Journal•ISSN: 0096-1779
Ire Transactions on Product Engineering and Production
Institute of Electrical and Electronics Engineers
About: Ire Transactions on Product Engineering and Production is an academic journal. The journal publishes majorly in the area(s): Electronic packaging & Electronics cooling. Over the lifetime, 19 publications have been published receiving 22 citations.
Topics: Electronic packaging, Electronics cooling, Value engineering, Shock (mechanics), Etching (microfabrication)
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TL;DR: In this paper, the thermoelectric spot cooling of temperature-limiting component parts located within local areas of an electronic equipment was investigated and nine spot coolers constructed to specifications determined by an analysis.
Abstract: Summary Recent developments in the construction of thermoelectric coolers have resulted in improved coolers suitable for use in electronic equipment. The continual effort to improve the techniques of cooling electronic equipment led to the investigation of thermoelectric spot cooling of temperature-limiting component parts located within local areas of an electronic equipment. The investigation consisted of the evaluation and application of nine spot coolers constructed to specifications determined by an analysis. Thermal evaluation of the nine spot coolers showed that each spot cooler either met or exceeded the design requirement of pumping 5 w over a 30°C temperature difference. The coefficient of performance exceeded 0.5 for each of the spot coolers operated under the design condition. In addition to the satisfactory thermal performance, a spot cooler passed the mechanical shock and vibration requirements for satellite equipments used in Project Mercury. The information on spot cooler thermal performance was employed in an analytical application of spot cooling to a free-convection and radiation-cooled equipment and a forced-convection-cooled equipment. The results indicate that free-convection - and radiationcooled equipment can be operated in higher temperature environments with spot cooling; moreover, the cooling requirements for forced-convection-cooled equipment can be reduced.
5 citations
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TL;DR: In this paper, a flexible container is proposed for electronic packages where high voltages exist, and a simple, novel, weight-saving technique for accomplishing this consists essentially of replacing the conventional container with a flexible one (for example, fabric-reinforced rubber).
Abstract: In electronic packages where high voltages exist, a high dielectric strength environment surrounding the components is necessary. Liquid-filled units have used various oils which in addition to dielectric strength provide good thermal paths for cooling; evaporative-cooled units often use refrigerants. In either case allowance, volume-wise, must be made for thermal expansion of the fluid. A simple, novel, weight-saving technique for accomplishing this consists essentially of replacing the conventional container with a flexible one (for example, fabric-reinforced rubber). The flexible container then expands and contracts accomodating volume variations in the fluid. Design details, test results, and a general evaluation illustrating the adaptability of the flexible container as a practical design tool are discussed.
5 citations
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2 citations