraband absorption at room temperature. The broadening of the absorption peak remains below 150meV and can be as small as ∼80meV. This absorption line is attributed to transition from the s ground level of the QD to the first excited level along the growth axis, pz. ...

Si-doped GaN /AlN quantum dot superlattices for optoelectronics at telecommunication wavelengths

Al0.26Ga0.74N∕AlN∕GaN heterostructures with 1-nm-thick AlN interfacial layers were grown on 100-mm-diam epitaxial AlN/sapphire templates and sapphire substrates by metalorganic vapor phase epitaxy. It was found that AlN/sapphire templates significantly enhanced the electron mobility of the two-dimensional electron gas (2DEG) confined at the GaN channel. This can be explained by the high-crystal-quality GaN channel realized by the use of epitaxial AlN/sapphire templates as substrates. The very high Hall mobilities of approximately 2100cm2∕Vs at room temperature and approximately 17000cm2∕Vs at 77K with a 2DEG density of approximately 1×1013∕cm2 were uniformly obtained for AlGaN∕AlN∕GaN heterostructures on 100-mm-diam epitaxial AlN/sapphire templates. The Hall mobility of AlGaN∕AlN∕GaN heterostructures on epitaxial AlN/sapphire templates reached a very high value of 25500cm2∕Vs at 15K.

Mitsuhiro Tanaka

Papers

Semiconductor light-emitting device

Semiconductor light-emitting element

Structure of GaN quantum dots grown under “modified Stranski–Krastanow” conditions on AlN

Si-doped GaN /AlN quantum dot superlattices for optoelectronics at telecommunication wavelengths

High-electron-mobility AlGaN∕AlN∕GaN heterostructures grown on 100-mm-diam epitaxial AlN/sapphire templates by metalorganic vapor phase epitaxy