Introduction to Electromagnetic Compatibility

https://espace.library.uq.edu.au/view/UQ:e38288a/UQe38288a_OA.pdf

High-performance SnSe thermoelectric materials: Progress and future challenge

Методы подавления шумов и помех в электронных системах. (Noise reduction techniques in electronic systems)

Introduction to the Finite-Difference Time-Domain (FDTD) Method for Electromagnetics provides a comprehensive tutorial of the most widely used method for solving Maxwell's equations -- the Finite Difference Time-Domain Method. This book is an essential guide for students, researchers, and professional engineers who want to gain a fundamental knowledge of the FDTD method. It can accompany an undergraduate or entry-level graduate course or be used for self-study. The book provides all the background required to either research or apply the FDTD method for the solution of Maxwell's equations to practical problems in engineering and science. Introduction to the Finite-Difference Time-Domain (FDTD) Method for Electromagnetics guides the reader through the foundational theory of the FDTD method starting with the one-dimensional transmission-line problem and then progressing to the solution of Maxwell's equations in three dimensions. It also provides step by step guides to modeling physical sources, lumped-circuit components, absorbing boundary conditions, perfectly matched layer absorbers, and sub-cell structures. Post processing methods such as network parameter extraction and far-field transformations are also detailed. Efficient implementations of the FDTD method in a high level language are also provided. Table of Contents: Introduction / 1D FDTD Modeling of the Transmission Line Equations / Yee Algorithm for Maxwell's Equations / Source Excitations / Absorbing Boundary Conditions / The Perfectly Matched Layer (PML) Absorbing Medium / Subcell Modeling / Post Processing

Introduction to the Finite-Difference Time-Domain (Fdtd) Method for Electromagnetics

Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can he used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.

/pdf/investigation-of-fundamental-emi-source-mechanisms-driving-2v86hmhn28.pdf

Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board, looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.

/pdf/expert-system-algorithms-for-identifying-radiated-emission-4om82hu81j.pdf

Expert system algorithms for identifying radiated emission problems in printed circuit boards

Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noise, as well as radiation problems. An approach for estimating the power bus noise spectrum is presented in this paper. The power bus noise caused by digital circuits injecting high-frequency noise onto the DC buses feeding digital devices is calculated The transient current drawn by an IC device is modeled using the load current and the shoot-through current through the power dissipation capacitance. Modeling and experimental results for several digital chips are shown. The modeling agrees well with the experimental results.

/pdf/estimating-dc-power-bus-noise-2ryph97trz.pdf

Estimating DC power bus noise

Coupling between circuitry on printed circuit boards can be mitigated by a variety of well-known techniques. One such technique is to isolate circuitry in different areas of the printed circuit board by strategically placing a gap in the signal return plane. However, this technique is only effective at reducing common-impedance coupling, which is generally not a significant coupling mechanism at frequencies above 1 MHz. This paper investigates the effect of a gap located between and parallel to adjacent microstrip traces. The effect of the gap on the mutual inductance and mutual capacitance is evaluated. Laboratory measurements and numerical simulations show that gaps in the return plane are ineffective at reducing inductive and capacitive crosstalk in most configurations, and in some cases they increase the mutual coupling between printed circuit board traces.

Traces in proximity to gaps in return planes

This paper describes an expert systems approach, based on symbolic reasoning techniques, to the problem of predicting radiated EMI levels from printed circuit boards. The expert system, currently under development at the University of Missouri-Rolla, USA, starts by extracting board geometry information from the board layout files. This information is fed into the classification algorithm, which determines the signal properties and nature of each net, using the knowledge stored in the knowledge base. The evaluation algorithm uses the available in formation to identify and evaluate critical circuit geometries, and then estimates the effect that these geometries have on system radiation levels. The expert system also looks for violations of basic EMC design rules. The main advantage of such a system over conventional software is that the expert system does not require the user to be an expert in EMC or circuit design.

/pdf/an-expert-system-for-predicting-radiated-emi-from-pcb-s-te51z03nxl.pdf

An expert system for predicting radiated EMI from PCB's

PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling.

/pdf/fdtd-and-fem-mom-modeling-of-emi-resulting-from-a-trace-near-57seworht6.pdf

T.P. Van Doren

Papers

Expert system algorithms for identifying radiated emission problems in printed circuit boards

Estimating DC power bus noise

Traces in proximity to gaps in return planes

An expert system for predicting radiated EMI from PCB's

FDTD and FEM/MOM modeling of EMI resulting from a trace near a PCB edge