scispace - formally typeset
N

Niels Roelof Tas

Researcher at University of Twente

Publications -  181
Citations -  4755

Niels Roelof Tas is an academic researcher from University of Twente. The author has contributed to research in topics: Wafer & Lithography. The author has an hindex of 33, co-authored 170 publications receiving 4377 citations. Previous affiliations of Niels Roelof Tas include École Polytechnique Fédérale de Lausanne & MESA+ Institute for Nanotechnology.

Papers
More filters
Journal ArticleDOI

Stiction in surface micromachining

TL;DR: In this article, four major adhesion mechanisms have been analyzed: capillary forces, hydrogen bridging, electrostatic forces and van der Waals forces, and they have been successfully reduced.
Journal ArticleDOI

Capillary filling speed of water in nanochannels

TL;DR: In this paper, the authors measured the capillary filling speed of water in nanochannels with a rectangular cross section and a height on the order of 100 nm over a length of 1 cm, and the measured position of the meniscus as a function of time qualitatively follows the Washburn model.
Journal ArticleDOI

Micro-liquid flow sensor

TL;DR: In this paper, a simple to realize micro-liquid flow sensor with high sensitivity is presented, based on well known thermal anemometer principles, and an analytical model for the sensor behaviour applicable for gas/liquid fluids is presented.
Journal ArticleDOI

Capillarity Induced Negative Pressure of Water Plugs in Nanochannels

TL;DR: In this paper, the negative pressure of water plugs in nanochannels induces bending of the thin channel capping layer, which results in a visible curvature of the liquid meniscus.
Journal ArticleDOI

The effect of surface roughness on direct wafer bonding

TL;DR: In this paper, the effect of surface microroughness on the bondability was studied on the basis of the theory of contact and adhesion of elastic solids, and an effective bonding energy, the maximum of which is the specific surface energy of adhesion, was proposed to describe the real binding energy of the bonding interface.