Introduction to Electromagnetic Compatibility

https://espace.library.uq.edu.au/view/UQ:e38288a/UQe38288a_OA.pdf

High-performance SnSe thermoelectric materials: Progress and future challenge

Методы подавления шумов и помех в электронных системах. (Noise reduction techniques in electronic systems)

Introduction to the Finite-Difference Time-Domain (FDTD) Method for Electromagnetics provides a comprehensive tutorial of the most widely used method for solving Maxwell's equations -- the Finite Difference Time-Domain Method. This book is an essential guide for students, researchers, and professional engineers who want to gain a fundamental knowledge of the FDTD method. It can accompany an undergraduate or entry-level graduate course or be used for self-study. The book provides all the background required to either research or apply the FDTD method for the solution of Maxwell's equations to practical problems in engineering and science. Introduction to the Finite-Difference Time-Domain (FDTD) Method for Electromagnetics guides the reader through the foundational theory of the FDTD method starting with the one-dimensional transmission-line problem and then progressing to the solution of Maxwell's equations in three dimensions. It also provides step by step guides to modeling physical sources, lumped-circuit components, absorbing boundary conditions, perfectly matched layer absorbers, and sub-cell structures. Post processing methods such as network parameter extraction and far-field transformations are also detailed. Efficient implementations of the FDTD method in a high level language are also provided. Table of Contents: Introduction / 1D FDTD Modeling of the Transmission Line Equations / Yee Algorithm for Maxwell's Equations / Source Excitations / Absorbing Boundary Conditions / The Perfectly Matched Layer (PML) Absorbing Medium / Subcell Modeling / Post Processing

Introduction to the Finite-Difference Time-Domain (Fdtd) Method for Electromagnetics

Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can he used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.

/pdf/investigation-of-fundamental-emi-source-mechanisms-driving-2v86hmhn28.pdf

Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

Investigation of a server shows the heatsink of the CPU module as a primary component of the EMI coupling path. In order to identify the specific noise source and coupling path to the heatsink, a series of experiments were defined to provide support for one source and eliminate others. Based on experiments with two different versions of the CPU module, a stack-up related design guideline is proposed: a ground layer should be the first entire plane (as opposed to V/sub cc/) on the active component side of the board. If there are known IC sources that switch significant currents with the outputs unloaded at nanosecond rise and fall times on both sides of the board, then ground should be the first entire plane on both sides of the board when feasible.

/pdf/an-impact-of-layer-stack-up-on-emi-1htjpvrc3a.pdf

An impact of layer stack-up on EMI

Anthropologists recognize the importance of conceptualizing health in the context of the mutually evolving nature of biology and culture through the biocultural approach, but biocultural anthropological perspectives of infectious diseases and their impacts on humans (and vice versa) through time are relatively underrepresented. Tuberculosis (TB) has been a constant companion of humans for thousands of years and has heavily influenced population health in almost every phase of cultural and demographic evolution. TB in human populations has been dramatically influenced by behavior, demographic and epidemiological shifts, and other comorbidities through history. This paper critically discusses TB and some of its major comorbidities through history within a biocultural framework to show how transitions in human demography and culture affected the disease‐scape of TB. In doing so, I address the potential synthesis of biocultural and epidemiological transition theory to better comprehend the mutual evolution of infectious diseases and humans.

Biocultural perspectives of infectious diseases and demographic evolution: Tuberculosis and its comorbidities through history

Numerical methods are applied to modeling apertures in shielding enclosures. Subcellular FDTD algorithms for modeling thin slots in conductors have previously been developed. One algorithm that is based on a quasi-static approximation has been shown to agree well with experimental results for thin slots in planes. This FDTD thin-slot algorithm is compared with moment method results for thin slots near corners.

/pdf/a-comparison-of-an-fdtd-thin-slot-algorithm-and-method-of-ndp1uu3qp3.pdf

A comparison of an FDTD thin-slot algorithm and method of moments for modeling slots near corners

Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.

Application of higher-order FEM elements to the analysis of microstrip structures

Many of the rules-ofthumb that have helped circuit board designers to meet electromagnetic compatibility (EMC) requirements in the past are no longer effective. Today's densely populated multi-layer boards are very different from the one or two layer pin-in-hole boards that were the norm ten years ago. VLSI, high-speed logic, programmable components, and surface mount technology have significantly changed electromagnetic compatibility problems and priorities. In many cases, implementing an out-dated EMC design guideline can actually make radiation or susceptibility problems much worse.

/pdf/new-emc-design-guidelines-for-multilayer-printed-wiring-593h4dw0av.pdf

T.P. Van Doren

Papers

An impact of layer stack-up on EMI

Biocultural perspectives of infectious diseases and demographic evolution: Tuberculosis and its comorbidities through history

A comparison of an FDTD thin-slot algorithm and method of moments for modeling slots near corners

Application of higher-order FEM elements to the analysis of microstrip structures

New EMC design guidelines for multilayer printed wiring boards