Gallium-nitride power transistor (GaN HEMT) and integrated circuit technologies have matured dramatically over the last few years, and many hundreds of thousands of devices have been manufactured and fielded in applications ranging from pulsed radars and counter-IED jammers to CATV modules and fourth-generation infrastructure base-stations. GaN HEMT devices, exhibiting high power densities coupled with high breakdown voltages, have opened up the possibilities for highly efficient power amplifiers (PAs) exploiting the principles of waveform engineered designs. This paper summarizes the unique advantages of GaN HEMTs compared to other power transistor technologies, with examples of where such features have been exploited. Since RF power densities of GaN HEMTs are many times higher than other technologies, much attention has also been given to thermal management-examples of both commercial “off-the-shelf” packaging as well as custom heat-sinks are described. The very desirable feature of having accurate large-signal models for both discrete transistors and monolithic microwave integrated circuit foundry are emphasized with a number of circuit design examples. GaN HEMT technology has been a major enabler for both very broadband high-PAs and very high-efficiency designs. This paper describes examples of broadband amplifiers, as well as several of the main areas of high-efficiency amplifier design-notably Class-D, Class-E, Class-F, and Class-J approaches, Doherty PAs, envelope-tracking techniques, and Chireix outphasing.

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A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICs

In this article, a thorough overview of behavioral modeling and predistortion of dynamic nonlinearities in RF PAs and transmitters was presented. The sensitivity of the DUT behavior to the characteristics of the stimulus was reviewed to ensure appropriate conditions for accurate observation. Nearly all state-of-the-art behavioral models were described and their relative performance and complexity discussed. Similarities and specifics of behavioral modeling and digital predistortion were presented. Thereby, digital predistortion can be seen as a behavioral modeling problem for which performance assessment is much more straightforward. For DUT behavioral modeling, there is no comprehensive metric that allows the model performance evaluation while taking into account the model accuracy in predicting all the three components of the DUT behavior (in-band distortion, static nonlinearity and memory effects). Finally, a software digital predistortion solution that enables closed-loop wideband linearization was briefly presented with excellent linearization capabilities when amplifying a 12-carrier 60-MHZ wide WCDMA signal.

Behavioral modeling and predistortion

Introduction - signal pertubation IMD characterization techniques nonlinear analysis techniques nonlinear device modelling highly linear circuit design.

Intermodulation Distortion in Microwave and Wireless Circuits

Preface. About the Authors. Acknowledgments. 1 Power Amplifier Fundamentals. 1.1 Introduction. 1.2 Definition of Power Amplifier Parameters. 1.3 Distortion Parameters. 1.4 Power Match Condition. 1.5 Class of Operation. 1.6 Overview of Semiconductors for PAs. 1.7 Devices for PA. 1.8 Appendix: Demonstration of Useful Relationships. 1.9 References. 2 Power Amplifier Design. 2.1 Introduction. 2.2 Design Flow. 2.3 Simplified Approaches. 2.4 The Tuned Load Amplifier. 2.5 Sample Design of a Tuned Load PA. 2.6 References. 3 Nonlinear Analysis for Power Amplifiers. 3.1 Introduction. 3.2 Linear vs. Nonlinear Circuits. 3.3 Time Domain Integration. 3.4 Example. 3.5 Solution by Series Expansion. 3.6 The Volterra Series. 3.7 The Fourier Series. 3.8 The Harmonic Balance. 3.9 Envelope Analysis. 3.10 Spectral Balance. 3.11 Large Signal Stability Issue. 3.12 References. 4 Load Pull. 4.1 Introduction. 4.2 Passive Source/Load Pull Measurement Systems. 4.3 Active Source/Load Pull Measurement Systems. 4.4 Measurement Test-sets. 4.5 Advanced Load Pull Measurements. 4.6 Source/Load Pull Characterization. 4.7 Determination of Optimum Load Condition. 4.8 Appendix: Construction of Simplified Load Pull Contours through Linear Simulations. 4.9 References. 5 High Efficiency PA Design Theory. 5.1 Introduction. 5.2 Power Balance in a PA. 5.3 Ideal Approaches. 5.4 High Frequency Harmonic Tuning Approaches. 5.5 High Frequency Third Harmonic Tuned (Class F). 5.6 High Frequency Second Harmonic Tuned. 5.7 High Frequency Second and Third Harmonic Tuned. 5.8 Design by Harmonic Tuning. 5.9 Final Remarks. 5.10 References. 6 Switched Amplifiers. 6.1 Introduction. 6.2 The Ideal Class E Amplifier. 6.3 Class E Behavioural Analysis. 6.4 Low Frequency Class E Amplifier Design. 6.5 Class E Amplifier Design with 50# Duty-cycle. 6.6 Examples of High Frequency Class E Amplifiers. 6.7 Class E vs. Harmonic Tuned. 6.8 Class E Final Remarks. 6.9 Appendix: Demonstration of Useful Relationships. 6.10 References. 7 High Frequency Class F Power Amplifiers. 7.1 Introduction. 7.2 Class F Description Based on Voltage Wave-shaping. 7.3 High Frequency Class F Amplifiers. 7.4 Bias Level Selection. 7.5 Class F Output Matching Network Design. 7.6 Class F Design Examples. 7.7 References. 8 High Frequency Harmonic Tuned Power Amplifiers. 8.1 Introduction. 8.2 Theory of Harmonic Tuned PA Design. 8.3 Input Device Nonlinear Phenomena: Theoretical Analysis. 8.4 Input Device Nonlinear Phenomena: Experimental Results. 8.5 Output Device Nonlinear Phenomena. 8.6 Design of a Second HT Power Amplifier. 8.7 Design of a Second and Third HT Power Amplifier. 8.8 Example of 2nd HT GaN PA. 8.9 Final Remarks. 8.10 References. 9 High Linearity in Efficient Power Amplifiers. 9.1 Introduction. 9.2 Systems Classification. 9.3 Linearity Issue. 9.4 Bias Point Influence on IMD. 9.5 Harmonic Loading Effects on IMD. 9.6 Appendix: Volterra Analysis Example. 9.7 References. 10 Power Combining. 10.1 Introduction. 10.2 Device Scaling Properties. 10.3 Power Budget. 10.4 Power Combiner Classification. 10.5 The T-junction Power Divider. 10.6 Wilkinson Combiner. 10.7 The Quadrature (90 ) Hybrid. 10.8 The 180 Hybrid (Ring Coupler or Rat-race). 10.9 Bus-bar Combiner. 10.10 Other Planar Combiners. 10.11 Corporate Combiners. 10.12 Resonating Planar Combiners. 10.13 Graceful Degradation. 10.14 Matching Properties of Combined PAs. 10.15 Unbalance Issue in Hybrid Combiners. 10.16 Appendix: Basic Properties of Three-port Networks. 10.17 References. 11 The Doherty Power Amplifier. 11.1 Introduction. 11.2 Doherty's Idea. 11.3 The Classical Doherty Configuration. 11.4 The 'AB-C' Doherty Amplifier Analysis. 11.5 Power Splitter Sizing. 11.6 Evaluation of the Gain in a Doherty Amplifier. 11.7 Design Example. 11.8 Advanced Solutions. 11.9 References. Index.

