A Dot Component Packaging System for Electronics

TLDR: In this article, a new packaging concept for microelectronics and its application to a digital system are presented, where the new Dot components mounted in ceramic wafers are disks 0.03-in thick with a diameter as small as 0.05-in.

Abstract: Summary - A new packaging concept for microelectronics and its application to a digital system are presented. The concept utilizes the new Dot components mounted in ceramic wafers. Dot components are disks 0.03-in thick with a diameter as small as 0.05-in. Connections to components are made by multi-layer deposition techniques; and connections to wafer modules, by a novel pressure connection method. A unique and compact heat transfer scheme is described. The design example contains 2260 of the smallest Dot components in an approximately 1. 25-in cube. The component density of the package (including all thermal, interconnection, and structural provisions) is 1,960,000 per cubic foot (1130 per cubic inch). The package provides excellent temperature control for the components and is sufficiently rugged to withstand space environments. A photograph of model hardware is shown.