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Renchao Che

Researcher at Fudan University

Publications -  338
Citations -  20236

Renchao Che is an academic researcher from Fudan University. The author has contributed to research in topics: Microwave & Reflection loss. The author has an hindex of 56, co-authored 247 publications receiving 11299 citations. Previous affiliations of Renchao Che include Shanghai University.

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Insights into Growth-Oriented Interfacial Modulation within Semiconductor Multilayers.

TL;DR: In this paper, the authors found that the growth-oriented characteristic of interfacial modulation strongly determines the main regions where the modulation takes effect, where arsenic atoms modulated at the well-on-barrier interface tend to diffuse into the next-grown well layer.
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Zero-strain Ca0.4Ce0.6VO4 anode material for high capacity and long-life Na-ion batteries

TL;DR: In this article, the authors exploited a tetragonal-type Ca-Ce-V-O compound with a robust framework for stable Na+ storage, which exhibits exceptional cycling stability (ca. 97.8% capacity retention for 2000 cycles) and a reversible capacity of about 170 mA h g−1 with a safe average storage potential of ∼0.73 V (vs.
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Skyrmion bubbles stabilization in confined hole and trench materials

TL;DR: In this paper, the stabilization of magnetic skyrmion bubbles (SkBs) in confined trench and hole structures has been investigated using a high-resolution atomic force microscope, and it was shown that SkBs exhibit smaller sizes in nanoscale holes and trenches compared with that in uniform films.
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Insight into the split and asymmetry of charge distribution in biased M-structure superlattice

TL;DR: In this article, the charge distribution in real space of an insertion variant based on an InAs/GaSb superlattice for an infrared detector is illustrated by in situ electron microscopy.
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Tailorable coaxial carbon nanocables with high storage capabilities

TL;DR: In this article, coaxial nanocables were designed with the ability to be tailored into desired diameters, lengths and components through a low-cost, high-efficiency slicing process.