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High Efficiency RF and Microwave Solid State Power Amplifiers

The combination of the unique properties of graphene with new device concepts and nanotechnology can overcome some of the main limitations of traditional electronics in terms of maximum frequency, linearity, and power dissipation. In this letter, we demonstrate the use of the ambipolar-transport properties of graphene for the fabrication of a new kind of RF mixer device. Due to the symmetrical ambipolar conduction in graphene, graphene-based mixers can effectively suppress odd-order intermodulations and lead to lower spurious emissions in the circuit. The mixer operation was demonstrated at a frequency of 10 MHz using graphene grown by chemical vapor deposition on a Ni film and then transferred to an insulating substrate. The maximum operating frequency was limited by the device geometry and the measurement setup, and a high-quality factor was observed with a third-order intercept point of +13.8 dBm.

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Graphene-Based Ambipolar RF Mixers

In this paper, large-signal intermodulation distortion (IMD) sweet spots in microwave power amplifiers are studied and predicted using a new mathematical basis. The variations in the IMD versus drive pattern with active bias point and the terminating matching networks are investigated. This nonlinear distortion model enabled the design of power amplifiers specially tailored to present a desired IMD versus drive-level pattern. For practical validation purposes, a MESFET case study and an illustrative application example are presented.

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Large- and small-signal IMD behavior of microwave power amplifiers

A comprehensive analysis of various techniques currently used for assessing microwave components' nonlinear distortion behavior is presented in this paper. The output of a third-order system subject to a two- or three-tone input is given, and then used as the comparison reference for studying the response to a general multitone or random excitation. Theoretical results thus obtained allowed the generalization of standard two-tone intermodulation (IMD) figures of merit, to multitone IMD ratio, multitone or noise adjacent channel power ratio, and noise power ratio (NPR). This approach proved that normal NPR tests produce optimistic results that can be as large as 7 dB when evaluating in-band co-channel power interference.

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On the use of multitone techniques for assessing RF components' intermodulation distortion

This paper presents a comprehensive analysis of nonlinear intermodulation distortion (IMD) behavior in RF CMOS power amplifiers (PAs). Separate analyses are presented for small- and large-signal operation regimes. Especially, a new, simple, large-signal behavioral IMD analysis method is presented that allows the mechanisms dominant for IMD generation to be identified and their individual contributions to be studied. By combining these analyses, typical IMD versus input power characteristics of MOSFET PAs can be predicted and understood for different classes of operation. Various measurements made on a 950-MHz RF CMOS PA are used to demonstrate typical behavior and validate the proposed theory. Prediction of IMD using a standard CMOS transistor model is also evaluated and is shown to give good agreement with the measurements.

A comprehensive analysis of IMD behavior in RF CMOS power amplifiers

In this paper, the intermodulation distortion (IMD) behavior of LDMOS transistors is treated. First, an analysis is performed to explain measured IMD characteristics in different classes of operation. It is shown that the turn-on region plays an important role in explaining measured IMD behavior, which may also give a clue to the excellent linearity of LDMOS transistors. Thereafter, with this knowledge, a new empirical large-signal model with improved capability of predicting IMD in LDMOS amplifiers is presented. The model is verified against various measurements at low as well as high frequency in a class-AB power amplifier circuit.

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Prediction of IMD in LDMOS transistor amplifiers using a new large-signal model

Computer simulation of general microwave nonlinear circuits excited by a large number of input tones is addressed, The algorithm, based on the spectral-balance method, uses novel index-vector and convolution-matrix generation techniques. That, in conjunction with a new nonlinear-device modeling approach (which directly takes into account the higher order derivatives of the I/V and Q/V characteristics), allowed the prediction of such complex behavior as spectral regrowth and noise-power ratio (NPR) tests of a class-B power amplifier or multitone intermodulation phenomena in a saturated multioctave amplifier.

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N.B. de Carvalho

Papers

Large- and small-signal IMD behavior of microwave power amplifiers

On the use of multitone techniques for assessing RF components' intermodulation distortion

A comprehensive analysis of IMD behavior in RF CMOS power amplifiers

Prediction of IMD in LDMOS transistor amplifiers using a new large-signal model

Multitone frequency-domain simulation of nonlinear circuits in large- and small-signal regimes