Showing papers by "Sylwester Bargiel published in 2010"

Towards micro-assembly of hybrid MOEMS components on a reconfigurable silicon free-space micro-optical bench

Abstract: The 3D integration of hybrid chips is a viable approach for the micro-optical technologies to reduce the costs of assembly and packaging. In this paper a technology platform for the hybrid integration of MOEMS components on a reconfigurable silicon free-space micro-optical bench (FS-MOB) is presented. In this approach a desired optical component (e.g. micromirror, microlens) is integrated with a removable and adjustable silicon holder which can be manipulated, aligned and fixed in the precisely etched rail of the silicon baseplate by use of a robotic micro-assembly station. An active-based gripping system allows modification of the holder position on the baseplate with nanometre precision. The fabrication processes of the micromachined parts of the micro-optical bench, based on bulk micromachining of standard silicon wafer and SOI wafer, are described. The successful assembly of the holders, equipped with a micromirror and a refractive glass ball microlens, on the baseplate rail is demonstrated.

A two directional electrostatic comb-drive X–Y micro-stage for MOEMS applications

Abstract: We report the design, fabrication and characterization of a newly developed electrostatic silicon X – Y micro-stage with large displacement, suitable for many MOEMS including raster scanning devices. The micro-stage consists of four electrostatic comb-drive actuators driving a suspended movable platform via a system of straight spring suspensions and converting their deflections into a linear motion. Independent driving of the platform along X - and Y -direction has been achieved by employing a “stage-in-the-stage” construction of the movable structure, mechanically linked by suspended insulation bridges. Experimental characteristics have shown the large static translations of ±28 μm along X -axis and ±37 μm along Y -axis, at a driving voltage of 100 V. The resonant frequency at the fundamental mode in the X -direction (290 Hz) was lower than in the Y -direction (550 Hz) while the maximum out-of-plane displacement was measured to be 26 nm within the bandwidth of 0–5 kHz. The device was fabricated by double-side DRIE of a silicon-on-insulator (SOI) wafer with 30-μm-thick device layer. The micro-stage is intended to be integrated with micro-optical components (microlens, diffraction grating) and offers an attractive solution to build miniature and low cost 2D raster scanning modules.

Next-generation test equipment for micro-production

Abstract: The paper introduces different approaches to overcome the large ratio between wafer size and feature size in the testing step of micro production. For the inspection of Micro(Opto)ElectroMechanicalSystems (M(O)EMS) a priori information are available to optimise the inspection process. The EU-project SMARTIEHS develops a new concept for high volume M(O)EMS testing. The design of the test station and the fabrication of the first components are presented and the advancements compared to the state of the art are introduced within the following fields: micro-optical interferometer design, micro-optical production, smart-pixel camera and mechanical design. Furthermore the first demonstrators are introduced and experimental results are presented.

Assembly of 3D Reconfigurable Hybrid MOEMS through Microrobotic Approach

Abstract: Micro-assembly has been identified to be a critical technology in the microsystems technology and nanotechnology. Increasing needs of MOEMS (Micro-Opto-Electro- Mechanical Systems) for microsystems conducts to development of new concepts and skilled micro-assembly stations. This paper presents a 3D micro-assembly station used for the reconfigurable free space micro-optical benches (RFS-MOB) which are a promising type of MOEMS. Designed parts of RFS-MOB are assembled by using the developed micro-assembly station. The flexibility of the micro-assembly station provides the possibility to manipulate a variety of micro-components. The RFS-MOB design enables to reduce adhesion forces effects during releasing operations. Experimental results are shown and validate the effectiveness of the micro-assembly station and micro-assembly strategies.

Integrated glass lenses fabrication for parallel interferometric inspection systems of MEMS and MOEMS

Abstract: We present the application of glass microlenses for the fabrication of inspection systems based on interferometric measurements. The microlenses are molded from wet etched silicon by using microfabrication techniques. The concerned system requires lenses to be used in a Mirau interferometer configuration. The principle of the system is presented, as well as different choices of lenses to be integrated. The use of glass microlenses monolithically molded on a substrate is proven as the proper technology to be used in the system.

Simulation and in-plane movement characterization of 2D MEMS platform

Abstract: In the paper, we present design, numerical modeling and measurement results of silicon X-Y movable platform dedicated for miniaturized microinterferometric sensor based on grating interferometry. The structure fabricated with double-side DRIE of SOI wafer, provides independent movement in x and y directions in the distance of ±35 μm with driving voltage upto 150 V . The presented microstructure has 160 nm deep diffraction grating integrated on its surface. Small, static movement of the structure, with nanometric resolution, in direction perpendicular to the grating lines, provides phase shifting of two conjugated interfering beams. Optimization of the structure driving in order to achieve maximum movement resolution is covered in details. The in-plane displacements of the structure is characterized with common correlation method that needs no markers imprinted on its surface. Resolution of the method depends on the microscopic imaging system. The performance of the method is presented on the example of various steering modes of the platform, covering parabolic and linear displacement(voltage) characteristics.