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Numerical Heat Transfer And Fluid Flow

Review on high heat flux flow boiling of refrigerants and water for electronics cooling

Experimental study of free-surface jet impingement heat transfer with molten salt

Computational study of PCM cooling for electronic circuit of smart-phone

In the modern scenario of the automobile industry there is a translation from conventional fuel vehicles to electric vehicles as a set to reduce carbon percentage. High power Lithium-ion batteries are the main power source of this vehicle to drive the powertrain, but due to the natural influence of various hot environmental conditions, there is a significant reduction in mileage of vehicle which is not desirable because a lithium-ion battery pack covers 50 to 60% whole cost of vehicle. To tackle this problem from recent years there are several types of research have been performed over active and passive thermal management techniques in which passive thermal management system is widely growth from recent years due to its numerous working advantages with the low-cost application. In the present study, we performed PCM based passive thermal management study over 60 Cell 18,650 Lithium-ion battery packs which are considered to be working for automobile applications. The high-power energy density battery is submerged with a layer of PCM to investigate the delay effect caused by the battery pack to resists the set limit of the threshold temperature range. The output field results from numerical investigation are predicted using neural network approach in which a multi-objective optimization strategy is proposed between battery pack delay effect for selected paraffin wax and RT-18 PCM against its given C-rate. furthermore, liquid fraction rate is monitored for the fixed temperature limit in varying C-rate condition, for optimization strategy Fixed temperature is taken as a function for time delay by PCM addition with liquid fraction rate of PCM over the varying C-rate condition. Correlations suggest paraffin wax is the best choice for a set temperature limit below 60 °C because paraffin wax is found to be melted faster and acts as a resistance to increase the temperature of the cell. The best fit line from the linear regression model using neural network approach suggest best fit line as the time delay is the function of liquid fraction rate over the selected PCM configuration. The highest time delay is occurred in case of paraffin wax PCM as 11,900 s for 1C rate and lowest time delay is occurred as 10,000 s for 1C rate in case of RT-18.

Phase change material based passive battery thermal management system to predict delay effect

The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200 600 W/cm2) for cooling of electronic components. The type of working fluids (Water / Fluorocarbon liquids / Dielectric fluids / Nanofluids) used for cooling, mode of heat transfer (Natural / Forced / Mixed) from electronic components, and the method of analysis (Experimental / Numerical / Combination of both) greatly influence the cooling mechanism. The electronic components considered in the present study are limited to microelectronic chips, VLSI circuit chips, integrated circuits (IC) chips and resistors. Most of the literature is pertinent to cooling of square heat sources, and many of the researchers have also focused on the comparative studies using different working fluids. Results suggest that Fluorocarbon liquids can be used for higher heat flux removal due to their high boiling point. The temperature drop obtained from the electronic components using liquid jet impingement was found to be in the range of 80 85oC.

/pdf/a-review-on-cooling-of-discrete-heated-modules-using-liquid-56jeqf9rgw.pdf

A review on cooling of discrete heated modules using liquid jet impingement

The study has focused on the role of working fluids (air, water and FC-72) on the cooling of discrete heated modules under free, forced and mixed convection medium. Three non-identical protruding discrete heat sources are arranged at different positions on a substrate board following golden mean ratio (GMR). Numerical simulations for these heat sources are carried out using a commercial software (ANSYS-Icepak R-15) to simulate their flow and temperature fields under three different modes of heat transfer.
 Results suggest that the temperature of the heat sources is a strong function of their size, position on the substrate board, the velocity of the fluid and type of working fluid used. A correlation has been proposed for the temperature of these heat sources keeping in mind their strong dependence on the afore-mentioned parameters. It has been found that water can be used for better heat removal from the heat sources due to its high boiling point. The whole idea gives a clear insight to the electronic cooling engineers regarding the selection of working fluids and modes of heat transfer for the cooling of electronic components.

/pdf/role-of-working-fluids-on-the-cooling-of-discrete-heated-3uqmj8cmze.pdf

Role of working fluids on the cooling of discrete heated modules: a numerical approach

Three-dimensional steady state numerical simulations are carried out from seven protruding IC chips (Aluminium) of different sizes mounted at various positions on a high-power SMPS board (Bakelite)...

A combined numerical simulation and optimization model for the cooling of IC chips under forced convection

The paper emphasizes the numerical investigation to analyse the three modes of conjugate convective heat transfer characteristics from seven non-identical heat sources (Aluminium) mounted on a substrate board (Bakelite). The objective is to determine the best mode of heat transfer which suits for cooling of ICs (heat sources), also temperature is non-dimensionalized as (θ), and it is predicted by applying fuzzy logic control. To accomplish this, numerical simulations are carried out using ANSYS Icepak to estimate the temperature distribution of the IC chips. Results suggest that the mixed convection is the better mode of heat transfer and the temperature of heat sources is reduced. Temperature of the heat sources is a strong function of their size and position on the substrate board. There is a strong agreement between the numerical values of ANSYS Icepak and predicted values obtained from fuzzy logic.

Convective Heat Transfer on the Optimum Spacing of High Heat Dissipating Heat Sources—A Numerical Approach

The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine nonidentical elec...

Naveen G. Patil

Papers

A review on cooling of discrete heated modules using liquid jet impingement

Role of working fluids on the cooling of discrete heated modules: a numerical approach

A combined numerical simulation and optimization model for the cooling of IC chips under forced convection

Convective Heat Transfer on the Optimum Spacing of High Heat Dissipating Heat Sources—A Numerical Approach

Effect of thermal conductivity of substrate board for temperature control of electronic components: A numerical study