Journal ArticleDOI
A combined numerical simulation and optimization model for the cooling of IC chips under forced convection
TLDR
In this paper, three-dimensional steady state numerical simulations are carried out from seven protruding IC chips (Aluminium) of different sizes mounted at various positions on a high-power SMPS board (Bakelite).Abstract:
Three-dimensional steady state numerical simulations are carried out from seven protruding IC chips (Aluminium) of different sizes mounted at various positions on a high-power SMPS board (Bakelite)...read more
Citations
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Numerical Heat Transfer And Fluid Flow
TL;DR: The numerical heat transfer and fluid flow is universally compatible with any devices to read and is available in the authors' digital library an online access to it is set as public so you can get it instantly.
Journal ArticleDOI
Effect of thermal conductivity of substrate board for temperature control of electronic components: A numerical study
TL;DR: In this paper, the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine non-identical elec...
Journal ArticleDOI
Heat Transfer Characteristics of High Heat Generating Integrated Circuit Chips Cooled Using Liquid Cold Plate—A Combined Numerical and Experimental Study
TL;DR: In this article, the experimental and numerical investigations of seven integrated circuit (IC) chips cooled using the water flowing inside the cold plate at different flowrates were carried out using the commercial software ansys fluent (R-16).
Book ChapterDOI
Role of Constrained Optimization Technique in the Hybrid Cooling of High Heat Generating IC Chips Using PCM-Based Mini-channels
TL;DR: In this paper, transient numerical simulations on seven asymmetric IC chips kept next to the LRBT and LRB mini-channels fabricated on the SMPS board using the three different phase change materials (PCMs); Suntech P116 (Tm: 49.5 °C), Paraffin wax (tm: 44 °C) and n-eicosane (tmt: 40.5°C).
Journal ArticleDOI
Simulation design for thermal model from various materials in electronic devices: A review
TL;DR: In this paper , the authors provide an overview of the simulation work focusing on the heat transfer in the various design of electronic devices, and also provide insights into challenges in simulation work with available opportunities to solve the heattransfer issue by understanding fundamental knowledge.
References
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Numerical Heat Transfer And Fluid Flow
TL;DR: The numerical heat transfer and fluid flow is universally compatible with any devices to read and is available in the authors' digital library an online access to it is set as public so you can get it instantly.
Journal Article
Cooling of a multichip electronic module by means of confined two-dimensional jets of dielectric liquid
D. C. Wadsworth,Issam Mudawar +1 more
TL;DR: In this article, single-phase heat transfer from a smooth 12.7×12.7 mm 2 simulated chip to a two-dimensional jet of dielectric Fluorinert FC-72 liquid issuing from a thin rectangular slot into a channel confined between the chip surface and nozzle plate was investigated.
Journal ArticleDOI
Optimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets
Matteo Fabbri,Vijay K. Dhir +1 more
TL;DR: In this article, the authors investigated the heat transfer under arrays of microjets, using deionized water and FC40 as test fluids, achieving a maximum surface heat flux of 310W∕cm2 with water jets of 173.6μm diameter and 3mm spacing, impinging at 12.5m∕s on a circular 19mm diameter copper surface.
Journal ArticleDOI
Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid
D. C. Wadsworth,Issam Mudawar +1 more
TL;DR: In this paper, the authors investigated single-phase heat transfer from a smooth 12.7 mm-sup 2 -simulated chip to a two-dimensional jet of dielectric Fluorinert FC-72 liquid issuing from a thin rectangular slot into a channel confined between the chip surface and nozzle plate.
Journal ArticleDOI
Conjugate natural convection from an array of discrete heat sources: part 1 — two- and three-dimensional model validation
TL;DR: In this paper, two-and three-dimensional numerical models have been developed for conjugate natural convection in a discretely heated cavity and the nature and extent of 3D effects on the flow and heat transfer have been delineated.
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