S. Ramanathan

Bio: S. Ramanathan is an academic researcher from Indian Institute of Technology Madras. The author has contributed to research in topic(s): Chemical-mechanical planarization & Copper. The author has an hindex of 17, co-authored 35 publication(s) receiving 1316 citation(s).

Microwave food processing—A review

Abstract: Microwave heating has vast applications in the field of food processing such as cooking, drying, pasteurization and preservation of food materials. In this article, various applications of microwave food processing such as microwave cooking, microwave pasteurization and microwave assisted drying were extensively reviewed. The advantages and the factors affecting the microwave cooking of food materials have been reviewed. Microwave pasteurization of fresh juices, milk and various food products has been elaborately discussed. Microwave pasteurization has the ability to achieve destruction of microorganisms at temperatures lesser than that of conventional pasteurization due to significant enhancement or magnification of thermal effects. Applications of microwave drying include microwave assisted hot air drying, microwave vacuum drying and microwave freeze drying. Microwave drying combined with other conventional methods of drying enhances the drying characteristics of the sole effect of microwave drying. Modeling of microwave heating of food materials based on Maxwell's equations and Lambert's law equations have been reviewed along with their applications. Microwave modeling can be used to predict the temperature and moisture distributions during microwave heating of food materials. The factors affecting the dielectric property of food material and the applications of dielectric property measurements were also discussed. Various solution strategies to overcome non-uniform temperature distribution during microwave heating of food materials were proposed. It is required to obtain better end product qualities of food materials by conducting more research at pilot scale levels. It is also necessary to eliminate hot spots or non-uniform temperature distribution during microwave heating of food materials.

Microwave material processing—a review

Abstract: Microwave heating is caused by the ability of the materials to absorb microwave energy and convert it to heat. This article represents a review on fundamentals of microwave heating and their interaction with materials for various applications in a comprehensive manner. Experimental studies of single, multimode, and variable frequency microwave processing were reviewed along with their applications. Modeling of microwave heating based on Lambert's law and Maxwell's electromagnetic field equations have also been reviewed along with their applications. Modeling approaches were used to predict the effect of resonances on microwave power absorption, the role of supports for microwave heating, and to determine the nonuniformity on heating rates. Various industrial applications on thermal processing have been reviewed. There is tremendous scope for theoretical and experimental studies on the athermal effects of microwaves. Some of the unresolved problems are identified and directions for further research are also suggested. © 2011 American Institute of Chemical Engineers AIChE J, 2012

Experimental and theoretical investigation on microwave melting of metals

Abstract: Experiments were conducted for microwave heating and melting of lead, tin, aluminium and copper with the aid of susceptors and the detailed results were presented for various microwave power levels and sample loading. Aluminium and copper samples were heated in presence of inert gas to minimize oxidation. Compared to conventional melting, microwave melting was twice as fast and more energy efficient. Lumped parameter model of the heating process showed that the conversion of microwave to thermal energy was enhanced at higher temperatures, justifying this a favourable process for metal melting applications.

Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor

Abstract: Chemical mechanical planarization of copper disks in hydrogen peroxide and l -arginine based alkaline slurry was investigated. Various commonly proposed inhibitors were screened by static etch rate experiments and only BTA and uric acid were found to be effective in the alkaline pH range, while potassium sorbate was moderately effective. The combination of arginine, hydrogen peroxide and uric acid leads to a more robust polish rate than can be achieved with glycine, hydrogen peroxide and BTA based slurries. The dissolution in presence of uric acid was further studied by potentiodynamic and cyclic polarization experiments which indicate formation of a passivation layer on the copper surface. Silicon dioxide wafers were polished to determine the Cu/silicon dioxide polish rate selectivity in alkaline pH range and a high selectivity (>100) was observed. These results indicate that it is possible to conduct a robust copper CMP with alkaline slurries while maintaining an excellent Cu/silicon dioxide polish rate selectivity.

Characterization of TMAH based cleaning solution for post Cu-CMP application

Abstract: The cleaning of copper surface after chemical mechanical planarization (CMP) process is a critical step since the surface would be contaminated by a large number of slurry particles such as silica or alumina and organic residues such as benzo triazole (BTA). The presence of organic residues results in a hydrophobic surface, which leads to problems in particle removal and drying. A major function of a post copper CMP cleaning solution is to remove these organic contaminants without significant increase in the surface roughness. Alkaline or acidic cleaning solutions are usually preferred over neutral solutions since they can remove organic residues better. The objective of this work is to formulate an alkaline cleaning solution and characterize its efficiency on particle and BTA removal. The cleaning solution studied consists of tetra methyl ammonium hydroxide (TMAH) as the cleaning agent and arginine as the chelating agent. The removal of BTA is characterized using contact angle measurements and electrochemical techniques. The proposed cleaning solution showed good ability in removing BTA and silica particles from the copper surface and also yielded a lower surface roughness. Arginine facilitates complexing of Cu ions thereby preventing redeposition.

Recent advances in Sonogashira reactions

Abstract: The coupling of aryl or vinyl halides with terminal acetylenes catalysed by palladium and other transition metals, commonly termed as Sonogashira cross-coupling reaction, is one of the most important and widely used sp2–sp carbon–carbon bond formation reactions in organic synthesis, frequently employed in the synthesis of natural products, biologically active molecules, heterocycles, molecular electronics, dendrimers and conjugated polymers or nanostructures. This critical review focuses on developments in the Sonogashira reaction achieved in recent years concerning catalysts, reaction conditions and substrates (352 references).

