Journal ArticleDOI
Effect of thermal conductivity of substrate board for temperature control of electronic components: A numerical study
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In this paper, the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine non-identical elec...Abstract:
The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine nonidentical elec...read more
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Journal ArticleDOI
Computational study of PCM cooling for electronic circuit of smart-phone
TL;DR: A passive phase change material cooling strategy is proposed which can utilize the advantage of isotopic heat conduction from the electronic element to give an optimum cooling strategy over the electronic aspect which help in keeping the temperature of the electronicelement below 85 °C.
Journal ArticleDOI
Phase change material based passive battery thermal management system to predict delay effect
TL;DR: In this article, the authors performed PCM-based passive thermal management study over 60 Cell 18,650 lithium-ion battery packs which are considered to be working for automobile applications, and the output field results from numerical investigation are predicted using neural network approach in which a multi-objective optimization strategy is proposed between battery pack delay effect for selected paraffin wax and RT-18 PCM against its given C-rate.
Book ChapterDOI
Role of Phase Change Material Thermal Conductivity on Predicting Battery Thermal Effectiveness for Electric Vehicle Application
TL;DR: In this article , the performance of the battery with N-Eicosane and paraffin wax was investigated for a 5S3P having a maximum 18.6 A at 2-C rate output battery pack.
Journal ArticleDOI
Thermal Control of IC chips using phase change material: A CFD Investigation
Anant Sidhappa Kurhade,G. Murali +1 more
TL;DR: In this paper , the authors provide an implicit transient numerical formulation of novel minichannel-coupled passive thermal arrangement to cool down unidentical IC chips on substrate board.
Journal ArticleDOI
Temperature Curve of Reflow Furnace Based on Newton's Law of Cooling
TL;DR: In this paper , the authors used Newton's law of cooling to establish the mechanism model of the temperature of each zone of the furnace and the curve of furnace temperature, which can reduce the number of experiments in actual production and obtain a better furnace temperature curve.
References
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Journal ArticleDOI
Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection
V. K. Mathew,Tapano Kumar Hotta +1 more
TL;DR: In this paper, the authors investigate numerically the mixed convection heat transfer characteristics from seven non-identical IC chips (Aluminium) mounted on a Switch Mode Power Supply (SMPS) board (substrate) made by FR-4 (glass-reinforced epoxy laminate material).
Journal ArticleDOI
Hybrid microchannel/multi-jet two-phase heat sink: A benchmark and geometry optimization study of commercial product
Cong Hiep Hoang,Srikanth Rangarajan,Sadegh Khalili,Bharath Ramakrisnan,Vahideh Radmard,Yaser Hadad,Scott N. Schiffres,Bahgat Sammakia +7 more
TL;DR: In this paper, an experimental study of two-phase cooling heat sink using the dielectric working fluid Novec/HFE-7000 is performed, where liquid flow is directed into microchannel fins through multiple impinging jets.
Journal ArticleDOI
Numerical investigation of natural and mixed convection heat transfer on optimal distribution of discrete heat sources mounted on a substrate
TL;DR: In this paper, the numerical investigation of natural and mixed convection heat transfer on optimal distribution of five non-identical protruding discrete heat sources (Aluminium) mounted on a substrate (Bakelite) board was conducted.
Journal ArticleDOI
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
Yaser Hadad,Vahideh Radmard,Srikanth Rangarajan,Mahdi Farahikia,Gamal Refai-Ahmed,Paul R. Chiarot,Bahgat Sammakia +6 more
TL;DR: In this paper, the authors demonstrate a novel concept to remotely cool chips with hotspots and maximize chip temperature uniformity using an optimized flow distribution under constrained geometric parameters for the heatsink.
Journal ArticleDOI
A combined numerical simulation and optimization model for the cooling of IC chips under forced convection
TL;DR: In this paper, three-dimensional steady state numerical simulations are carried out from seven protruding IC chips (Aluminium) of different sizes mounted at various positions on a high-power SMPS board (Bakelite).
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