Showing papers by "Paul W. Marshall published in 2008"

Low Energy Proton Single-Event-Upset Test Results on 65 nm SOI SRAM

Abstract: Experimental results are presented on proton induced single-event-upsets (SEU) on a 65 nm silicon-on-insulator (SOI) SRAM. The low energy proton SEU results are very different for the 65 nm SRAM as compared with SRAMs fabricated in previous technology generations. Specifically, no upset threshold is observed as the proton energy is decreased down to 1 MeV; and a sharp rise in the upset cross-section is observed below 1 MeV. The increase below 1 MeV is attributed to upsets caused by direct ionization from the low energy protons. The implications of the low energy proton upsets are discussed for space applications of 65 nm SRAMs; and the implications for radiation assurance testing are also discussed.

Laser-Induced Current Transients in Silicon-Germanium HBTs

Abstract: Device-level current transients are induced by injecting carriers using two-photon absorption from a subbandgap pulsed laser and recorded using wideband transmission and measurement equipment. These transients exhibit three distinct temporal trends that depend on laser pulse energy as well as the transverse and vertical charge generation location. The nature of the current transient is controlled by both the behavior of the subcollector-substrate junction and isolation biasing. However, substrate potential modulation, due to deformation of the subcollector-substrate depletion region, is the dominant mechanism affecting transient characteristics.

Single Event Upset Mechanisms for Low-Energy-Deposition Events in SiGe HBTs

Abstract: Microbeam measurements and TCAD simulations are used to examine the effects of ion angle of incidence on the charge collected from events occurring in a Silicon Germanium (SiGe) Heterojunction Bipolar Transistor (HBT). The results identify the geometrically driven charge-collection mechanisms that dominate the low LET broad beam SEU response. The deep trench isolation that surrounds the transistor significantly modulates the charge transport and, therefore, the charge collected by the collector. A new way of estimating critical charge, , for upset in SiGe HBT circuits is proposed based on TCAD simulation results and measured broadbeam data.

Proton-induced SEU in SiGe digital logic at cryogenic temperatures

Abstract: We present the first experimental results confirming the increased SEE sensitivity of SiGe digital bipolar logic circuits operating in a 63 MeV proton environment at cryogenic temperatures. A 3× increase in both the error-event and bit-error cross sections is observed as the circuits are cooled from 300 K to 77 K, with error signature analyses indicating corresponding increases in the average number of bits-in-error and error length over data rates ranging from 50 Mbit/s to 4 Gbit/s. Single-bit-errors dominate the proton-induced SEU response at both 300 K and 77 K, as opposed to the multiple-bit-errors seen in the heavy-ion SEU response. Temperature dependent substrate carrier lifetime measurements, when combined with calibrated 2 D DESSIS simulations, suggest that the increased transistor charge collection at low temperature is a mobility driven phenomenon. Circuit-level RHBD techniques are shown to be very efficient in mitigating the proton- induced SEU at both 300 K and 77 K over the data rates tested. These results suggest that the circuit operating temperature must be carefully considered during component qualification for SEE tolerance and indicate the need for broad-beam heavy-ion testing at low temperatures.

3-D Mixed-Mode Simulation of Single Event Transients in SiGe HBT Emitter Followers and Resultant Hardening Guidelines

Abstract: This work presents 3-D mixed-mode simulation results of single event transients (SET) in SiGe HBT emitter followers. The impact of circuit design parameters, including biasing current and resistance are detailed. A simple increase of biasing emitter current is shown to be ineffective for hardening. Instead, during SET, the emitter voltage upset simply follows the base voltage upset due to the inherent nature of the emitter follower topology during circuit operation. The duration and the peak value of the base voltage upset are determined by the impedance and electric field between collector and base. As a result, the use of a smaller base biasing resistance is desirable for reducing SETs in emitter followers.

Novel Total Dose and Heavy-Ion Charge Collection Phenomena in a New SiGe HBT on >Thin-Film SOI Technology

Abstract: We investigate radiation-induced effects on the DC, AC and thermal characteristics of high-performance SiGe HBTs fabricated on thin-film SOI. TCAD simulations indicate novel heavy-ion charge collection phenomena resulting from the unique CBEBC device layout of this technology platform.

On the Radiation Tolerance of SiGe HBT and CMOS-Based Phase Shifters for Space-Based, Phased-Array Antenna Systems

Abstract: We report the first irradiation results on high-frequency SiGe HBT and CMOS phase shifters for space-based, phased-array antennas used in radar or wireless communication systems. Both phase shifter circuits remain functional with acceptable dc and RF performance up to multi-Mrad proton exposure, and are thus suitable for many orbital applications. In addition, simulation results probing the limits of phase shifter performance in a radiation environment are presented. These results show that both CMOS and SiGe HBT based phase shifters can be used for space-based applications without any specific radiation hardening techniques.

Impact of Proton Irradiation on the RF Performance of 65 nm SOI CMOS Technology

Abstract: The effects of 63 MeV proton irradiation on 65nm Silicon-On-Insulator (SOI) CMOS technology are presented for the first time. The radiation response of the CMOS devices was investigated up to an equivalent total gamma dose of 4.1 Mrad (SiO2). We analyze the implications of proton irradiation on RF performance of these devices. The cut-off frequency is degraded due to post-irradiation degradation of device transconductance. High-frequency measurements show that the input and output matching conditions are not affected, up to a cumulative dose of 4.1 Mrad. The implications of proton irradiation on device design constraints, particularly device width and number of gate fingers, are discussed in the context of high performance RF CMOS technology. These results suggest that the higher finger width devices, of sufficient gate width, are well-suited for the development of total-dose radiation tolerant analog and RF circuits without additional radiation hardening.

The Effects of Proton Irradiation on the Performance of High-Voltage n-MOSFETs Implemented in a Low-Voltage SiGe BiCMOS Platform

Abstract: This paper presents the first comprehensive investigation of the impact of proton irradiation on the performance of high-voltage (HV) nMOS transistors implemented in a low-voltage (LV) SiGe BiCMOS technology. The effects of irradiation gate bias, irradiation substrate bias, and operating substrate bias on the radiation response of these transistors are examined. Experimental results show that the radiation-induced subthreshold leakage current under different irradiation biasing conditions remains negligible after exposure to a total dose of 600 krad(Si). We find that there are differences in the radiation response of LV and HV MOSFETs, suggesting that the mechanisms involved in causing degradation in LV and HV transistors could be of fundamentally different origins.