Microwave food processing—A review

Abstract: Microwave heating has vast applications in the field of food processing such as cooking, drying, pasteurization and preservation of food materials. In this article, various applications of microwave food processing such as microwave cooking, microwave pasteurization and microwave assisted drying were extensively reviewed. The advantages and the factors affecting the microwave cooking of food materials have been reviewed. Microwave pasteurization of fresh juices, milk and various food products has been elaborately discussed. Microwave pasteurization has the ability to achieve destruction of microorganisms at temperatures lesser than that of conventional pasteurization due to significant enhancement or magnification of thermal effects. Applications of microwave drying include microwave assisted hot air drying, microwave vacuum drying and microwave freeze drying. Microwave drying combined with other conventional methods of drying enhances the drying characteristics of the sole effect of microwave drying. Modeling of microwave heating of food materials based on Maxwell's equations and Lambert's law equations have been reviewed along with their applications. Microwave modeling can be used to predict the temperature and moisture distributions during microwave heating of food materials. The factors affecting the dielectric property of food material and the applications of dielectric property measurements were also discussed. Various solution strategies to overcome non-uniform temperature distribution during microwave heating of food materials were proposed. It is required to obtain better end product qualities of food materials by conducting more research at pilot scale levels. It is also necessary to eliminate hot spots or non-uniform temperature distribution during microwave heating of food materials.

Microwave–material interaction phenomena: Heating mechanisms, challenges and opportunities in material processing

Abstract: Efforts to use microwaves in material processing are gradually increasing. However, the phenomena associated with the processing are less understood; popular mechanisms such as dipolar heating and conduction heating have been mostly explored. The current paper reviews most of the significant phenomena that cause heating during microwave–material interaction and heat transfer during microwave energy absorption in materials. Mechanisms involved during interaction of microwave with characteristically different materials – metals, non-metals and composites (metal matrix composites, ceramic matrix composites and polymer matrix composites) have been discussed using suitable illustrations. It was observed that while microwave heating of metal based materials is due to the magnetic field based loss effects, dipolar loss and conduction loss are the phenomena associated with the electric field effects in microwave heating of non-metals. Challenges in processing of advanced materials, particularly composites have been identified from the available literature; further research directions with possible benefits have been highlighted.

Microwave-assisted synthesis of metal oxide/hydroxide composite electrodes for high power supercapacitors – A review

Abstract: Electrochemical capacitors (ECs), also known as pseudocapacitors or supercapacitors (SCs), is receiving great attention for its potential applications in electric and hybrid electric vehicles because of their ability to store energy, alongside with the advantage of delivering the stored energy much more rapidly than batteries, namely power density. To become primary devices for power supply, supercapacitors must be developed further to improve their ability to deliver high energy and power simultaneously. In this concern, a lot of effort is devoted to the investigation of pseudocapacitive transition-metal-based oxides/hydroxides such as ruthenium oxide, manganese oxide, cobalt oxide, nickel oxide, cobalt hydroxide, nickel hydroxide, and mixed metal oxides/hydroxides such as nickel cobaltite and nickel–cobalt oxy-hydroxides. This is mainly due to the fact that they can produce much higher specific capacitances than typical carbon-based electric double-layer capacitors and electronically conducting polymers. This review presents supercapacitor performance data of metal oxide thin film electrodes by microwave-assisted as an inexpensive, quick and versatile technique. Supercapacitors have established the specific capacitance (Cs) principles, therefore, it is likely that metal oxide films will continue to play a major role in supercapacitor technology and are expected to considerably increase the capabilities of these devices in near future.

Chemical mechanical planarization: slurry chemistry, materials, and mechanisms.

Abstract: 3. FEOL Applications: Device Level 180 3.1. Shallow Trench Isolation (STI) CMP 180 3.2. Replacement Metal Gate CMP 184 3.3. Poly-Si CMP for FinFET Devices 186 4. MOL Applications: Contact Level 187 4.1. Tungsten CMP 187 5. BEOL Applications: Multilevel Interconnects 188 5.1. Copper Interconnect Technology 188 5.2. CMP Challenges in Cu Interconnects 189 5.2.1. Low-k and Ultralow-k Material Challenges 189 5.2.2. Integration Challenges 190 5.2.3. CMP Process Challenges 191 5.3. Copper Planarizarion Process 191 5.4. Ta/TaN Liner CMP Process 193 6. CMP Process-Induced Defects 194 6.1. Defects in FEOL CMP 194 6.2. Defects in MOL Tungsten CMP 195 6.3. Defects in Cu BEOL CMP 195 6.3.1. Corrosion of Copper 196 6.3.2. Scratches 196 6.3.3. Dishing, Erosion, and Trenching 196 6.3.4. Mechanical Damage 197 6.3.5. Other Defects 197 7. Models of CMP Processes 198 7.1. Models Based on Contact Mechanics 198 7.2. CMP Process Models 199 8. Alternative CMP Processes 200 9. Concluding Remarks 201 10. Acknowledgments 201 11. References 201