R
R. Popp
Researcher at Fraunhofer Society
Publications - 2
Citations - 107
R. Popp is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Dielectric & Wafer. The author has an hindex of 2, co-authored 2 publications receiving 102 citations.
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Three dimensional metallization for vertically integrated circuits
D. Bollmann,R. Braun,R. Buchner,U. Cao-Minh,Manfred Engelhardt,G. Errmann,T. Grassl,K. Hieber,H. Hübner,G. Kawala,M.B. Kleiner,Armin Klumpp,S.A. Kuhn,Christof Landesberger,H. Lezec,W. Muth,Werner Pamler,R. Popp,E. Renner,G. Ruhl,A. Sanger,U. Scheler,C. Schmidt,Siegfried Dr. Rer. Nat. Schwarzl,Josef Weber,Werner Weber,Peter Ramm +26 more
TL;DR: In this article, the authors realized a three dimensional metallization for vertically integrated circuits (VIC) using a newly developed technology that allows stacking and vertical interchip wiring of completely processed and electrically tested wafers using available microelectronic processes.
Vertically integrated circuits : A key technology for future high performance systems
Manfred Engelhardt,H. Hübner,H. Jacobs,M. Kleiner,S. Kühn,W. Pamler,E. Renner,A. Sanger,U. Scheler,C. Schmidt,Siegfried Dr. Rer. Nat. Schwarzl,Werner Weber,R. Braun,T. Grassl,K. Hieber,G. Kawala,A. Klumpp,C. Landesberger,R. Popp,P. Ramn,G. Ruhl,J. Weber +21 more
TL;DR: In this article, the authors developed a 3D integration technology to realize Vertically Integrated Circuits (VIC) utilizing interchip vias for the electrical interchip connection in a wafer stack.