Z
Ze Zhu
Researcher at City University of Hong Kong
Publications - 14
Citations - 182
Ze Zhu is an academic researcher from City University of Hong Kong. The author has contributed to research in topics: Soldering & Microstructure. The author has an hindex of 5, co-authored 14 publications receiving 131 citations.
Papers
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Journal ArticleDOI
Friction-stir welding of a ductile high entropy alloy: microstructural evolution and weld strength
Ze Zhu,Yufeng Sun,F.L. Ng,M.H. Goh,Peter K. Liaw,Hidetoshi Fujii,Q.B. Nguyen,Yi Xu,Chan Hung Shek,S.M.L. Nai,J. Wei +10 more
TL;DR: In this paper, the microstructural evolution during FSW was dominated by discontinuous recrystallization through grain bulging and the B/B ¯ {112} shear texture formed in the stir zone (SZ).
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Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
TL;DR: Carbon nanotubes (CNTs) with three different diameter ranges (10-20, 40-60, and 60-100) were doped into tin-silver-copper (SAC) solder, to study the performance of the composite SAC-CNT materials.
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Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing
Ze Zhu,Y.C. Chan,Fengshun Wu +2 more
TL;DR: The discrepancies of reported temperature distribution are explained and the possible reasons are analyzed and microstructure evolution of interfacial intermetallic compounds under both DC and AC stressing, as well as the effect of various frequency are discussed.
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Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods
TL;DR: In this article, the effectiveness of alloying methods with doping methods was compared in order to compare the microstructure and mechanical strength of Sn0.7Cu solders and two kinds of Ag modified solders.
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Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect
Ze Zhu,Y.C. Chan,Fengshun Wu +2 more
TL;DR: In this paper, the effect of alternating current (AC) on the microstructure and mechanical properties of a line-type solder interconnect was designed for investigation of the impact of AC on the performance of the interconnect.