Intel Ireland

About: Intel Ireland is a company organization based out in Leixlip, Ireland. It is known for research contribution in the topics: Thin film & Nanowire. The organization has 100 authors who have published 114 publications receiving 2332 citations.

SHIMMER™ – A Wireless Sensor Platform for Noninvasive Biomedical Research

Abstract: Applying new sensing technology to healthcare maybe part of a solution to the financial and demographic crisis facing global healthcare systems. Researchers applying new approaches to noninvasive patient monitoring and diagnostics are assisted by the features of Sensing Health with Intelligence, Modularity, Mobility and Experimental Reusability (SHIMMER™), a flexible sensing platform. Integrated peripherals, open software, modular expansion, specific power management hardware, and a library of applications supported with platform validation provide SHIMMER with advantages over many other medical research platforms.

Experimental evaluation of Physically Unclonable Functions in 65 nm CMOS

Abstract: We present a silicon characterization vehicle implementing six different constructions of intrinsic Physically Unclonable Functions (PUFs) The design contains four different memory-based PUFs, one of which is a novel buskeeper PUF, and two different delay-based PUFs Test chips are fabricated in 65 nm Low Power (LP) technology, using a standard cell ASIC design flow for the memory-based PUFs and a full custom flow for the delay-based ones This test vehicle enables a comprehensive experimental evaluation of individual PUF implementations as well as a comparative analysis across different PUF types for the same silicon technology PUF responses are obtained from 192 device samples and the uniqueness and reliability of the implemented PUFs are evaluated In addition, the effects of varying temperature and silicon device ageing on the PUF characteristics are extensively studied

Towards the Use of Artificial Intelligence on the Edge in Space Systems: Challenges and Opportunities

Abstract: The market for remote sensing space-based applications is fundamentally limited by up- and downlink bandwidth and onboard compute capability for space data handling systems. This article details how the compute capability on these platforms can be vastly increased by leveraging emerging commercial off-the-shelf (COTS) system-on-chip (SoC) technologies. The orders of magnitude increase in processing power can then be applied to consuming data at source rather than on the ground allowing the deployment of value-added applications in space, which consume a tiny fraction of the downlink bandwidth that would be otherwise required. The proposed solution has the potential to revolutionize Earth observation (EO) and other remote sensing applications, reducing the time and cost to deploy new added value services to space by a great extent compared with the state of the art. This article also reports the first results in radiation tolerance and power/performance of these COTS SoCs for space-based applications and maps the trajectory toward low Earth orbit trials and the complete life-cycle for space-based artificial intelligence classifiers on orbital platforms and spacecraft.

Monitoring PMMA Elimination by Reactive Ion Etching from a Lamellar PS-b-PMMA Thin Film by ex Situ TEM Methods

Abstract: Block copolymer thin films require selective elimination of one of their constituent blocks to access their potential as lithographic nanopatterns. This paper demonstrates an on-substrate TEM-based approach for establishing the removal of poly(methyl methyacrylate) from vertically oriented lamellar polystyrene-block-poly(methyl methacrylate) (PS-b-PMMA) thin films and subsequent transfer to the underlying silicon by reactive ion etching. The ex situ microscopy technique presents an insight into the removal of PMMA, the etch end point, PS faceting, etch anisotropy, and residual PS thickness.